Relationships among Carrier, Friction Coefficient and Removal Rate of Double-Sided Polishing: Effect of Carrier on Friction Coefficient between Polishing Pad and Substrate and Correlation of Friction Coefficient and Removal Rate
Double-sided polishing (DSP) method is widely used in manufacturing process of sapphire substrate for LEDs. Since, several studies on the DSP method have been actively reported, however, it is not enough from the practical viewpoint such as the effect of carrier, polishing pad surface asperities and...
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| Veröffentlicht in: | Journal of the Japan Society for Precision Engineering 2019/09/05, Vol.85(9), pp.793-799 |
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| container_title | Journal of the Japan Society for Precision Engineering |
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| creator | UNEDA, Michio HIYAMA, Michiaki IZUMIDA, Ryo SHIBUYA, Kazutaka MIYASHITA, Tadakazu ISHIKAWA, Ken-ichi |
| description | Double-sided polishing (DSP) method is widely used in manufacturing process of sapphire substrate for LEDs. Since, several studies on the DSP method have been actively reported, however, it is not enough from the practical viewpoint such as the effect of carrier, polishing pad surface asperities and kinematic friction characteristics on the removal rate. This study focuses on the carrier used in the DSP as well as aims to elucidate the carrier characteristics and the kinematic friction coefficient for obtaining the high removal rate. In this paper, the effects of slurry hole area ratio and surface properties of carrier on the removal rate in upper/ lower surfaces of substrate were examined. Moreover, in the kinematic friction characteristics between the polishing pad and the substrate, the friction characteristics in the DSP were observed. As a result, the removal rate and kinematic friction coefficient of the upper/ lower surfaces of substrate change depending on the slurry hole area ratio and surface properties of carrier, and there is a strong relationship between them. |
| doi_str_mv | 10.2493/jjspe.85.793 |
| format | Article |
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Since, several studies on the DSP method have been actively reported, however, it is not enough from the practical viewpoint such as the effect of carrier, polishing pad surface asperities and kinematic friction characteristics on the removal rate. This study focuses on the carrier used in the DSP as well as aims to elucidate the carrier characteristics and the kinematic friction coefficient for obtaining the high removal rate. In this paper, the effects of slurry hole area ratio and surface properties of carrier on the removal rate in upper/ lower surfaces of substrate were examined. Moreover, in the kinematic friction characteristics between the polishing pad and the substrate, the friction characteristics in the DSP were observed. As a result, the removal rate and kinematic friction coefficient of the upper/ lower surfaces of substrate change depending on the slurry hole area ratio and surface properties of carrier, and there is a strong relationship between them.</description><identifier>ISSN: 0912-0289</identifier><identifier>EISSN: 1882-675X</identifier><identifier>DOI: 10.2493/jjspe.85.793</identifier><language>jpn</language><publisher>Tokyo: The Japan Society for Precision Engineering</publisher><subject>carrier ; Coefficient of friction ; double-sided polishing ; Friction ; friction coefficient ; Kinematics ; Polishing ; polishing pad surface asperities ; removal rate ; Sapphire ; Slurries ; slurry hole area ratio ; Substrates ; Surface properties</subject><ispartof>Journal of the Japan Society for Precision Engineering, 2019/09/05, Vol.85(9), pp.793-799</ispartof><rights>2019 The Japan Society for Precision Engineering</rights><rights>Copyright Japan Science and Technology Agency 2019</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c191t-8ead2e3e98fc2685f31bcfb9c71477b1d72999f7988804dca6e3399cd00def163</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>UNEDA, Michio</creatorcontrib><creatorcontrib>HIYAMA, Michiaki</creatorcontrib><creatorcontrib>IZUMIDA, Ryo</creatorcontrib><creatorcontrib>SHIBUYA, Kazutaka</creatorcontrib><creatorcontrib>MIYASHITA, Tadakazu</creatorcontrib><creatorcontrib>ISHIKAWA, Ken-ichi</creatorcontrib><title>Relationships among Carrier, Friction Coefficient and Removal Rate of Double-Sided Polishing: Effect of Carrier on Friction Coefficient between Polishing Pad and Substrate and Correlation of Friction Coefficient and Removal Rate</title><title>Journal of the Japan Society for Precision Engineering</title><addtitle>Journal of the Japan Society for Precision Engineering</addtitle><description>Double-sided polishing (DSP) method is widely used in manufacturing process of sapphire substrate for LEDs. 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As a result, the removal rate and kinematic friction coefficient of the upper/ lower surfaces of substrate change depending on the slurry hole area ratio and surface properties of carrier, and there is a strong relationship between them.