Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Pressureless and low-temperature sintering of Ag paste has been mentioned as a promising strategy to solve the poor performance of large-area chips. In this paper, we develop a two-step surface activation process to achieve rapid pressureless and low-temperature bonding of Cu in air using a micron-s...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2020-04, Vol.31 (8), p.6497-6505
Hauptverfasser:	Fang, Hui, Wang, Chenxi, Zhou, Shicheng, Kang, Qiushi, Wang, Te, Yang, Dongsheng, Tian, Yanhong, Suga, Tadatomo
Format:	Artikel
Sprache:	eng
Schlagworte:	Activated sintering Activation Bonded joints Bonding strength Characterization and Evaluation of Materials Chemistry and Materials Science Copper Electronic packaging Heat conductivity Heat transfer Interfacial properties Lead Low temperature Materials Science Optical and Electronic Materials Oxygen plasma Shear strength Silver Sinterability Sintering Solders Surface activation Thermal conductivity Tin
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