Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness
Grinding of brittle materials is characterized by a complex removal mechanism of both ductile and brittle removal. Therefore, the traditional force models, which are mainly targeted to metallic materials, cannot be fully applied to the force prediction of brittle materials. This paper will propose a...
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| Veröffentlicht in: | International journal of advanced manufacturing technology 2016-11, Vol.87 (5-8), p.1967-1975 |
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| container_end_page | 1975 |
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| container_issue | 5-8 |
| container_start_page | 1967 |
| container_title | International journal of advanced manufacturing technology |
| container_volume | 87 |
| creator | Wu, Chongjun Li, Beizhi Yang, Jianguo Liang, Steven Y. |
| description | Grinding of brittle materials is characterized by a complex removal mechanism of both ductile and brittle removal. Therefore, the traditional force models, which are mainly targeted to metallic materials, cannot be fully applied to the force prediction of brittle materials. This paper will propose a new grinding force model for brittle materials considering co-existing of ductile removal force and brittle removal force. The ductile removal force is mainly composed of rubbing force, ploughing force, and chipping force. However, the brittle removal force is more related to rubbing force and fracture chipping force. The proportional coefficient of ductile removal and crack size will be modeled through a series of experiments under different wheel speed and undeformed chip thickness. The working status for a single grit was separated based on the Hertz Theory and chip thickness modeling of Rayleigh probability density function. Grinding experiments have been undertaken by using a high speed diamond grinder on Silicon Carbide, and the results was compared to the force model predictions for validation. The predictive force model shows a reasonable agreement quantitatively with the experimental force data. |
| doi_str_mv | 10.1007/s00170-016-8594-4 |
| format | Article |
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Therefore, the traditional force models, which are mainly targeted to metallic materials, cannot be fully applied to the force prediction of brittle materials. This paper will propose a new grinding force model for brittle materials considering co-existing of ductile removal force and brittle removal force. The ductile removal force is mainly composed of rubbing force, ploughing force, and chipping force. However, the brittle removal force is more related to rubbing force and fracture chipping force. The proportional coefficient of ductile removal and crack size will be modeled through a series of experiments under different wheel speed and undeformed chip thickness. The working status for a single grit was separated based on the Hertz Theory and chip thickness modeling of Rayleigh probability density function. Grinding experiments have been undertaken by using a high speed diamond grinder on Silicon Carbide, and the results was compared to the force model predictions for validation. The predictive force model shows a reasonable agreement quantitatively with the experimental force data.</description><identifier>ISSN: 0268-3768</identifier><identifier>EISSN: 1433-3015</identifier><identifier>DOI: 10.1007/s00170-016-8594-4</identifier><language>eng</language><publisher>London: Springer London</publisher><subject>Brittle materials ; CAE) and Design ; Chipping ; Computer-Aided Engineering (CAD ; Diamonds ; Ductile fracture ; Ductile-brittle transition ; Engineering ; Grinding ; Industrial and Production Engineering ; Mechanical Engineering ; Media Management ; Original Article ; Predictions ; Probability density functions ; Rubbing ; Silicon carbide ; Thickness</subject><ispartof>International journal of advanced manufacturing technology, 2016-11, Vol.87 (5-8), p.1967-1975</ispartof><rights>Springer-Verlag London 2016</rights><rights>Copyright Springer Science & Business Media 2016</rights><rights>The International Journal of Advanced Manufacturing Technology is a copyright of Springer, (2016). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c344t-f976bb153a5b0462c0e7a1b101f08c37f2b3670c8d39ace3dc113fd06d3511ba3</citedby><cites>FETCH-LOGICAL-c344t-f976bb153a5b0462c0e7a1b101f08c37f2b3670c8d39ace3dc113fd06d3511ba3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s00170-016-8594-4$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s00170-016-8594-4$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Wu, Chongjun</creatorcontrib><creatorcontrib>Li, Beizhi</creatorcontrib><creatorcontrib>Yang, Jianguo</creatorcontrib><creatorcontrib>Liang, Steven Y.</creatorcontrib><title>Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness</title><title>International journal of advanced manufacturing technology</title><addtitle>Int J Adv Manuf Technol</addtitle><description>Grinding of brittle materials is characterized by a complex removal mechanism of both ductile and brittle removal. Therefore, the traditional force models, which are mainly targeted to metallic materials, cannot be fully applied to the force prediction of brittle materials. This paper will propose a new grinding force model for brittle materials considering co-existing of ductile removal force and brittle removal force. The ductile removal force is mainly composed of rubbing force, ploughing force, and chipping force. However, the brittle removal force is more related to rubbing force and fracture chipping force. The proportional coefficient of ductile removal and crack size will be modeled through a series of experiments under different wheel speed and undeformed chip thickness. The working status for a single grit was separated based on the Hertz Theory and chip thickness modeling of Rayleigh probability density function. Grinding experiments have been undertaken by using a high speed diamond grinder on Silicon Carbide, and the results was compared to the force model predictions for validation. The predictive force model shows a reasonable agreement quantitatively with the experimental force data.