</description><subject>carrier</subject><subject>Coefficient of friction</subject><subject>double-sided polishing</subject><subject>Friction</subject><subject>friction coefficient</subject><subject>Kinematics</subject><subject>Polishing</subject><subject>polishing pad surface asperities</subject><subject>removal rate</subject><subject>Sapphire</subject><subject>Slurries</subject><subject>slurry hole area ratio</subject><subject>Substrates</subject><subject>Surface properties</subject><issn>0912-0289</issn><issn>1882-675X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNpFkF1LwzAUhoMoOObu_AEBb9eZj7VNrkSqU2GgTAUvhJCmJ1tK18ykE_z3dm7Mq3PxPu974EHokpIJm0p-XddxAxORTnLJT9CACsGSLE8_TtGASMoSwoQ8R6MYXUkIy3LCOBugzwU0unO-jSu3iVivfbvEhQ7BQRjjWXBmF-LCg7XOOGg7rNsKL2Dtv3WDF7oD7C2-89uygeTVVVDhF9-4fq5dXqAzq5sIo8MdovfZ_VvxmMyfH56K23liqKRdIkBXDDhIYQ3LRGo5LY0tpcnpNM9LWuVMSmlzKYQg08roDDiX0lSEVGBpxofoar-7Cf5rC7FTtd-Gtn-pGJOUk4wR2lPjPWWCjzGAVZvg1jr8KErUTqH6U6hEqnqFPX6zx-vY6SUcYR06Zxr4h-WhcUzMSgcFLf8FqWV81Q</recordid><startdate>20190905</startdate><enddate>20190905</enddate><creator>UNEDA, Michio</creator><creator>HIYAMA, Michiaki</creator><creator>IZUMIDA, Ryo</creator><creator>SHIBUYA, Kazutaka</creator><creator>MIYASHITA, Tadakazu</creator><creator>ISHIKAWA, Ken-ichi</creator><general>The Japan Society for Precision Engineering</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope></search><sort><creationdate>20190905</creationdate><title>Relationships among Carrier, Friction Coefficient and Removal Rate of Double-Sided Polishing</title><author>UNEDA, Michio ; HIYAMA, Michiaki ; IZUMIDA, Ryo ; SHIBUYA, Kazutaka ; MIYASHITA, Tadakazu ; ISHIKAWA, Ken-ichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c191t-8ead2e3e98fc2685f31bcfb9c71477b1d72999f7988804dca6e3399cd00def163</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>2019</creationdate><topic>carrier</topic><topic>Coefficient of friction</topic><topic>double-sided polishing</topic><topic>Friction</topic><topic>friction coefficient</topic><topic>Kinematics</topic><topic>Polishing</topic><topic>polishing pad surface asperities</topic><topic>removal rate</topic><topic>Sapphire</topic><topic>Slurries</topic><topic>slurry hole area ratio</topic><topic>Substrates</topic><topic>Surface properties</topic><toplevel>online_resources</toplevel><creatorcontrib>UNEDA, Michio</creatorcontrib><creatorcontrib>HIYAMA, Michiaki</creatorcontrib><creatorcontrib>IZUMIDA, Ryo</creatorcontrib><creatorcontrib>SHIBUYA, Kazutaka</creatorcontrib><creatorcontrib>MIYASHITA, Tadakazu</creatorcontrib><creatorcontrib>ISHIKAWA, Ken-ichi</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><jtitle>Journal of the Japan Society for Precision Engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>UNEDA, Michio</au><au>HIYAMA, Michiaki</au><au>IZUMIDA, Ryo</au><au>SHIBUYA, Kazutaka</au><au>MIYASHITA, Tadakazu</au><au>ISHIKAWA, Ken-ichi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Relationships among Carrier, Friction Coefficient and Removal Rate of Double-Sided Polishing: Effect of Carrier on Friction Coefficient between Polishing Pad and Substrate and Correlation of Friction Coefficient and Removal Rate</atitle><jtitle>Journal of the Japan Society for Precision Engineering</jtitle><addtitle>Journal of the Japan Society for Precision Engineering</addtitle><date>2019-09-05</date><risdate>2019</risdate><volume>85</volume><issue>9</issue><spage>793</spage><epage>799</epage><pages>793-799</pages><issn>0912-0289</issn><eissn>1882-675X</eissn><abstract>Double-sided polishing (DSP) method is widely used in manufacturing process of sapphire substrate for LEDs. Since, several studies on the DSP method have been actively reported, however, it is not enough from the practical viewpoint such as the effect of carrier, polishing pad surface asperities and kinematic friction characteristics on the removal rate. This study focuses on the carrier used in the DSP as well as aims to elucidate the carrier characteristics and the kinematic friction coefficient for obtaining the high removal rate. In this paper, the effects of slurry hole area ratio and surface properties of carrier on the removal rate in upper/ lower surfaces of substrate were examined. Moreover, in the kinematic friction characteristics between the polishing pad and the substrate, the friction characteristics in the DSP were observed. As a result, the removal rate and kinematic friction coefficient of the upper/ lower surfaces of substrate change depending on the slurry hole area ratio and surface properties of carrier, and there is a strong relationship between them.</abstract><cop>Tokyo</cop><pub>The Japan Society for Precision Engineering</pub><doi>10.2493/jjspe.85.793</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | Journal of the Japan Society for Precision Engineering, 2019/09/05, Vol.85(9), pp.793-799 |
| issn | 0912-0289 1882-675X |
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| source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals |
| subjects | carrier Coefficient of friction double-sided polishing Friction friction coefficient Kinematics Polishing polishing pad surface asperities removal rate Sapphire Slurries slurry hole area ratio Substrates Surface properties |
| title | Relationships among Carrier, Friction Coefficient and Removal Rate of Double-Sided Polishing: Effect of Carrier on Friction Coefficient between Polishing Pad and Substrate and Correlation of Friction Coefficient and Removal Rate |
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