Dielectric properties of silicon dioxide/wood composite
For a better understanding of the binding between silicon dioxide and wood as well as the dielectric properties of silicon dioxide/wood composite, dielectric relaxation was measured for untreated wood [Cunninghamia lanceolata (Lamb.) Hook] and for silicon dioxide/wood composite with different weight...
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| Veröffentlicht in: | Wood science and technology 2007-08, Vol.41 (6), p.511-522 |
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| creator | Fu, Yunlin Zhao, Guangjie |
| description | For a better understanding of the binding between silicon dioxide and wood as well as the dielectric properties of silicon dioxide/wood composite, dielectric relaxation was measured for untreated wood [Cunninghamia lanceolata (Lamb.) Hook] and for silicon dioxide/wood composite with different weight percentage gain (WPG). Cole-Cole's circular arc law, distribution spectrum of relaxation time and relation model were applied to the results of relaxation due to motions of the methylol groups. The results were as follows. The generalized relaxation time and ε s - ε [infinity] decreased with increasing WPG. The distribution spectrum of relaxation time decreased more and more and broadened with increasing WPG. The methylol group in the amorphous region of the wood cell wall participated in hydrolysis reaction and condensation reaction caused by tetraethylorthosilicate (TEOS), and there is a cross-link between silicon dioxide and wood. The value of apparent activation energy (ΔE) increased for silicon dioxide/wood composite, and increased with increasing WPG. Activation enthalpy (ΔH) and activation entropy (ΔS) increased, while activation free energy (ΔG) decreased with increasing WPG. The number of hydroxyl groups cut in dielectric relaxation increased with increasing WPG. |
| doi_str_mv | 10.1007/s00226-007-0137-6 |
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Hook] and for silicon dioxide/wood composite with different weight percentage gain (WPG). Cole-Cole's circular arc law, distribution spectrum of relaxation time and relation model were applied to the results of relaxation due to motions of the methylol groups. The results were as follows. The generalized relaxation time and ε s - ε [infinity] decreased with increasing WPG. The distribution spectrum of relaxation time decreased more and more and broadened with increasing WPG. The methylol group in the amorphous region of the wood cell wall participated in hydrolysis reaction and condensation reaction caused by tetraethylorthosilicate (TEOS), and there is a cross-link between silicon dioxide and wood. The value of apparent activation energy (ΔE) increased for silicon dioxide/wood composite, and increased with increasing WPG. Activation enthalpy (ΔH) and activation entropy (ΔS) increased, while activation free energy (ΔG) decreased with increasing WPG. The number of hydroxyl groups cut in dielectric relaxation increased with increasing WPG.</description><identifier>ISSN: 0043-7719</identifier><identifier>EISSN: 1432-5225</identifier><identifier>DOI: 10.1007/s00226-007-0137-6</identifier><language>eng</language><publisher>Heidelberg: Berlin/Heidelberg : Springer-Verlag</publisher><subject>Activation energy ; Cell walls ; Crosslinking ; Dielectric properties ; Dielectric relaxation ; Electrical properties ; Enthalpy ; Entropy ; Entropy of activation ; Free energy ; Hydroxyl groups ; Relaxation time ; Silica ; Silicon ; Silicon dioxide ; Wood ; Wood composites</subject><ispartof>Wood science and technology, 2007-08, Vol.41 (6), p.511-522</ispartof><rights>Wood Science and Technology is a copyright of Springer, (2007). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c297t-b9e23799b7591bad38fc661d7fbe8ba59db9452cf969ecaf7fbba951e71bc1fd3</citedby><cites>FETCH-LOGICAL-c297t-b9e23799b7591bad38fc661d7fbe8ba59db9452cf969ecaf7fbba951e71bc1fd3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,778,782,27911,27912</link.rule.ids></links><search><creatorcontrib>Fu, Yunlin</creatorcontrib><creatorcontrib>Zhao, Guangjie</creatorcontrib><title>Dielectric properties of silicon dioxide/wood composite</title><title>Wood science and technology</title><description>For a better understanding of the binding between silicon dioxide and wood as well as the dielectric properties of silicon dioxide/wood composite, dielectric relaxation was measured for untreated wood [Cunninghamia lanceolata (Lamb.) Hook] and for silicon dioxide/wood composite with different weight percentage gain (WPG). Cole-Cole's circular arc law, distribution spectrum of relaxation time and relation model were applied to the results of relaxation due to motions of the methylol groups. The results were as follows. The generalized relaxation time and ε s - ε [infinity] decreased with increasing WPG. The distribution spectrum of relaxation time decreased more and more and broadened with increasing WPG. The methylol group in the amorphous region of the wood cell wall participated in hydrolysis reaction and condensation reaction caused by tetraethylorthosilicate (TEOS), and there is a cross-link between silicon dioxide and wood. The value of apparent activation energy (ΔE) increased for silicon dioxide/wood composite, and increased with increasing WPG. Activation enthalpy (ΔH) and activation entropy (ΔS) increased, while activation free energy (ΔG) decreased with increasing WPG. The number of hydroxyl groups cut in dielectric relaxation increased with increasing WPG.