Deep reactive ion etching of silicon using non-ICP-based equipment

Deep reactive ion etching (DRIE) technology is one of the most important technologies in the processing of microelectronic devices and microelectromechanical system. As a necessary process in semiconductor integration, it has been widely studied in the past decades. It is known that the traditional...

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Veröffentlicht in:	Applied physics. A, Materials science & processing Materials science & processing, 2020-07, Vol.126 (7), Article 540
Hauptverfasser:	Du, Zaifa, Nie, Junyang, Li, Dianlun, Guo, Weiling, Yan, Qun, Wang, Le, Guo, Tailiang, Sun, Jie
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied physics Characterization and Evaluation of Materials Condensed Matter Physics Cryogenic properties Cryogenic temperature Equipment costs High aspect ratio Inductively coupled plasma Machines Manufacturing Materials science Microelectromechanical systems Nanotechnology Optical and Electronic Materials Optimization Parallel plates Physics Physics and Astronomy Plasma etching Processes Reactive ion etching Silicon Surfaces and Interfaces Temperature control Thin Films
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