The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging
The correlations between different Ni contents in Sn-1.2Ag-0.5Cu-xNi (wt.%; x = 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering diffraction analysis and a scanning electron micr...
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| Veröffentlicht in: | Journal of electronic materials 2020, Vol.49 (1), p.196-201 |
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| creator | Fleshman, Collin Duh, Jenq-Gong |
| description | The correlations between different Ni contents in Sn-1.2Ag-0.5Cu-xNi (wt.%;
x
= 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering diffraction analysis and a scanning electron microscope, complexity in microstructure of Ni-doped solder joints was investigated. The results of a slow speed shear test revealed that the peak force of solder joints was efficiently enhanced by the addition of Ni before and after aging. The improvement of mechanical strength was ascribed to the modification of microstructure by the introduction of minor Ni addition. Spread and tiny intermetallic compounds, and the oriented interlaced structure in Ni-doped solder joints acted as hindrances for propagation of cracks and dislocations. It is revealed that solder joints with minor Ni doping tend to exhibit better mechanical reliability in advanced electronic packaging no matter before or after aging. |
| doi_str_mv | 10.1007/s11664-019-07481-3 |
| format | Article |
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x
= 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering diffraction analysis and a scanning electron microscope, complexity in microstructure of Ni-doped solder joints was investigated. The results of a slow speed shear test revealed that the peak force of solder joints was efficiently enhanced by the addition of Ni before and after aging. The improvement of mechanical strength was ascribed to the modification of microstructure by the introduction of minor Ni addition. Spread and tiny intermetallic compounds, and the oriented interlaced structure in Ni-doped solder joints acted as hindrances for propagation of cracks and dislocations. It is revealed that solder joints with minor Ni doping tend to exhibit better mechanical reliability in advanced electronic packaging no matter before or after aging.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-019-07481-3</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Aging ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Crack propagation ; Cracks ; Dislocations ; Electronic packaging ; Electronics and Microelectronics ; Emerging Interconnection Technology ; Instrumentation ; Interconnect ; Intermetallic compounds ; Materials Science ; Microstructure ; Nickel ; Optical and Electronic Materials ; Pb-free Solder ; Preservatives ; Shear strength ; Shear tests ; Solderability ; Soldered joints ; Solid State Physics ; Tin base alloys ; TMS2019 Advanced Microelectronic Packaging ; TMS2019 Microelectronic Packaging</subject><ispartof>Journal of electronic materials, 2020, Vol.49 (1), p.196-201</ispartof><rights>The Minerals, Metals & Materials Society 2019</rights><rights>Journal of Electronic Materials is a copyright of Springer, (2019). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-e53cfa35a20d66b99a0947c20db45257964f5dfd004e1a5b193479287e41270e3</citedby><cites>FETCH-LOGICAL-c319t-e53cfa35a20d66b99a0947c20db45257964f5dfd004e1a5b193479287e41270e3</cites><orcidid>0000-0002-7364-4283</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-019-07481-3$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-019-07481-3$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Fleshman, Collin</creatorcontrib><creatorcontrib>Duh, Jenq-Gong</creatorcontrib><title>The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The correlations between different Ni contents in Sn-1.2Ag-0.5Cu-xNi (wt.%;
x
= 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering diffraction analysis and a scanning electron microscope, complexity in microstructure of Ni-doped solder joints was investigated. The results of a slow speed shear test revealed that the peak force of solder joints was efficiently enhanced by the addition of Ni before and after aging. The improvement of mechanical strength was ascribed to the modification of microstructure by the introduction of minor Ni addition. Spread and tiny intermetallic compounds, and the oriented interlaced structure in Ni-doped solder joints acted as hindrances for propagation of cracks and dislocations. It is revealed that solder joints with minor Ni doping tend to exhibit better mechanical reliability in advanced electronic packaging no matter before or after aging.