Thermoelectric Cooling of Heat-Loaded Electronics
The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm 2 and 40 × 40 mm 2 a...
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| Veröffentlicht in: | Russian microelectronics 2020-03, Vol.49 (2), p.123-131 |
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| container_title | Russian microelectronics |
| container_volume | 49 |
| creator | Vasil’ev, E. N. |
| description | The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm
2
and 40 × 40 mm
2
are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed. |
| doi_str_mv | 10.1134/S1063739720020092 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2383060294</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2383060294</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2312-e1b17e4cbbc60daef109d7d1769d515f706dd9ed9ca021f28f5969f715ad32e3</originalsourceid><addsrcrecordid>eNp1kEFLAzEQhYMoWKs_wNuC59WZZDdpjlKqFRY82PuSJpO6Zbupyfbgvze1ggcRBmbge-8NPMZuEe4RRfXwhiCFElpxgDyan7EJSpiVosL6PN8Zl0d-ya5S2gIggJQThqt3irtAPdkxdraYh9B3w6YIvliSGcsmGEeuWHzzMHQ2XbMLb_pENz97ylZPi9V8WTavzy_zx6a0XCAvCdeoqLLrtZXgDHkE7ZRDJbWrsfYKpHOanLYGOHo-87WW2iusjROcxJTdnWL3MXwcKI3tNhzikD-2XMwESOC6yio8qWwMKUXy7T52OxM_W4T2WEz7p5js4SdPytphQ_E3-X_TF65xYz8</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2383060294</pqid></control><display><type>article</type><title>Thermoelectric Cooling of Heat-Loaded Electronics</title><source>SpringerNature Journals</source><creator>Vasil’ev, E. N.</creator><creatorcontrib>Vasil’ev, E. N.</creatorcontrib><description>The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm
2
and 40 × 40 mm
2
are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed.</description><identifier>ISSN: 1063-7397</identifier><identifier>EISSN: 1608-3415</identifier><identifier>DOI: 10.1134/S1063739720020092</identifier><language>eng</language><publisher>Moscow: Pleiades Publishing</publisher><subject>Cooling ; Distributors ; Electrical Engineering ; Engineering ; Heat ; Heat flux ; Inhomogeneity ; Mathematical analysis ; Modules ; Parameters ; Power consumption ; Power efficiency ; Temperature distribution ; Temperature gradients ; Thermal control systems ; Thermal energy ; Thermal resistance ; Thermoelectric cooling</subject><ispartof>Russian microelectronics, 2020-03, Vol.49 (2), p.123-131</ispartof><rights>Pleiades Publishing, Ltd. 2020</rights><rights>2020© Pleiades Publishing, Ltd. 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2312-e1b17e4cbbc60daef109d7d1769d515f706dd9ed9ca021f28f5969f715ad32e3</citedby><cites>FETCH-LOGICAL-c2312-e1b17e4cbbc60daef109d7d1769d515f706dd9ed9ca021f28f5969f715ad32e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1134/S1063739720020092$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1134/S1063739720020092$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>315,781,785,27929,27930,41493,42562,51324</link.rule.ids></links><search><creatorcontrib>Vasil’ev, E. N.</creatorcontrib><title>Thermoelectric Cooling of Heat-Loaded Electronics</title><title>Russian microelectronics</title><addtitle>Russ Microelectron</addtitle><description>The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm
2
and 40 × 40 mm
2
