Optimization of Microchannel Heat Sink with Rhombus Fractal-like Units for Electronic Chip Cooling
•A novel microchannel heat sink with rhombus fractal-like units is proposed.•An optimization approach is developed for the design of microchannel heat sink.•Experimental validation of the optimization approach is performed.•Rhombus fractal-like units may effectively reduce pumping power of heat sink...
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Veröffentlicht in: | International journal of refrigeration 2020-08, Vol.116, p.108-118 |
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creator | Zhuang, Dawei Yang, Yifei Ding, Guoliang Du, Xinyuan Hu, Zuntao |
description | •A novel microchannel heat sink with rhombus fractal-like units is proposed.•An optimization approach is developed for the design of microchannel heat sink.•Experimental validation of the optimization approach is performed.•Rhombus fractal-like units may effectively reduce pumping power of heat sink.
Microchannel heat sink is commonly used as a high-efficiency heat exchanger type in electronic microchips cooling, and the parallel microchannels arranged on the heat sink not only enhance heat transfer area but also result in large pumping power. In this paper, a novel structure of microchannel heat sink with rhombus fractal-like units is proposed for improve the overall performance, and a geometry optimization approach is developed for the design of the new microchannel heat sink. The validation of the geometry optimization approach is performed, and the results show that the predicted pumping power can describe 93% of the experimental data within the deviation limit of ± 5% and the mean deviation is 1.95%. Compared to the conventional parallel microchannel heat sink, the microchannel heat sink with rhombus fractal-like units may increase the COP by 7.9%-68.7% under the same constrains of external size, specified heat flux and maximum temperature limitation, which indicates the rhombus fractal-like units may effectively improve the efficiency of microchannel heat sinks. |
doi_str_mv | 10.1016/j.ijrefrig.2020.03.026 |
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Microchannel heat sink is commonly used as a high-efficiency heat exchanger type in electronic microchips cooling, and the parallel microchannels arranged on the heat sink not only enhance heat transfer area but also result in large pumping power. In this paper, a novel structure of microchannel heat sink with rhombus fractal-like units is proposed for improve the overall performance, and a geometry optimization approach is developed for the design of the new microchannel heat sink. The validation of the geometry optimization approach is performed, and the results show that the predicted pumping power can describe 93% of the experimental data within the deviation limit of ± 5% and the mean deviation is 1.95%. Compared to the conventional parallel microchannel heat sink, the microchannel heat sink with rhombus fractal-like units may increase the COP by 7.9%-68.7% under the same constrains of external size, specified heat flux and maximum temperature limitation, which indicates the rhombus fractal-like units may effectively improve the efficiency of microchannel heat sinks.</description><identifier>ISSN: 0140-7007</identifier><identifier>EISSN: 1879-2081</identifier><identifier>DOI: 10.1016/j.ijrefrig.2020.03.026</identifier><language>eng</language><publisher>Paris: Elsevier Ltd</publisher><subject>Chip Cooling ; Cooling ; Deviation ; Electronics ; Fractals ; Heat exchangers ; Heat flux ; Heat sink ; Heat sinks ; Heat transfer ; Microcanal ; Microchannel ; Microchannels ; Optimisation ; Optimization ; Puits de chaleur ; Pumping ; Refroidissement de puce électronique ; Rhombus fractal-like unit ; Temperature ; Unité fractale en losange</subject><ispartof>International journal of refrigeration, 2020-08, Vol.116, p.108-118</ispartof><rights>2020 Elsevier Ltd and IIR</rights><rights>Copyright Elsevier Science Ltd. Aug 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c340t-c174eab9b99df3427d39df861ca1011f844180173e1f805523028f1fe86f6513</citedby><cites>FETCH-LOGICAL-c340t-c174eab9b99df3427d39df861ca1011f844180173e1f805523028f1fe86f6513</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.ijrefrig.2020.03.026$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Zhuang, Dawei</creatorcontrib><creatorcontrib>Yang, Yifei</creatorcontrib><creatorcontrib>Ding, Guoliang</creatorcontrib><creatorcontrib>Du, Xinyuan</creatorcontrib><creatorcontrib>Hu, Zuntao</creatorcontrib><title>Optimization of Microchannel Heat Sink with Rhombus Fractal-like Units for Electronic Chip Cooling</title><title>International journal of refrigeration</title><description>•A novel microchannel heat sink with rhombus fractal-like units is proposed.•An optimization approach is developed for the design of microchannel heat sink.•Experimental validation of the optimization approach is performed.•Rhombus fractal-like units may effectively reduce pumping power of heat sink.
