Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology
In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm × 650 mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with consi...
Gespeichert in:
| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.304-313 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 313 |
|---|---|
| container_issue | 2 |
| container_start_page | 304 |
| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
| container_volume | 10 |
| creator | Che, Fa Xing Yamamoto, Kazunori Rao, Vempati Srinivasa Sekhar, Vasarla Nagendra |
| description | In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm × 650 mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with considering material selection of photo-dielectric, glass carrier and molding compound, structure design, and process optimization. Taguchi method is implemented to identify important parameters resulting in large panel warpage in each process and further parametric studies are also conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed in this study by considering the panel process and panel size. Modeling gravity effect reduces the panel warpage significantly, which is very close to the real case and is validated by warpage measurement results. Therefore, the gravity effect on warpage needs to be modeled for the large panelwarpage simulation to achieve accurate simulation results. |
| doi_str_mv | 10.1109/TCPMT.2019.2929529 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_journals_2352193941</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>8765785</ieee_id><sourcerecordid>2352193941</sourcerecordid><originalsourceid>FETCH-LOGICAL-c295t-74b59bddf92291b6a5a68e1e4cf09b365d1bda209bb83ea14f1c6da49ee7bc0b3</originalsourceid><addsrcrecordid>eNo9UMtOwzAQtBBIVKU_AJdInF38iJP4iAotlYJaoVQcLdvZhJSSFDtF6t_jPtQ97I40M7urQeiekjGlRD4Vk-V7MWaEyjGTTAomr9CAUZFgLjNxfcGC3KKR92sSSmQkJXyA5kvdwib61G6ra4i6KprqFi92fXQkcA5_gV5q-63rpq2jlT_0j5ccTxvn-6gA-9V2m67e36GbSm88jM5ziFbT12LyhvPFbD55zrENr_U4jY2QpiwryZikJtFCJxlQiG1FpOGJKKkpNQvYZBw0jStqk1LHEiA1lhg-RI-nvVvX_e7A92rd7VwbTirGBaOSy5gGFTuprOu8d1CprWt-tNsrStQhNXVMTR1SU-fUgunhZGoA4GLI0kSkmeD_qi1n6w</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2352193941</pqid></control><display><type>article</type><title>Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology</title><source>IEEE Electronic Library (IEL)</source><creator>Che, Fa Xing ; Yamamoto, Kazunori ; Rao, Vempati Srinivasa ; Sekhar, Vasarla Nagendra</creator><creatorcontrib>Che, Fa Xing ; Yamamoto, Kazunori ; Rao, Vempati Srinivasa ; Sekhar, Vasarla Nagendra</creatorcontrib><description>In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm × 650 mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with considering material selection of photo-dielectric, glass carrier and molding compound, structure design, and process optimization. Taguchi method is implemented to identify important parameters resulting in large panel warpage in each process and further parametric studies are also conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed in this study by considering the panel process and panel size. Modeling gravity effect reduces the panel warpage significantly, which is very close to the real case and is validated by warpage measurement results. Therefore, the gravity effect on warpage needs to be modeled for the large panelwarpage simulation to achieve accurate simulation results.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2019.2929529</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Chemicals ; Computer simulation ; Design optimization ; Electromagnetic compatibility ; Fan-out (FO) technology ; Finite element method ; finite-element modeling ; FO panel-level packaging (FO-PLP) ; Glass ; Gravitation ; Gravitational effects ; Gravity ; gravity effect ; Load modeling ; Materials selection ; Molding (process) ; Molding compounds ; Packaging ; panel warpage ; panel-level packaging ; Parameter identification ; Photoelectric effect ; Semiconductor device modeling ; Simulation ; Taguchi methods ; Technology utilization ; Warpage</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.304-313</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c295t-74b59bddf92291b6a5a68e1e4cf09b365d1bda209bb83ea14f1c6da49ee7bc0b3</citedby><cites>FETCH-LOGICAL-c295t-74b59bddf92291b6a5a68e1e4cf09b365d1bda209bb83ea14f1c6da49ee7bc0b3</cites><orcidid>0000-0003-2326-6568</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8765785$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/8765785$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Che, Fa Xing</creatorcontrib><creatorcontrib>Yamamoto, Kazunori</creatorcontrib><creatorcontrib>Rao, Vempati Srinivasa</creatorcontrib><creatorcontrib>Sekhar, Vasarla Nagendra</creatorcontrib><title>Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm × 650 mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with considering material selection of photo-dielectric, glass carrier and molding compound, structure design, and process optimization. Taguchi method is implemented to identify important parameters resulting in large panel warpage in each process and further parametric studies are also conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed in this study by considering the panel process and panel size. Modeling gravity effect reduces the panel warpage significantly, which is very close to the real case and is validated by warpage measurement results. Therefore, the gravity effect on warpage needs to be modeled for the large panelwarpage simulation to achieve accurate simulation results.