Nickel–tin transient liquid phase sintering with high bonding strength for high-temperature power applications

We performed 30Ni–70Sn (wt%) transient liquid phase sintering (TLPS) bonding with micro-sized Ni and Sn powders for high-temperature power applications. A Ni–Sn paste was fabricated and TLPS bonding was performed. We investigated the interfacial reactions, transformations into Ni 3 Sn 4 intermetalli...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2019-11, Vol.30 (22), p.20205-20212
Hauptverfasser:	Yoon, Jeong-Won, Kim, Young-Se, Jeong, So-Eun
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive strength Bonded joints Bonding strength Characterization and Evaluation of Materials Chemistry and Materials Science High temperature Interface reactions Intermetallic compounds Liquid phase sintering Liquid phases Materials Science Melting points Nickel Optical and Electronic Materials Shear strength Tin Tin base alloys
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