are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed.</description><subject>Cooling</subject><subject>Distributors</subject><subject>Electrical Engineering</subject><subject>Engineering</subject><subject>Heat</subject><subject>Heat flux</subject><subject>Inhomogeneity</subject><subject>Mathematical analysis</subject><subject>Modules</subject><subject>Parameters</subject><subject>Power consumption</subject><subject>Power efficiency</subject><subject>Temperature distribution</subject><subject>Temperature gradients</subject><subject>Thermal control systems</subject><subject>Thermal energy</subject><subject>Thermal resistance</subject><subject>Thermoelectric cooling</subject><issn>1063-7397</issn><issn>1608-3415</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNp1kEFLAzEQhYMoWKs_wNuC59WZZDdpjlKqFRY82PuSJpO6Zbupyfbgvze1ggcRBmbge-8NPMZuEe4RRfXwhiCFElpxgDyan7EJSpiVosL6PN8Zl0d-ya5S2gIggJQThqt3irtAPdkxdraYh9B3w6YIvliSGcsmGEeuWHzzMHQ2XbMLb_pENz97ylZPi9V8WTavzy_zx6a0XCAvCdeoqLLrtZXgDHkE7ZRDJbWrsfYKpHOanLYGOHo-87WW2iusjROcxJTdnWL3MXwcKI3tNhzikD-2XMwESOC6yio8qWwMKUXy7T52OxM_W4T2WEz7p5js4SdPytphQ_E3-X_TF65xYz8</recordid><startdate>20200301</startdate><enddate>20200301</enddate><creator>Vasil’ev, E. N.</creator><general>Pleiades Publishing</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20200301</creationdate><title>Thermoelectric Cooling of Heat-Loaded Electronics</title><author>Vasil’ev, E. N.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2312-e1b17e4cbbc60daef109d7d1769d515f706dd9ed9ca021f28f5969f715ad32e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Cooling</topic><topic>Distributors</topic><topic>Electrical Engineering</topic><topic>Engineering</topic><topic>Heat</topic><topic>Heat flux</topic><topic>Inhomogeneity</topic><topic>Mathematical analysis</topic><topic>Modules</topic><topic>Parameters</topic><topic>Power consumption</topic><topic>Power efficiency</topic><topic>Temperature distribution</topic><topic>Temperature gradients</topic><topic>Thermal control systems</topic><topic>Thermal energy</topic><topic>Thermal resistance</topic><topic>Thermoelectric cooling</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Vasil’ev, E. N.</creatorcontrib><collection>CrossRef</collection><jtitle>Russian microelectronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Vasil’ev, E. N.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermoelectric Cooling of Heat-Loaded Electronics</atitle><jtitle>Russian microelectronics</jtitle><stitle>Russ Microelectron</stitle><date>2020-03-01</date><risdate>2020</risdate><volume>49</volume><issue>2</issue><spage>123</spage><epage>131</epage><pages>123-131</pages><issn>1063-7397</issn><eissn>1608-3415</eissn><abstract>The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm
2
and 40 × 40 mm
2
are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed.</abstract><cop>Moscow</cop><pub>Pleiades Publishing</pub><doi>10.1134/S1063739720020092</doi><tpages>9</tpages></addata></record> |
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| ispartof | Russian microelectronics, 2020-03, Vol.49 (2), p.123-131 |
| issn | 1063-7397 1608-3415 |
| language | eng |
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| source | SpringerNature Journals |
| subjects | Cooling Distributors Electrical Engineering Engineering Heat Heat flux Inhomogeneity Mathematical analysis Modules Parameters Power consumption Power efficiency Temperature distribution Temperature gradients Thermal control systems Thermal energy Thermal resistance Thermoelectric cooling |
| title | Thermoelectric Cooling of Heat-Loaded Electronics |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T17%3A58%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Thermoelectric%20Cooling%20of%20Heat-Loaded%20Electronics&rft.jtitle=Russian%20microelectronics&rft.au=Vasil%E2%80%99ev,%20E.%20N.&rft.date=2020-03-01&rft.volume=49&rft.issue=2&rft.spage=123&rft.epage=131&rft.pages=123-131&rft.issn=1063-7397&rft.eissn=1608-3415&rft_id=info:doi/10.1134/S1063739720020092&rft_dat=%3Cproquest_cross%3E2383060294%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2383060294&rft_id=info:pmid/&rfr_iscdi=true |