Effect of copper foam thickness on pool boiling heat transfer of HFE-7100
•Pool boiling using HFE-7100 and copper foams at three thicknesses were tested;•An optimum thickness to enhance the boiling heat transfer was found;•Vapor bubbles get trapped in the foam cell with higher thickness;•The lowest foam reduces the entrapped vapor into it and improves the wickability;•The...
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creator | Manetti, Leonardo Lachi Moita, Ana Sofia Oliveira Henriques de Souza, Reinaldo Rodrigues Cardoso, Elaine Maria |
description | •Pool boiling using HFE-7100 and copper foams at three thicknesses were tested;•An optimum thickness to enhance the boiling heat transfer was found;•Vapor bubbles get trapped in the foam cell with higher thickness;•The lowest foam reduces the entrapped vapor into it and improves the wickability;•The foam thickness effects on pool boiling are summarized.
Pool boiling is a low-cost technique for cooling electronic devices; HFE-7100 is a dielectric fluid with advantageous properties for such application but its high wettability can cause temperature overshoot in the system. Hence, the use of porous heating surfaces improves the heat transfer performance, eliminating the temperature overshoot due to their interconnected porous, which increase the wetted area and active nucleation site density. This work addressed pool boiling tests by using HFE-7100 and copper foams with three different thicknesses: 3 mm, 2 mm, and 1 mm in order to study the vapor bubble dynamics into the foam cell and find out an optimum thickness to enhance the boiling heat transfer. The results show that high thickness, 2 mm and 3 mm, has the best performance at low heat fluxes while the lowest thickness has the best performance at high heat fluxes. At heat fluxes lower than 50 kW/m², the higher surface wetted area increases the natural convection zone even though the latent heat also plays an important role. At higher heat fluxes, mainly after 200 kW/m², the vapor bubbles are trapped at the foam structure leading to an unstable boiling pattern and prevent the liquid from rewetting the surface. Therefore, the lowest foam thickness reduces the vapor trapping into the cell; additionally, the capillary-wicking ability increases and it also improves the HTC and the dryout heat flux due to the prevention of hotspots within the foam surface.
Effect of open-cell metal foam thickness on pool boiling of HFE-7100 [Display omitted] . |
doi_str_mv | 10.1016/j.ijheatmasstransfer.2020.119547 |
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Pool boiling is a low-cost technique for cooling electronic devices; HFE-7100 is a dielectric fluid with advantageous properties for such application but its high wettability can cause temperature overshoot in the system. Hence, the use of porous heating surfaces improves the heat transfer performance, eliminating the temperature overshoot due to their interconnected porous, which increase the wetted area and active nucleation site density. This work addressed pool boiling tests by using HFE-7100 and copper foams with three different thicknesses: 3 mm, 2 mm, and 1 mm in order to study the vapor bubble dynamics into the foam cell and find out an optimum thickness to enhance the boiling heat transfer. The results show that high thickness, 2 mm and 3 mm, has the best performance at low heat fluxes while the lowest thickness has the best performance at high heat fluxes. At heat fluxes lower than 50 kW/m², the higher surface wetted area increases the natural convection zone even though the latent heat also plays an important role. At higher heat fluxes, mainly after 200 kW/m², the vapor bubbles are trapped at the foam structure leading to an unstable boiling pattern and prevent the liquid from rewetting the surface. Therefore, the lowest foam thickness reduces the vapor trapping into the cell; additionally, the capillary-wicking ability increases and it also improves the HTC and the dryout heat flux due to the prevention of hotspots within the foam surface.