Microchannel heat sink is commonly used as a high-efficiency heat exchanger type in electronic microchips cooling, and the parallel microchannels arranged on the heat sink not only enhance heat transfer area but also result in large pumping power. In this paper, a novel structure of microchannel heat sink with rhombus fractal-like units is proposed for improve the overall performance, and a geometry optimization approach is developed for the design of the new microchannel heat sink. The validation of the geometry optimization approach is performed, and the results show that the predicted pumping power can describe 93% of the experimental data within the deviation limit of ± 5% and the mean deviation is 1.95%. Compared to the conventional parallel microchannel heat sink, the microchannel heat sink with rhombus fractal-like units may increase the COP by 7.9%-68.7% under the same constrains of external size, specified heat flux and maximum temperature limitation, which indicates the rhombus fractal-like units may effectively improve the efficiency of microchannel heat sinks.</description><subject>Chip Cooling</subject><subject>Cooling</subject><subject>Deviation</subject><subject>Electronics</subject><subject>Fractals</subject><subject>Heat exchangers</subject><subject>Heat flux</subject><subject>Heat sink</subject><subject>Heat sinks</subject><subject>Heat transfer</subject><subject>Microcanal</subject><subject>Microchannel</subject><subject>Microchannels</subject><subject>Optimisation</subject><subject>Optimization</subject><subject>Puits de chaleur</subject><subject>Pumping</subject><subject>Refroidissement de puce électronique</subject><subject>Rhombus fractal-like unit</subject><subject>Temperature</subject><subject>Unité fractale en losange</subject><issn>0140-7007</issn><issn>1879-2081</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEQhoMoWKt_QQKed50k293tTSn1AyoFP84hTRM7221Sk1TRX2-kevY0c5h3Zp6HkHMGJQNWX3YldsHYgK8lBw4liBJ4fUAGrG3GBYeWHZIBsAqKBqA5JicxdgCsgVE7IIv5NuEGv1RC76i39AF18HqlnDM9vTMq0Sd0a_qBaUUfV36z2EV6E5ROqi96XBv64jBFan2g097oFLxDTScr3NKJ9z2611NyZFUfzdlvHZLnm-nz5K6YzW_vJ9ezQosKUqFZUxm1GC_G46UVFW-WIjdtzbTKmMy2VcXa_LYwuYfRiAvgrWXWtLWtR0wMycV-7Tb4t52JSXZ-F1y-KHlVccEzPM9T9X4qU8aYtcltwI0Kn5KB_NEpO_mnU_7olCBk1pmDV_ugyQjvaIKMGo3TZokhY8ulx_9WfAMUz4EU</recordid><startdate>202008</startdate><enddate>202008</enddate><creator>Zhuang, Dawei</creator><creator>Yang, Yifei</creator><creator>Ding, Guoliang</creator><creator>Du, Xinyuan</creator><creator>Hu, Zuntao</creator><general>Elsevier Ltd</general><general>Elsevier Science Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope></search><sort><creationdate>202008</creationdate><title>Optimization of Microchannel Heat Sink with Rhombus Fractal-like Units for Electronic Chip Cooling</title><author>Zhuang, Dawei ; Yang, Yifei ; Ding, Guoliang ; Du, Xinyuan ; Hu, Zuntao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c340t-c174eab9b99df3427d39df861ca1011f844180173e1f805523028f1fe86f6513</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Chip Cooling</topic><topic>Cooling</topic><topic>Deviation</topic><topic>Electronics</topic><topic>Fractals</topic><topic>Heat exchangers</topic><topic>Heat flux</topic><topic>Heat sink</topic><topic>Heat sinks</topic><topic>Heat transfer</topic><topic>Microcanal</topic><topic>Microchannel</topic><topic>Microchannels</topic><topic>Optimisation</topic><topic>Optimization</topic><topic>Puits de chaleur</topic><topic>Pumping</topic><topic>Refroidissement de puce électronique</topic><topic>Rhombus fractal-like unit</topic><topic>Temperature</topic><topic>Unité fractale en losange</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhuang, Dawei</creatorcontrib><creatorcontrib>Yang, Yifei</creatorcontrib><creatorcontrib>Ding, Guoliang</creatorcontrib><creatorcontrib>Du, Xinyuan</creatorcontrib><creatorcontrib>Hu, Zuntao</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><jtitle>International journal of refrigeration</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhuang, Dawei</au><au>Yang, Yifei</au><au>Ding, Guoliang</au><au>Du, Xinyuan</au><au>Hu, Zuntao</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Optimization of Microchannel Heat Sink with Rhombus Fractal-like Units for Electronic Chip Cooling</atitle><jtitle>International journal of refrigeration</jtitle><date>2020-08</date><risdate>2020</risdate><volume>116</volume><spage>108</spage><epage>118</epage><pages>108-118</pages><issn>0140-7007</issn><eissn>1879-2081</eissn><abstract>•A novel microchannel heat sink with rhombus fractal-like units is proposed.•An optimization approach is developed for the design of microchannel heat sink.•Experimental validation of the optimization approach is performed.•Rhombus fractal-like units may effectively reduce pumping power of heat sink.
Microchannel heat sink is commonly used as a high-efficiency heat exchanger type in electronic microchips cooling, and the parallel microchannels arranged on the heat sink not only enhance heat transfer area but also result in large pumping power. In this paper, a novel structure of microchannel heat sink with rhombus fractal-like units is proposed for improve the overall performance, and a geometry optimization approach is developed for the design of the new microchannel heat sink. The validation of the geometry optimization approach is performed, and the results show that the predicted pumping power can describe 93% of the experimental data within the deviation limit of ± 5% and the mean deviation is 1.95%. Compared to the conventional parallel microchannel heat sink, the microchannel heat sink with rhombus fractal-like units may increase the COP by 7.9%-68.7% under the same constrains of external size, specified heat flux and maximum temperature limitation, which indicates the rhombus fractal-like units may effectively improve the efficiency of microchannel heat sinks.</abstract><cop>Paris</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.ijrefrig.2020.03.026</doi><tpages>11</tpages></addata></record> |
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subjects | Chip Cooling Cooling Deviation Electronics Fractals Heat exchangers Heat flux Heat sink Heat sinks Heat transfer Microcanal Microchannel Microchannels Optimisation Optimization Puits de chaleur Pumping Refroidissement de puce électronique Rhombus fractal-like unit Temperature Unité fractale en losange |
title | Optimization of Microchannel Heat Sink with Rhombus Fractal-like Units for Electronic Chip Cooling |
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