Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials
The practical application of Bi 2 Te 3 thermoelectric (TE) materials is constrained by their high orientation structure and limited service temperature range. In this work, non-textured Bi 0.5 Sb 1.5 Te 3 (BST) TE materials were fabricated via a facile, low-cost, and commercially applicable method:...
Gespeichert in:
| Veröffentlicht in: | Journal of electronic materials 2020-05, Vol.49 (5), p.2962-2967 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 2967 |
|---|---|
| container_issue | 5 |
| container_start_page | 2962 |
| container_title | Journal of electronic materials |
| container_volume | 49 |
| creator | Zhu, Wanting Hu, Wenhua Wei, Ping Nie, Xiaolei Zhao, Wenyu |
| description | The practical application of Bi
2
Te
3
thermoelectric (TE) materials is constrained by their high orientation structure and limited service temperature range. In this work, non-textured Bi
0.5
Sb
1.5
Te
3
(BST) TE materials were fabricated via a facile, low-cost, and commercially applicable method: cold-pressing combined with annealing. Cu impurity was added into a BST matrix to regulate the carrier concentration and expand the service temperature range. The effects of Cu impurity on the phase composition, microstructure, and TE properties of
x
Cu/BST (
x
= 0.000%, 0.025%, 0.050%, 0.075%, 0.100%, 0.200% in weight) composite TE materials were investigated. An excellent ZT
ave
value of 0.85 was achieved across the entire temperature range due to synergistic optimization of the electronic and thermal transport properties, which was larger than that of the BST matrix of 0.52 and comparable to that of BST materials prepared by costly and low-yield methods. |
| doi_str_mv | 10.1007/s11664-020-08011-2 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2385583200</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2385583200</sourcerecordid><originalsourceid>FETCH-LOGICAL-c319t-d0b17867e3c80c8910e24ec8cbd287a27d1966738ca11b2045b5288919f293fe3</originalsourceid><addsrcrecordid>eNp9kE1Lw0AURQdRsFb_gKsB12nfm8kkk6WG-gEVC1YQN2EyebEpbSbOpAv_vdEI7lzdzbn3wmHsEmGGAOk8ICZJHIGACDQgRuKITVDFMkKdvB6zCcgEIyWkOmVnIWwBUKHGCXtbeeqMN33jWm7aii_ajWktVXy9Ib93tCPb-8bylXcd-b6hwF3N88P8poGZei5xptYkee72nQtNT_zR9OQbswvn7KQegi5-c8pebhfr_D5aPt095NfLyErM-qiCElOdpCStBqszBBIxWW3LSujUiLTCLElSqa1BLAXEqlRCD1xWi0zWJKfsatztvPs4UOiLrTv4drgshNRKaSkABkqMlPUuBE910flmb_xngVB8OyxGh8XgsPhxOLSnTI6lMMDtO_m_6X9aX3WVcm8</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2385583200</pqid></control><display><type>article</type><title>Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials</title><source>Springer Nature - Complete Springer Journals</source><creator>Zhu, Wanting ; Hu, Wenhua ; Wei, Ping ; Nie, Xiaolei ; Zhao, Wenyu</creator><creatorcontrib>Zhu, Wanting ; Hu, Wenhua ; Wei, Ping ; Nie, Xiaolei ; Zhao, Wenyu</creatorcontrib><description>The practical application of Bi
2
Te
3
thermoelectric (TE) materials is constrained by their high orientation structure and limited service temperature range. In this work, non-textured Bi
0.5
Sb
1.5
Te
3
(BST) TE materials were fabricated via a facile, low-cost, and commercially applicable method: cold-pressing combined with annealing. Cu impurity was added into a BST matrix to regulate the carrier concentration and expand the service temperature range. The effects of Cu impurity on the phase composition, microstructure, and TE properties of
x
Cu/BST (
x
= 0.000%, 0.025%, 0.050%, 0.075%, 0.100%, 0.200% in weight) composite TE materials were investigated. An excellent ZT
ave
