Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Ag-decorated multi-walled carbon nanotubes (Ag-MWCNT) were investigated for use in Sn58Bi solder joints for FCLED packages. Among lead-free solders, Sn58Bi solder has been identified as a candidate for widespread use because of its low melting temperature and high tensile strength. However, Sn58Bi s...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2020-07, Vol.31 (13), p.10170-10176
Hauptverfasser:	Lee, Choong-Jae, Myung, Woo-Ram, Park, Bum-Geun, Jung, Seung-Boo
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonded joints Bonding strength Carbon Characterization and Evaluation of Materials Chemistry and Materials Science Circuits Composite materials Ductility Electronics industry Intermetallic compounds Lasers Lead free Materials Science Mechanical properties Melt temperature Multi wall carbon nanotubes Optical and Electronic Materials Semiconductors Shear strength Shear tests Soldered joints Solders Tensile strength Thermal resistance Thermodynamic properties Tin base alloys
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