Effect of open-cell metal foam thickness on pool boiling of HFE-7100 [Display omitted] .</description><identifier>ISSN: 0017-9310</identifier><identifier>EISSN: 1879-2189</identifier><identifier>DOI: 10.1016/j.ijheatmasstransfer.2020.119547</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Boiling ; Copper ; Copper foam ; Dielectric properties ; Electronic devices ; Free convection ; Heat flux ; Heat transfer ; HFE-7100 ; Latent heat ; Metal foams ; Nucleation ; Pool boiling ; Porous surface ; Thickness ; Vapors ; Wettability</subject><ispartof>International journal of heat and mass transfer, 2020-05, Vol.152, p.119547, Article 119547</ispartof><rights>2020</rights><rights>Copyright Elsevier BV May 2020</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c494t-a7c1aed58bc27a2f280daa4ec767fbdf05139054875830f7a3c49f0785554a473</citedby><cites>FETCH-LOGICAL-c494t-a7c1aed58bc27a2f280daa4ec767fbdf05139054875830f7a3c49f0785554a473</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.ijheatmasstransfer.2020.119547$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Manetti, Leonardo Lachi</creatorcontrib><creatorcontrib>Moita, Ana Sofia Oliveira Henriques</creatorcontrib><creatorcontrib>de Souza, Reinaldo Rodrigues</creatorcontrib><creatorcontrib>Cardoso, Elaine Maria</creatorcontrib><title>Effect of copper foam thickness on pool boiling heat transfer of HFE-7100</title><title>International journal of heat and mass transfer</title><description>•Pool boiling using HFE-7100 and copper foams at three thicknesses were tested;•An optimum thickness to enhance the boiling heat transfer was found;•Vapor bubbles get trapped in the foam cell with higher thickness;•The lowest foam reduces the entrapped vapor into it and improves the wickability;•The foam thickness effects on pool boiling are summarized.
Pool boiling is a low-cost technique for cooling electronic devices; HFE-7100 is a dielectric fluid with advantageous properties for such application but its high wettability can cause temperature overshoot in the system. Hence, the use of porous heating surfaces improves the heat transfer performance, eliminating the temperature overshoot due to their interconnected porous, which increase the wetted area and active nucleation site density. This work addressed pool boiling tests by using HFE-7100 and copper foams with three different thicknesses: 3 mm, 2 mm, and 1 mm in order to study the vapor bubble dynamics into the foam cell and find out an optimum thickness to enhance the boiling heat transfer. The results show that high thickness, 2 mm and 3 mm, has the best performance at low heat fluxes while the lowest thickness has the best performance at high heat fluxes. At heat fluxes lower than 50 kW/m², the higher surface wetted area increases the natural convection zone even though the latent heat also plays an important role. At higher heat fluxes, mainly after 200 kW/m², the vapor bubbles are trapped at the foam structure leading to an unstable boiling pattern and prevent the liquid from rewetting the surface. Therefore, the lowest foam thickness reduces the vapor trapping into the cell; additionally, the capillary-wicking ability increases and it also improves the HTC and the dryout heat flux due to the prevention of hotspots within the foam surface.
Effect of open-cell metal foam thickness on pool boiling of HFE-7100 [Display omitted] .</description><subject>Boiling</subject><subject>Copper</subject><subject>Copper foam</subject><subject>Dielectric properties</subject><subject>Electronic devices</subject><subject>Free convection</subject><subject>Heat flux</subject><subject>Heat transfer</subject><subject>HFE-7100</subject><subject>Latent heat</subject><subject>Metal foams</subject><subject>Nucleation</subject><subject>Pool boiling</subject><subject>Porous surface</subject><subject>Thickness</subject><subject>Vapors</subject><subject>Wettability</subject><issn>0017-9310</issn><issn>1879-2189</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNqNkMFOAyEURYnRxFr9BxI3bqY-GCjMTtNUW9PEja4JZcAytsMIUxP_XiajKzeuXl4e99xwELohMCNA5rfNzDc7q_uDTqmPuk3OxhkFms-k4kycoAmRoiookdUpmgAQUVQlgXN0kVIzrMDmE7ReOmdNj4PDJnSdjdgFfcD9zpv31qaEQ4u7EPZ4G_zet2946MS_hUNs9bAsBAG4RGdO75O9-plT9PqwfFmsis3z43pxvykMq1hfaGGItjWXW0OFpo5KqLVm1oi5cNvaASdlBZxJwWUJTugy5xwIyTlnmolyiq5HbhfDx9GmXjXhGNtcqShjhGdOTk7R3fjKxJBStE510R90_FIE1CBQNeqvQDUIVKPAjHgaETb_5tPnazLetsbWPmZlqg7-_7Bv9aOENg</recordid><startdate>202005</startdate><enddate>202005</enddate><creator>Manetti, Leonardo Lachi</creator><creator>Moita, Ana