</description><subject>Brittle materials</subject><subject>CAE) and Design</subject><subject>Chipping</subject><subject>Computer-Aided Engineering (CAD</subject><subject>Diamonds</subject><subject>Ductile fracture</subject><subject>Ductile-brittle transition</subject><subject>Engineering</subject><subject>Grinding</subject><subject>Industrial and Production Engineering</subject><subject>Mechanical Engineering</subject><subject>Media Management</subject><subject>Original Article</subject><subject>Predictions</subject><subject>Probability density functions</subject><subject>Rubbing</subject><subject>Silicon carbide</subject><subject>Thickness</subject><issn>0268-3768</issn><issn>1433-3015</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNp9kE1LAzEQhoMoWD9-gLcFz9GZJJvNHqX4BQU96Dlkk2xJaXdrkoL992apghe9TCbwPu_AQ8gVwg0CNLcJABuggJKquhVUHJEZCs4pB6yPyQyYVJQ3Up2Ss5RWJS1RqhlZvkbvgs1hHKqxr5YxDC4My6ofo_XTrLoYcl77amOyj8GsU2XHIQVXPiVnR-o_Q8rTXni3K1XrkPeVGdwPOviULshJX1h_-f2ek_eH-7f5E128PD7P7xbUciEy7dtGdh3W3NQdCMks-MZgh4A9KMubnnVcNmCV462xnjuLyHsH0vEasTP8nFwferdx_Nj5lPVq3MWhnNSMScbrFhj-l0KlQAmpOCspPKRsHFOKvtfbGDYm7jWCnqzrg3VdZOrJuhaFYQcmbSc_Pv5q_hP6AnnPhXs</recordid><startdate>20161101</startdate><enddate>20161101</enddate><creator>Wu, Chongjun</creator><creator>Li, Beizhi</creator><creator>Yang, Jianguo</creator><creator>Liang, Steven Y.</creator><general>Springer London</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>L6V</scope><scope>M7S</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope></search><sort><creationdate>20161101</creationdate><title>Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness</title><author>Wu, Chongjun ; Li, Beizhi ; Yang, Jianguo ; Liang, Steven Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c344t-f976bb153a5b0462c0e7a1b101f08c37f2b3670c8d39ace3dc113fd06d3511ba3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Brittle materials</topic><topic>CAE) and Design</topic><topic>Chipping</topic><topic>Computer-Aided Engineering (CAD</topic><topic>Diamonds</topic><topic>Ductile fracture</topic><topic>Ductile-brittle transition</topic><topic>Engineering</topic><topic>Grinding</topic><topic>Industrial and Production Engineering</topic><topic>Mechanical Engineering</topic><topic>Media Management</topic><topic>Original Article</topic><topic>Predictions</topic><topic>Probability density functions</topic><topic>Rubbing</topic><topic>Silicon carbide</topic><topic>Thickness</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wu, Chongjun</creatorcontrib><creatorcontrib>Li, Beizhi</creatorcontrib><creatorcontrib>Yang, Jianguo</creatorcontrib><creatorcontrib>Liang, Steven Y.</creatorcontrib><collection>CrossRef</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><jtitle>International journal of advanced manufacturing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wu, Chongjun</au><au>Li, Beizhi</au><au>Yang, Jianguo</au><au>Liang, Steven Y.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness</atitle><jtitle>International journal of advanced manufacturing technology</jtitle><stitle>Int J Adv Manuf Technol</stitle><date>2016-11-01</date><risdate>2016</risdate><volume>87</volume><issue>5-8</issue><spage>1967</spage><epage>1975</epage><pages>1967-1975</pages><issn>0268-3768</issn><eissn>1433-3015</eissn><abstract>Grinding of brittle materials is characterized by a complex removal mechanism of both ductile and brittle removal. Therefore, the traditional force models, which are mainly targeted to metallic materials, cannot be fully applied to the force prediction of brittle materials. This paper will propose a new grinding force model for brittle materials considering co-existing of ductile removal force and brittle removal force. The ductile removal force is mainly composed of rubbing force, ploughing force, and chipping force. However, the brittle removal force is more related to rubbing force and fracture chipping force. The proportional coefficient of ductile removal and crack size will be modeled through a series of experiments under different wheel speed and undeformed chip thickness. The working status for a single grit was separated based on the Hertz Theory and chip thickness modeling of Rayleigh probability density function. Grinding experiments have been undertaken by using a high speed diamond grinder on Silicon Carbide, and the results was compared to the force model predictions for validation. The predictive force model shows a reasonable agreement quantitatively with the experimental force data.</abstract><cop>London</cop><pub>Springer London</pub><doi>10.1007/s00170-016-8594-4</doi><tpages>9</tpages></addata></record> |
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| subjects | Brittle materials CAE) and Design Chipping Computer-Aided Engineering (CAD Diamonds Ductile fracture Ductile-brittle transition Engineering Grinding Industrial and Production Engineering Mechanical Engineering Media Management Original Article Predictions Probability density functions Rubbing Silicon carbide Thickness |
| title | Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness |
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