Optimizing size and distribution of voids in phenolic resins through the choice of catalyst types

ABSTRACT Phenolics are widely used for over a century in different industries due to their chemical resistance and thermomechanical properties. However, the presence of voids in phenolic resins has negative effects on the mechanical properties and a conventional approach is to avoid these by utilizi...

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Veröffentlicht in:Journal of applied polymer science 2019-12, Vol.136 (47), p.n/a
Hauptverfasser: Hamad, Sameer F., Farr, Nicholas, Fei, Teng, Shukor, Nur F., Dean, Julian S., Hayes, Simon A., Foreman, Joel P., Rodenburg, Cornelia
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Sprache:eng
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Zusammenfassung:ABSTRACT Phenolics are widely used for over a century in different industries due to their chemical resistance and thermomechanical properties. However, the presence of voids in phenolic resins has negative effects on the mechanical properties and a conventional approach is to avoid these by utilizing very long cure cycles. Our alternative approach investigates the tailoring of void size and distribution to achieve a better balance between processing time and mechanical properties. Therefore, we produced phenolic resin with a void‐free microstructure by a long cure cycle as a reference. To alter the void size and distributions, we utilized different catalysts and a short cure cycle to obtain phenolic resins and test their flexural properties with respect to the reference. We investigated the fracture surfaces of all materials by SEM, FTIR and compared results to finite element modeling that confirmed the effects of different void size and distributions on the mechanical properties. © 2019 The Authors. Journal of Applied Polymer Science published by Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 48249. LV‐SEM micrographs of the flexural fractured surfaces of phenolic resins cured with slow action acid catalyst (phencat 382) and fast action acid catalyst (phencat 10). The models show the stress distribution in both samples.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.48249