Evolution of the microstructure, electrical resistivity and microhardness during atomic ordering of cryogenically deformed Cu-47at.%Pd alloy

The kinetics of the A1→B2 phase transition in the cryogenically deformed Cu-47at.%Pd alloy has been compared with that both after room-temperature deformation and after quenching from high temperature. For this aim, the evolution of the microstructure, electrical properties and microhardness of the...

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Veröffentlicht in:	Journal of alloys and compounds 2020-10, Vol.838, p.155591, Article 155591
Hauptverfasser:	Novikova, O.S., Volkova, E.G., Glukhov, A.V., Antonova, O.V., Kostina, A.E., Antonov, B.D., Volkov, A. Yu
Format:	Artikel
Sprache:	eng
Schlagworte:	Annealing Copper base alloys Cryogenic deformation Cu-Pd alloys Electrical properties Electrical resistivity Evolution High temperature Intermetallic phases Microhardness Microstructure Order-disorder transformation Palladium base alloys Phase transitions Room temperature Solid state reactions Ultrafines X-ray diffraction
Online-Zugang:	Volltext
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