Characteristics of Ag thin films sputter deposited using Ar or Kr gas under different pressure

Recently, we found that Ag thin films with low electrical resistivity could be produced by DC sputtering using Kr gas, whose atomic mass is closer to that of Ag than Ar gas is. In contrast, sputtering using Ar caused trapping of Ar atoms in the film, leading to higher resistivity. In addition, the f...

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Veröffentlicht in:Surface & coatings technology 2020-04, Vol.388, p.125616-4, Article 125616
Hauptverfasser: Sagara, Ryosuke, Kawamura, Midori, Kiba, Takayuki, Abe, Yoshio, Kim, Kyung Ho
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Kawamura, Midori
Kiba, Takayuki
Abe, Yoshio
Kim, Kyung Ho
description Recently, we found that Ag thin films with low electrical resistivity could be produced by DC sputtering using Kr gas, whose atomic mass is closer to that of Ag than Ar gas is. In contrast, sputtering using Ar caused trapping of Ar atoms in the film, leading to higher resistivity. In addition, the films sputtered using Kr gas had a much larger crystallite size than those sputtered using Ar gas. In the present study, we clarified the relation between the resistivity and crystallite size by data fitting using an equation proposed in the literature. Ag thin films with a thickness of 150 nm were deposited on glass substrates via DC magnetron sputtering in Ar or Kr gas at a pressure of 2 mTorr. The sputtering voltage was varied from 300 to 1000 V. By fitting the experimental data, we found that the model curves reproduced the experimental results for films sputtered in either Ar or Kr gas, and the electron reflection coefficient at the grain boundaries was the same for both types of film. Thus, the resistivity depends on the crystallite size, and the electron scattering behavior is basically the same for both films. Therefore, it is considered that the main reason for the lower resistivity of the film produced by sputtering in Kr is enhanced grain growth due to suppression of energetic neutral Kr bombardment of the film surface. Although it is known that the Ar gas pressure affects the characteristics of thin films, the effects of pressure have not been well investigated for Kr gas. In the present study, we examined the effect of the Kr gas pressure on the resistivity and crystallite size for sputtered Ag films. The results indicated that there was no significant effect. •Ag thin films were prepared by DC magnetron sputtering system in Ar and Kr gases.•The sputtering Kr gas pressure was changed and their characteristics were compared.•The resistivity change was investigated with equation proposed by Mayadas and Shatzkes.•Kr gas pressure did not affect on the characteristics of Ag thin film.•In this study, the crystallite size of all films dominated the resistivity change.•Electron reflection coefficients at the grain boundaries in films were estimated.
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In contrast, sputtering using Ar caused trapping of Ar atoms in the film, leading to higher resistivity. In addition, the films sputtered using Kr gas had a much larger crystallite size than those sputtered using Ar gas. In the present study, we clarified the relation between the resistivity and crystallite size by data fitting using an equation proposed in the literature. Ag thin films with a thickness of 150 nm were deposited on glass substrates via DC magnetron sputtering in Ar or Kr gas at a pressure of 2 mTorr. The sputtering voltage was varied from 300 to 1000 V. By fitting the experimental data, we found that the model curves reproduced the experimental results for films sputtered in either Ar or Kr gas, and the electron reflection coefficient at the grain boundaries was the same for both types of film. Thus, the resistivity depends on the crystallite size, and the electron scattering behavior is basically the same for both films. Therefore, it is considered that the main reason for the lower resistivity of the film produced by sputtering in Kr is enhanced grain growth due to suppression of energetic neutral Kr bombardment of the film surface. Although it is known that the Ar gas pressure affects the characteristics of thin films, the effects of pressure have not been well investigated for Kr gas. In the present study, we examined the effect of the Kr gas pressure on the resistivity and crystallite size for sputtered Ag films. The results indicated that there was no significant effect. •Ag thin films were prepared by DC magnetron sputtering system in Ar and Kr gases.•The sputtering Kr gas pressure was changed and their characteristics were compared.•The resistivity change was investigated with equation proposed by Mayadas and Shatzkes.•Kr gas pressure did not affect on the characteristics of Ag thin film.•In this study, the crystallite size of all films dominated the resistivity change.