</description><subject>Aging</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Crack propagation</subject><subject>Cracks</subject><subject>Dislocations</subject><subject>Electronic packaging</subject><subject>Electronics and Microelectronics</subject><subject>Emerging Interconnection Technology</subject><subject>Instrumentation</subject><subject>Interconnect</subject><subject>Intermetallic compounds</subject><subject>Materials Science</subject><subject>Microstructure</subject><subject>Nickel</subject><subject>Optical and Electronic Materials</subject><subject>Pb-free Solder</subject><subject>Preservatives</subject><subject>Shear strength</subject><subject>Shear tests</subject><subject>Solderability</subject><subject>Soldered joints</subject><subject>Solid State Physics</subject><subject>Tin base alloys</subject><subject>TMS2019 Advanced Microelectronic Packaging</subject><subject>TMS2019 Microelectronic Packaging</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>BENPR</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp9kMtKAzEUhoMoWC8v4CrgOjYnt5ksa_GKNxgVdyGdybQjNqNJRnTno5tawZ2rcML3_4fzIXQA9AgoLcYRQClBKGhCC1EC4RtoBFJwAqV62kQjyhUQybjcRjsxPlMKEkoYoa_7hcOPNnQ2db3HfYuvuzr0MYWhTkNw2PoGp8xcLF9D_-6WzqcVVS2cDbhKwfl5WuDO42oyBUYl-bjpxrfVHZ4OuOpfGhfwZd_5FPGxa_vfwkmb8v9k3vn5Htpq7Ut0-7_vLno4PbmfnpOr27OL6eSK1Bx0Ik7yurVcWkYbpWZaW6pFUedpJiSThVailU3bUCocWDkDzUWhWVk4Aaygju-iw3VvPuNtcDGZ534IPq80jKlSKMqFzhRbUysHMbjWvIZuacOnAWpWps3atMmmzY9pw3OIr0Mxw37uwl_1P6lvqDl_Zg</recordid><startdate>2020</startdate><enddate>2020</enddate><creator>Fleshman, Collin</creator><creator>Duh, Jenq-Gong</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><orcidid>https://orcid.org/0000-0002-7364-4283</orcidid></search><sort><creationdate>2020</creationdate><title>The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging</title><author>Fleshman, Collin ; Duh, Jenq-Gong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-e53cfa35a20d66b99a0947c20db45257964f5dfd004e1a5b193479287e41270e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Aging</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Crack propagation</topic><topic>Cracks</topic><topic>Dislocations</topic><topic>Electronic packaging</topic><topic>Electronics and Microelectronics</topic><topic>Emerging Interconnection Technology</topic><topic>Instrumentation</topic><topic>Interconnect</topic><topic>Intermetallic compounds</topic><topic>Materials Science</topic><topic>Microstructure</topic><topic>Nickel</topic><topic>Optical and Electronic Materials</topic><topic>Pb-free Solder</topic><topic>Preservatives</topic><topic>Shear strength</topic><topic>Shear tests</topic><topic>Solderability</topic><topic>Soldered joints</topic><topic>Solid State Physics</topic><topic>Tin base alloys</topic><topic>TMS2019 Advanced Microelectronic Packaging</topic><topic>TMS2019 Microelectronic Packaging</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fleshman, Collin</creatorcontrib><creatorcontrib>Duh, Jenq-Gong</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection (ProQuest)</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fleshman, Collin</au><au>Duh, Jenq-Gong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2020</date><risdate>2020</risdate><volume>49</volume><issue>1</issue><spage>196</spage><epage>201</epage><pages>196-201</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>The correlations between different Ni contents in Sn-1.2Ag-0.5Cu-xNi (wt.%;
x
= 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering diffraction analysis and a scanning electron microscope, complexity in microstructure of Ni-doped solder joints was investigated. The results of a slow speed shear test revealed that the peak force of solder joints was efficiently enhanced by the addition of Ni before and after aging. The improvement of mechanical strength was ascribed to the modification of microstructure by the introduction of minor Ni addition. Spread and tiny intermetallic compounds, and the oriented interlaced structure in Ni-doped solder joints acted as hindrances for propagation of cracks and dislocations. It is revealed that solder joints with minor Ni doping tend to exhibit better mechanical reliability in advanced electronic packaging no matter before or after aging.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-019-07481-3</doi><tpages>6</tpages><orcidid>https://orcid.org/0000-0002-7364-4283</orcidid></addata></record> |
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| ispartof | Journal of electronic materials, 2020, Vol.49 (1), p.196-201 |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Aging Characterization and Evaluation of Materials Chemistry and Materials Science Copper Crack propagation Cracks Dislocations Electronic packaging Electronics and Microelectronics Emerging Interconnection Technology Instrumentation Interconnect Intermetallic compounds Materials Science Microstructure Nickel Optical and Electronic Materials Pb-free Solder Preservatives Shear strength Shear tests Solderability Soldered joints Solid State Physics Tin base alloys TMS2019 Advanced Microelectronic Packaging TMS2019 Microelectronic Packaging |
| title | The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging |
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