Sofia Oliveira Henriques</creator><creator>de Souza, Reinaldo Rodrigues</creator><creator>Cardoso, Elaine Maria</creator><general>Elsevier Ltd</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>H8D</scope><scope>KR7</scope><scope>L7M</scope></search><sort><creationdate>202005</creationdate><title>Effect of copper foam thickness on pool boiling heat transfer of HFE-7100</title><author>Manetti, Leonardo Lachi ; Moita, Ana Sofia Oliveira Henriques ; de Souza, Reinaldo Rodrigues ; Cardoso, Elaine Maria</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c494t-a7c1aed58bc27a2f280daa4ec767fbdf05139054875830f7a3c49f0785554a473</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Boiling</topic><topic>Copper</topic><topic>Copper foam</topic><topic>Dielectric properties</topic><topic>Electronic devices</topic><topic>Free convection</topic><topic>Heat flux</topic><topic>Heat transfer</topic><topic>HFE-7100</topic><topic>Latent heat</topic><topic>Metal foams</topic><topic>Nucleation</topic><topic>Pool boiling</topic><topic>Porous surface</topic><topic>Thickness</topic><topic>Vapors</topic><topic>Wettability</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Manetti, Leonardo Lachi</creatorcontrib><creatorcontrib>Moita, Ana Sofia Oliveira Henriques</creatorcontrib><creatorcontrib>de Souza, Reinaldo Rodrigues</creatorcontrib><creatorcontrib>Cardoso, Elaine Maria</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>International journal of heat and mass transfer</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Manetti, Leonardo Lachi</au><au>Moita, Ana Sofia Oliveira Henriques</au><au>de Souza, Reinaldo Rodrigues</au><au>Cardoso, Elaine Maria</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of copper foam thickness on pool boiling heat transfer of HFE-7100</atitle><jtitle>International journal of heat and mass transfer</jtitle><date>2020-05</date><risdate>2020</risdate><volume>152</volume><spage>119547</spage><pages>119547-</pages><artnum>119547</artnum><issn>0017-9310</issn><eissn>1879-2189</eissn><abstract>•Pool boiling using HFE-7100 and copper foams at three thicknesses were tested;•An optimum thickness to enhance the boiling heat transfer was found;•Vapor bubbles get trapped in the foam cell with higher thickness;•The lowest foam reduces the entrapped vapor into it and improves the wickability;•The foam thickness effects on pool boiling are summarized.
Pool boiling is a low-cost technique for cooling electronic devices; HFE-7100 is a dielectric fluid with advantageous properties for such application but its high wettability can cause temperature overshoot in the system. Hence, the use of porous heating surfaces improves the heat transfer performance, eliminating the temperature overshoot due to their interconnected porous, which increase the wetted area and active nucleation site density. This work addressed pool boiling tests by using HFE-7100 and copper foams with three different thicknesses: 3 mm, 2 mm, and 1 mm in order to study the vapor bubble dynamics into the foam cell and find out an optimum thickness to enhance the boiling heat transfer. The results show that high thickness, 2 mm and 3 mm, has the best performance at low heat fluxes while the lowest thickness has the best performance at high heat fluxes. At heat fluxes lower than 50 kW/m², the higher surface wetted area increases the natural convection zone even though the latent heat also plays an important role. At higher heat fluxes, mainly after 200 kW/m², the vapor bubbles are trapped at the foam structure leading to an unstable boiling pattern and prevent the liquid from rewetting the surface. Therefore, the lowest foam thickness reduces the vapor trapping into the cell; additionally, the capillary-wicking ability increases and it also improves the HTC and the dryout heat flux due to the prevention of hotspots within the foam surface.
Effect of open-cell metal foam thickness on pool boiling of HFE-7100 [Display omitted] .</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.ijheatmasstransfer.2020.119547</doi><oa>free_for_read</oa></addata></record> |
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subjects | Boiling Copper Copper foam Dielectric properties Electronic devices Free convection Heat flux Heat transfer HFE-7100 Latent heat Metal foams Nucleation Pool boiling Porous surface Thickness Vapors Wettability |
title | Effect of copper foam thickness on pool boiling heat transfer of HFE-7100 |
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