•Electron reflection coefficients at the grain boundaries in films were estimated.</description><identifier>ISSN: 0257-8972</identifier><identifier>EISSN: 1879-3347</identifier><identifier>DOI: 10.1016/j.surfcoat.2020.125616</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Ag thin film ; Atomic properties ; Bombardment ; Crystallites ; Electrical resistivity ; Electron reflection coefficient ; Gas pressure ; Glass substrates ; Grain boundaries ; Grain growth ; Magnetron sputtering ; Pressure effects ; Reflectance ; Resistivity ; Sputtering ; Thermal energy ; Thickness ; Thin films</subject><ispartof>Surface &amp; coatings technology, 2020-04, Vol.388, p.125616-4, Article 125616</ispartof><rights>2020 Elsevier B.V.</rights><rights>Copyright Elsevier BV Apr 25, 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c406t-702313a77e835867f091a2591a43d8544afd1645a5821b15c4d1f2806127b0a33</citedby><cites>FETCH-LOGICAL-c406t-702313a77e835867f091a2591a43d8544afd1645a5821b15c4d1f2806127b0a33</cites><orcidid>0000-0001-6543-2558</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.surfcoat.2020.125616$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Sagara, Ryosuke</creatorcontrib><creatorcontrib>Kawamura, Midori</creatorcontrib><creatorcontrib>Kiba, Takayuki</creatorcontrib><creatorcontrib>Abe, Yoshio</creatorcontrib><creatorcontrib>Kim, Kyung Ho</creatorcontrib><title>Characteristics of Ag thin films sputter deposited using Ar or Kr gas under different pressure</title><title>Surface &amp; coatings technology</title><description>Recently, we found that Ag thin films with low electrical resistivity could be produced by DC sputtering using Kr gas, whose atomic mass is closer to that of Ag than Ar gas is. In contrast, sputtering using Ar caused trapping of Ar atoms in the film, leading to higher resistivity. In addition, the films sputtered using Kr gas had a much larger crystallite size than those sputtered using Ar gas. In the present study, we clarified the relation between the resistivity and crystallite size by data fitting using an equation proposed in the literature. Ag thin films with a thickness of 150 nm were deposited on glass substrates via DC magnetron sputtering in Ar or Kr gas at a pressure of 2 mTorr. The sputtering voltage was varied from 300 to 1000 V. By fitting the experimental data, we found that the model curves reproduced the experimental results for films sputtered in either Ar or Kr gas, and the electron reflection coefficient at the grain boundaries was the same for both types of film. Thus, the resistivity depends on the crystallite size, and the electron scattering behavior is basically the same for both films. Therefore, it is considered that the main reason for the lower resistivity of the film produced by sputtering in Kr is enhanced grain growth due to suppression of energetic neutral Kr bombardment of the film surface. Although it is known that the Ar gas pressure affects the characteristics of thin films, the effects of pressure have not been well investigated for Kr gas. In the present study, we examined the effect of the Kr gas pressure on the resistivity and crystallite size for sputtered Ag films. The results indicated that there was no significant effect. •Ag thin films were prepared by DC magnetron sputtering system in Ar and Kr gases.•The sputtering Kr gas pressure was changed and their characteristics were compared.•The resistivity change was investigated with equation proposed by Mayadas and Shatzkes.•Kr gas pressure did not affect on the characteristics of Ag thin film.•In this study, the crystallite size of all films dominated the resistivity change.•Electron reflection coefficients at the grain boundaries in films were estimated.</description><subject>Ag thin film</subject><subject>Atomic properties</subject><subject>Bombardment</subject><subject>Crystallites</subject><subject>Electrical resistivity</subject><subject>Electron reflection coefficient</subject><subject>Gas pressure</subject><subject>Glass substrates</subject><subject>Grain boundaries</subject><subject>Grain growth</subject><subject>Magnetron sputtering</subject><subject>Pressure effects</subject><subject>Reflectance</subject><subject>Resistivity</subject><subject>Sputtering</subject><subject>Thermal energy</subject><subject>Thickness</subject><subject>Thin films</subject><issn>0257-8972</issn><issn>1879-3347</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNqFkMtKAzEUhoMoWKuvIAHXU3PPzM5SvGHBjW4NaSZpM7STMckIvr0po2s358A5_38uHwDXGC0wwuK2W6QxOhN0XhBESpFwgcUJmOFaNhWlTJ6CGSJcVnUjyTm4SKlDCGHZsBn4WO101Cbb6FP2JsHg4HIL88730Pn9IcE0jLm0YWuHkHy2LRyT77dwGWGI8CXCrU5w7NujxDtno-0zHKJN5Sp7Cc6c3id79Zvn4P3h_m31VK1fH59Xy3VlGBK5kohQTLWUtqa8FtKhBmvCS2C0rTlj2rVYMK55TfAGc8Na7EiNBCZygzSlc3AzzR1i-BxtyqoLY-zLSkUYpg1rRCOKSkwqE0NK0To1RH_Q8VthpI4sVaf-WKojSzWxLMa7yWjLD1_eRpWMt72xrY_WZNUG_9-IH0_cf7M</recordid><startdate>20200425</startdate><enddate>20200425</enddate><creator>Sagara, Ryosuke</creator><creator>Kawamura, Midori</creator><creator>Kiba, Takayuki</creator><creator>Abe, Yoshio</creator><creator>Kim, Kyung