Study on the Length Distribution and the Growth Rate of Sn Whiskers Generated on Sn/Cu Plating System

In this study, the occurrence and growth behavior of many whiskers occurred on the Sn/Cu plating system was observed over a long period of more than 1 year. The growth behavior of whiskers was analyzed statistically and quantitatively using the whisker length distributions and their temporal change....

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Veröffentlicht in:	Journal of the Japan Institute of Metals and Materials 2019/08/01, Vol.83(8), pp.273-281
Hauptverfasser:	Sakamoto, Yoshinori, Tsuda, Kazuto, Yamazaki, Wataru, Shimura, Masaomi, Ishihara, Sotomi
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Approximation Copper Exponential functions focused ion beam Growth rate Parameters Probability distribution functions Tin tin plating tin-whisker Weibull distribution whisker length distribution
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