Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water

This article presents the electrical circuit model of signal-ground through-silicon vias (TSVs) in a silicon microfluidic pin-fin heat sink in which the pin-fins are surrounded by deionized water. Such TSVs are asymmetric vertically because the TSVs are partially embedded in cylindrical pin-fins as...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2020-08, Vol.10 (8), p.1337-1347
Hauptverfasser:	Oh, Hanju, Swaminathan, Madhavan, May, Gary S., Bakir, Muhannad S.
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integrated circuit (3-D IC) Asymmetry Capacitance Circuit design Circuits Computer simulation Conductivity Deionization deionized water Diameters electrical circuit model Electromagnetic fields Heat sinks Impact analysis Integrated circuit modeling Integrated circuits Interconnections liquid cooling Microfluidics Modelling Pin fins pin-fin heat sink signal propagation Silicon Silicon dioxide Substrates through-silicon via (TSV) Through-silicon vias
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!