Effects of minor alloying with Ge and In on the interfacial microstructure between Zn–Sn solder alloy and Cu substrate

The interfacial reactions of Zn30Sn (ZS), Zn30Sn-1Ge (ZS-1Ge), and Zn30Sn–1In (ZS-1In) on the Cu substrate were investigated. After reflowing at 450 °C for 5 min, the ε-CuZn5 (scallop-type), γ-Cu5Zn8 (flat-type), and β’-CuZn (flat-type) intermetallic compounds (IMCs) formed at the interface between...

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Veröffentlicht in:	Journal of alloys and compounds 2020-08, Vol.831, p.154812, Article 154812
Hauptverfasser:	Wei, Yuhang, Liu, Yingxia, Zhao, Xiuchen, Tan, Chengwen, Dong, Yaru, Zhang, Ji
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloying effects Chemical precipitation Copper Diffusion layers Diffusion rate Diffusivity First principles Germanium High-temperature solder Interface reactions Intermetallic compounds Phase transformation Phase transitions Solders Solid phases Substrates Tin
Online-Zugang:	Volltext
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