Ho</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0001-6543-2558</orcidid></search><sort><creationdate>20200425</creationdate><title>Characteristics of Ag thin films sputter deposited using Ar or Kr gas under different pressure</title><author>Sagara, Ryosuke ; Kawamura, Midori ; Kiba, Takayuki ; Abe, Yoshio ; Kim, Kyung Ho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c406t-702313a77e835867f091a2591a43d8544afd1645a5821b15c4d1f2806127b0a33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Ag thin film</topic><topic>Atomic properties</topic><topic>Bombardment</topic><topic>Crystallites</topic><topic>Electrical resistivity</topic><topic>Electron reflection coefficient</topic><topic>Gas pressure</topic><topic>Glass substrates</topic><topic>Grain boundaries</topic><topic>Grain growth</topic><topic>Magnetron sputtering</topic><topic>Pressure effects</topic><topic>Reflectance</topic><topic>Resistivity</topic><topic>Sputtering</topic><topic>Thermal energy</topic><topic>Thickness</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sagara, Ryosuke</creatorcontrib><creatorcontrib>Kawamura, Midori</creatorcontrib><creatorcontrib>Kiba, Takayuki</creatorcontrib><creatorcontrib>Abe, Yoshio</creatorcontrib><creatorcontrib>Kim, Kyung Ho</creatorcontrib><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Surface &amp; coatings technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sagara, Ryosuke</au><au>Kawamura, Midori</au><au>Kiba, Takayuki</au><au>Abe, Yoshio</au><au>Kim, Kyung Ho</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Characteristics of Ag thin films sputter deposited using Ar or Kr gas under different pressure</atitle><jtitle>Surface &amp; coatings technology</jtitle><date>2020-04-25</date><risdate>2020</risdate><volume>388</volume><spage>125616</spage><epage>4</epage><pages>125616-4</pages><artnum>125616</artnum><issn>0257-8972</issn><eissn>1879-3347</eissn><abstract>Recently, we found that Ag thin films with low electrical resistivity could be produced by DC sputtering using Kr gas, whose atomic mass is closer to that of Ag than Ar gas is. In contrast, sputtering using Ar caused trapping of Ar atoms in the film, leading to higher resistivity. In addition, the films sputtered using Kr gas had a much larger crystallite size than those sputtered using Ar gas. In the present study, we clarified the relation between the resistivity and crystallite size by data fitting using an equation proposed in the literature. Ag thin films with a thickness of 150 nm were deposited on glass substrates via DC magnetron sputtering in Ar or Kr gas at a pressure of 2 mTorr. The sputtering voltage was varied from 300 to 1000 V. By fitting the experimental data, we found that the model curves reproduced the experimental results for films sputtered in either Ar or Kr gas, and the electron reflection coefficient at the grain boundaries was the same for both types of film. Thus, the resistivity depends on the crystallite size, and the electron scattering behavior is basically the same for both films. Therefore, it is considered that the main reason for the lower resistivity of the film produced by sputtering in Kr is enhanced grain growth due to suppression of energetic neutral Kr bombardment of the film surface. Although it is known that the Ar gas pressure affects the characteristics of thin films, the effects of pressure have not been well investigated for Kr gas. In the present study, we examined the effect of the Kr gas pressure on the resistivity and crystallite size for sputtered Ag films. The results indicated that there was no significant effect. •Ag thin films were prepared by DC magnetron sputtering system in Ar and Kr gases.•The sputtering Kr gas pressure was changed and their characteristics were compared.•The resistivity change was investigated with equation proposed by Mayadas and Shatzkes.•Kr gas pressure did not affect on the characteristics of Ag thin film.•In this study, the crystallite size of all films dominated the resistivity change.•Electron reflection coefficients at the grain boundaries in films were estimated.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.surfcoat.2020.125616</doi><tpages>4</tpages><orcidid>https://orcid.org/0000-0001-6543-2558</orcidid></addata></record>
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subjects Ag thin film
Atomic properties
Bombardment
Crystallites
Electrical resistivity
Electron reflection coefficient
Gas pressure
Glass substrates
Grain boundaries
Grain growth
Magnetron sputtering
Pressure effects
Reflectance
Resistivity
Sputtering
Thermal energy
Thickness
Thin films
title Characteristics of Ag thin films sputter deposited using Ar or Kr gas under different pressure
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