Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples

Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of electronic materials 2020-01, Vol.49 (1), p.173-187
Hauptverfasser:	Soares, Thiago, Cruz, Clarissa, Silva, Bismarck, Brito, Crystopher, Garcia, Amauri, Spinelli, José Eduardo, Cheung, Noé
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Copper Directional solidification Electronics and Microelectronics Emerging Interconnection Technology Heat transfer Heat transfer coefficients Instrumentation Interconnect Interface reactions Intermetallic compounds Low carbon steels Materials Science Nickel Optical and Electronic Materials Pb-free Solder Soldering Solid State Physics Substrates Thermal conductivity Thermal contraction Tin base alloys TMS2019 Advanced Microelectronic Packaging TMS2019 Microelectronic Packaging Transient heat transfer Wettability Wetting Workpieces
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!