A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

Due to many advantages, such as cost-effective production, design freedom, and weight reduction, plastics have replaced metals and ceramics in many fields. However, engineering plastics are good thermal insulators. This characteristic, although beneficial in certain applications, poses many challeng...

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Veröffentlicht in:	IEEE access 2019, Vol.7, p.56163-56173
Hauptverfasser:	Soltani, Mahdi, Kulkarni, Romit, Scheinost, Tobias, Groezinger, Tobias, Zimmermann, Andre
Format:	Artikel
Sprache:	eng
Schlagworte:	Analytical models Arrhenius compound Cooling systems failure analysis FEA filled plastics filler Fillers Finite element analysis Finite element method Heat generation Heat transmission Injection molding Insulators LED lifetime model light emitting diode Light emitting diodes Mathematical model matrix MID Miniaturization molded interconnect device plastics Polymers process simulation Product design Product development Reduction (metal working) Reliability Reliability analysis Simulation steady-state analysis Substrates Temperature thermal analysis Thermal conductivity Thermal management Thermoplastic resins thermoplastics Weight reduction
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