</description><subject>Chemicals</subject><subject>Computer simulation</subject><subject>Design optimization</subject><subject>Electromagnetic compatibility</subject><subject>Fan-out (FO) technology</subject><subject>Finite element method</subject><subject>finite-element modeling</subject><subject>FO panel-level packaging (FO-PLP)</subject><subject>Glass</subject><subject>Gravitation</subject><subject>Gravitational effects</subject><subject>Gravity</subject><subject>gravity effect</subject><subject>Load modeling</subject><subject>Materials selection</subject><subject>Molding (process)</subject><subject>Molding compounds</subject><subject>Packaging</subject><subject>panel warpage</subject><subject>panel-level packaging</subject><subject>Parameter identification</subject><subject>Photoelectric effect</subject><subject>Semiconductor device modeling</subject><subject>Simulation</subject><subject>Taguchi methods</subject><subject>Technology utilization</subject><subject>Warpage</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9UMtOwzAQtBBIVKU_AJdInF38iJP4iAotlYJaoVQcLdvZhJSSFDtF6t_jPtQ97I40M7urQeiekjGlRD4Vk-V7MWaEyjGTTAomr9CAUZFgLjNxfcGC3KKR92sSSmQkJXyA5kvdwib61G6ra4i6KprqFi92fXQkcA5_gV5q-63rpq2jlT_0j5ccTxvn-6gA-9V2m67e36GbSm88jM5ziFbT12LyhvPFbD55zrENr_U4jY2QpiwryZikJtFCJxlQiG1FpOGJKKkpNQvYZBw0jStqk1LHEiA1lhg-RI-nvVvX_e7A92rd7VwbTirGBaOSy5gGFTuprOu8d1CprWt-tNsrStQhNXVMTR1SU-fUgunhZGoA4GLI0kSkmeD_qi1n6w</recordid><startdate>20200201</startdate><enddate>20200201</enddate><creator>Che, Fa Xing</creator><creator>Yamamoto, Kazunori</creator><creator>Rao, Vempati Srinivasa</creator><creator>Sekhar, Vasarla Nagendra</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-2326-6568</orcidid></search><sort><creationdate>20200201</creationdate><title>Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology</title><author>Che, Fa Xing ; Yamamoto, Kazunori ; Rao, Vempati Srinivasa ; Sekhar, Vasarla Nagendra</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c295t-74b59bddf92291b6a5a68e1e4cf09b365d1bda209bb83ea14f1c6da49ee7bc0b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Chemicals</topic><topic>Computer simulation</topic><topic>Design optimization</topic><topic>Electromagnetic compatibility</topic><topic>Fan-out (FO) technology</topic><topic>Finite element method</topic><topic>finite-element modeling</topic><topic>FO panel-level packaging (FO-PLP)</topic><topic>Glass</topic><topic>Gravitation</topic><topic>Gravitational effects</topic><topic>Gravity</topic><topic>gravity effect</topic><topic>Load modeling</topic><topic>Materials selection</topic><topic>Molding (process)</topic><topic>Molding compounds</topic><topic>Packaging</topic><topic>panel warpage</topic><topic>panel-level packaging</topic><topic>Parameter identification</topic><topic>Photoelectric effect</topic><topic>Semiconductor device modeling</topic><topic>Simulation</topic><topic>Taguchi methods</topic><topic>Technology utilization</topic><topic>Warpage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Che, Fa Xing</creatorcontrib><creatorcontrib>Yamamoto, Kazunori</creatorcontrib><creatorcontrib>Rao, Vempati Srinivasa</creatorcontrib><creatorcontrib>Sekhar, Vasarla Nagendra</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Che, Fa Xing</au><au>Yamamoto, Kazunori</au><au>Rao, Vempati Srinivasa</au><au>Sekhar, Vasarla Nagendra</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2020-02-01</date><risdate>2020</risdate><volume>10</volume><issue>2</issue><spage>304</spage><epage>313</epage><pages>304-313</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm × 650 mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with considering material selection of photo-dielectric, glass carrier and molding compound, structure design, and process optimization. Taguchi method is implemented to identify important parameters resulting in large panel warpage in each process and further parametric studies are also conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed in this study by considering the panel process and panel size. Modeling gravity effect reduces the panel warpage significantly, which is very close to the real case and is validated by warpage measurement results. Therefore, the gravity effect on warpage needs to be modeled for the large panelwarpage simulation to achieve accurate simulation results.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2019.2929529</doi><tpages>10</tpages><orcidid>https://orcid.org/0000-0003-2326-6568</orcidid></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 2156-3950 |
| ispartof | IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.304-313 |
| issn | 2156-3950 2156-3985 |
| language | eng |
| recordid | cdi_proquest_journals_2352193941 |
| source | IEEE Electronic Library (IEL) |
| subjects | Chemicals Computer simulation Design optimization Electromagnetic compatibility Fan-out (FO) technology Finite element method finite-element modeling FO panel-level packaging (FO-PLP) Glass Gravitation Gravitational effects Gravity gravity effect Load modeling Materials selection Molding (process) Molding compounds Packaging panel warpage panel-level packaging Parameter identification Photoelectric effect Semiconductor device modeling Simulation Taguchi methods Technology utilization Warpage |
| title | Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-16T09%3A40%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Panel%20Warpage%20of%20Fan-Out%20Panel-Level%20Packaging%20Using%20RDL-First%20Technology&rft.jtitle=IEEE%20transactions%20on%20components,%20packaging,%20and%20manufacturing%20technology%20(2011)&rft.au=Che,%20Fa%20Xing&rft.date=2020-02-01&rft.volume=10&rft.issue=2&rft.spage=304&rft.epage=313&rft.pages=304-313&rft.issn=2156-3950&rft.eissn=2156-3985&rft.coden=ITCPC8&rft_id=info:doi/10.1109/TCPMT.2019.2929529&rft_dat=%3Cproquest_RIE%3E2352193941%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2352193941&rft_id=info:pmid/&rft_ieee_id=8765785&rfr_iscdi=true |