value of 0.85 was achieved across the entire temperature range due to synergistic optimization of the electronic and thermal transport properties, which was larger than that of the BST matrix of 0.52 and comparable to that of BST materials prepared by costly and low-yield methods.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-020-08011-2</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Bismuth tellurides ; Carrier density ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Cold pressing ; Composite materials ; Electronics and Microelectronics ; Impurities ; Instrumentation ; International Conference on Thermoelectrics 2019 ; Materials Science ; Optical and Electronic Materials ; Optimization ; Phase composition ; Solid State Physics ; Thermoelectric materials ; Topical Collection: International Conference on Thermoelectrics 2019 ; Transport properties</subject><ispartof>Journal of electronic materials, 2020-05, Vol.49 (5), p.2962-2967</ispartof><rights>The Minerals, Metals & Materials Society 2020</rights><rights>The Minerals, Metals & Materials Society 2020.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-d0b17867e3c80c8910e24ec8cbd287a27d1966738ca11b2045b5288919f293fe3</citedby><cites>FETCH-LOGICAL-c319t-d0b17867e3c80c8910e24ec8cbd287a27d1966738ca11b2045b5288919f293fe3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-020-08011-2$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-020-08011-2$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27903,27904,41467,42536,51297</link.rule.ids></links><search><creatorcontrib>Zhu, Wanting</creatorcontrib><creatorcontrib>Hu, Wenhua</creatorcontrib><creatorcontrib>Wei, Ping</creatorcontrib><creatorcontrib>Nie, Xiaolei</creatorcontrib><creatorcontrib>Zhao, Wenyu</creatorcontrib><title>Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The practical application of Bi
2
Te
3
thermoelectric (TE) materials is constrained by their high orientation structure and limited service temperature range. In this work, non-textured Bi
0.5
Sb
1.5
Te
3
(BST) TE materials were fabricated via a facile, low-cost, and commercially applicable method: cold-pressing combined with annealing. Cu impurity was added into a BST matrix to regulate the carrier concentration and expand the service temperature range. The effects of Cu impurity on the phase composition, microstructure, and TE properties of
x
Cu/BST (
x
= 0.000%, 0.025%, 0.050%, 0.075%, 0.100%, 0.200% in weight) composite TE materials were investigated. An excellent ZT
ave
value of 0.85 was achieved across the entire temperature range due to synergistic optimization of the electronic and thermal transport properties, which was larger than that of the BST matrix of 0.52 and comparable to that of BST materials prepared by costly and low-yield methods.</description><subject>Bismuth tellurides</subject><subject>Carrier density</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Cold pressing</subject><subject>Composite materials</subject><subject>Electronics and Microelectronics</subject><subject>Impurities</subject><subject>Instrumentation</subject><subject>International Conference on Thermoelectrics 2019</subject><subject>Materials Science</subject><subject>Optical and Electronic Materials</subject><subject>Optimization</subject><subject>Phase composition</subject><subject>Solid State Physics</subject><subject>Thermoelectric materials</subject><subject>Topical Collection: International Conference on Thermoelectrics 2019</subject><subject>Transport properties</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp9kE1Lw0AURQdRsFb_gKsB12nfm8kkk6WG-gEVC1YQN2EyebEpbSbOpAv_vdEI7lzdzbn3wmHsEmGGAOk8ICZJHIGACDQgRuKITVDFMkKdvB6zCcgEIyWkOmVnIWwBUKHGCXtbeeqMN33jWm7aii_ajWktVXy9Ib93tCPb-8bylXcd-b6hwF3N88P8poGZei5xptYkee72nQtNT_zR9OQbswvn7KQegi5-c8pebhfr_D5aPt095NfLyErM-qiCElOdpCStBqszBBIxWW3LSujUiLTCLElSqa1BLAXEqlRCD1xWi0zWJKfsatztvPs4UOiLrTv4drgshNRKaSkABkqMlPUuBE910flmb_xngVB8OyxGh8XgsPhxOLSnTI6lMMDtO_m_6X9aX3WVcm8</recordid><startdate>20200501</startdate><enddate>20200501</enddate><creator>Zhu, Wanting</creator><creator>Hu, Wenhua</creator><creator>Wei, Ping</creator><creator>Nie, Xiaolei</creator><creator>Zhao, Wenyu</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20200501</creationdate><title>Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials</title><author>Zhu, Wanting ; Hu, Wenhua ; Wei, Ping ; Nie, Xiaolei ; Zhao, Wenyu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-d0b17867e3c80c8910e24ec8cbd287a27d1966738ca11b2045b5288919f293fe3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Bismuth tellurides</topic><topic>Carrier density</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Cold pressing</topic><topic>Composite materials</topic><topic>Electronics and Microelectronics</topic><topic>Impurities</topic><topic>Instrumentation</topic><topic>International Conference on Thermoelectrics 2019</topic><topic>Materials Science</topic><topic>Optical and Electronic Materials</topic><topic>Optimization</topic><topic>Phase composition</topic><topic>Solid State Physics</topic><topic>Thermoelectric materials</topic><topic>Topical Collection: International Conference on Thermoelectrics 2019</topic><topic>Transport properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhu, Wanting</creatorcontrib><creatorcontrib>Hu, Wenhua</creatorcontrib><creatorcontrib>Wei, Ping</creatorcontrib><creatorcontrib>Nie, Xiaolei</creatorcontrib><creatorcontrib>Zhao, Wenyu</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhu, Wanting</au><au>Hu, Wenhua</au><au>Wei, Ping</au><au>Nie, Xiaolei</au><au>Zhao, Wenyu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2020-05-01</date><risdate>2020</risdate><volume>49</volume><issue>5</issue><spage>2962</spage><epage>2967</epage><pages>2962-2967</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>The practical application of Bi
2
Te
3
thermoelectric (TE) materials is constrained by their high orientation structure and limited service temperature range. In this work, non-textured Bi
0.5
Sb
1.5
Te
3
(BST) TE materials were fabricated via a facile, low-cost, and commercially applicable method: cold-pressing combined with annealing. Cu impurity was added into a BST matrix to regulate the carrier concentration and expand the service temperature range. The effects of Cu impurity on the phase composition, microstructure, and TE properties of
x
Cu/BST (
x
= 0.000%, 0.025%, 0.050%, 0.075%, 0.100%, 0.200% in weight) composite TE materials were investigated. An excellent ZT
ave
value of 0.85 was achieved across the entire temperature range due to synergistic optimization of the electronic and thermal transport properties, which was larger than that of the BST matrix of 0.52 and comparable to that of BST materials prepared by costly and low-yield methods.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-020-08011-2</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 2020-05, Vol.49 (5), p.2962-2967 |
| issn | 0361-5235 1543-186X |
| language | eng |
| recordid | cdi_proquest_journals_2385583200 |
| source | Springer Nature - Complete Springer Journals |
| subjects | Bismuth tellurides Carrier density Characterization and Evaluation of Materials Chemistry and Materials Science Cold pressing Composite materials Electronics and Microelectronics Impurities Instrumentation International Conference on Thermoelectrics 2019 Materials Science Optical and Electronic Materials Optimization Phase composition Solid State Physics Thermoelectric materials Topical Collection: International Conference on Thermoelectrics 2019 Transport properties |
| title | Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T20%3A51%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Preparation%20and%20Enhanced%20Thermoelectric%20Properties%20of%20Cu/Bi0.5Sb1.5Te3%20Composite%20Materials&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=Zhu,%20Wanting&rft.date=2020-05-01&rft.volume=49&rft.issue=5&rft.spage=2962&rft.epage=2967&rft.pages=2962-2967&rft.issn=0361-5235&rft.eissn=1543-186X&rft_id=info:doi/10.1007/s11664-020-08011-2&rft_dat=%3Cproquest_cross%3E2385583200%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2385583200&rft_id=info:pmid/&rfr_iscdi=true |