</description><subject>Activation energy</subject><subject>Cell walls</subject><subject>Crosslinking</subject><subject>Dielectric properties</subject><subject>Dielectric relaxation</subject><subject>Electrical properties</subject><subject>Enthalpy</subject><subject>Entropy</subject><subject>Entropy of activation</subject><subject>Free energy</subject><subject>Hydroxyl groups</subject><subject>Relaxation time</subject><subject>Silica</subject><subject>Silicon</subject><subject>Silicon dioxide</subject><subject>Wood</subject><subject>Wood composites</subject><issn>0043-7719</issn><issn>1432-5225</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNotUMtOwzAQtBBIhMIHcCISZ1OvncTxEZWnVIkD9Gz5iVy1dbBTAX-Po3Da0e7M7s4gdA3kDgjhy0wIpR0uEBNgHHcnqIKGUdxS2p6iipCGYc5BnKOLnLeEAOdNXyH-ENzOmTEFUw8pDi6NweU6-jqHXTDxUNsQf4J1y-8YbW3ifog5jO4SnXm1y-7qvy7Q5unxY_WC12_Pr6v7NTZU8BFr4SjjQmjeCtDKst6brgPLvXa9Vq2wWjQtNV50whnlS18r0YLjoA14yxbodt5bnvs6ujzKbTymQzkpi18KrLjtCwtmlkkx5-S8HFLYq_QrgcgpHznnIyc45SO7ormZNV5FqT5TyHLzTsuwcERDesL-AO4zYjk</recordid><startdate>20070801</startdate><enddate>20070801</enddate><creator>Fu, Yunlin</creator><creator>Zhao, Guangjie</creator><general>Berlin/Heidelberg : Springer-Verlag</general><general>Springer Nature B.V</general><scope>FBQ</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AEUYN</scope><scope>AFKRA</scope><scope>ATCPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>BHPHI</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>PATMY</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PYCSY</scope></search><sort><creationdate>20070801</creationdate><title>Dielectric properties of silicon dioxide/wood composite</title><author>Fu, Yunlin ; Zhao, Guangjie</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c297t-b9e23799b7591bad38fc661d7fbe8ba59db9452cf969ecaf7fbba951e71bc1fd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Activation energy</topic><topic>Cell walls</topic><topic>Crosslinking</topic><topic>Dielectric properties</topic><topic>Dielectric relaxation</topic><topic>Electrical properties</topic><topic>Enthalpy</topic><topic>Entropy</topic><topic>Entropy of activation</topic><topic>Free energy</topic><topic>Hydroxyl groups</topic><topic>Relaxation time</topic><topic>Silica</topic><topic>Silicon</topic><topic>Silicon dioxide</topic><topic>Wood</topic><topic>Wood composites</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fu, Yunlin</creatorcontrib><creatorcontrib>Zhao, Guangjie</creatorcontrib><collection>AGRIS</collection><collection>CrossRef</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest One Sustainability</collection><collection>ProQuest Central UK/Ireland</collection><collection>Agricultural & Environmental Science Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>Natural Science Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>Environmental Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Environmental Science Collection</collection><jtitle>Wood science and technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fu, Yunlin</au><au>Zhao, Guangjie</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Dielectric properties of silicon dioxide/wood composite</atitle><jtitle>Wood science and technology</jtitle><date>2007-08-01</date><risdate>2007</risdate><volume>41</volume><issue>6</issue><spage>511</spage><epage>522</epage><pages>511-522</pages><issn>0043-7719</issn><eissn>1432-5225</eissn><abstract>For a better understanding of the binding between silicon dioxide and wood as well as the dielectric properties of silicon dioxide/wood composite, dielectric relaxation was measured for untreated wood [Cunninghamia lanceolata (Lamb.) Hook] and for silicon dioxide/wood composite with different weight percentage gain (WPG). Cole-Cole's circular arc law, distribution spectrum of relaxation time and relation model were applied to the results of relaxation due to motions of the methylol groups. The results were as follows. The generalized relaxation time and ε s - ε [infinity] decreased with increasing WPG. The distribution spectrum of relaxation time decreased more and more and broadened with increasing WPG. The methylol group in the amorphous region of the wood cell wall participated in hydrolysis reaction and condensation reaction caused by tetraethylorthosilicate (TEOS), and there is a cross-link between silicon dioxide and wood. The value of apparent activation energy (ΔE) increased for silicon dioxide/wood composite, and increased with increasing WPG. Activation enthalpy (ΔH) and activation entropy (ΔS) increased, while activation free energy (ΔG) decreased with increasing WPG. The number of hydroxyl groups cut in dielectric relaxation increased with increasing WPG.</abstract><cop>Heidelberg</cop><pub>Berlin/Heidelberg : Springer-Verlag</pub><doi>10.1007/s00226-007-0137-6</doi><tpages>12</tpages></addata></record> |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Activation energy Cell walls Crosslinking Dielectric properties Dielectric relaxation Electrical properties Enthalpy Entropy Entropy of activation Free energy Hydroxyl groups Relaxation time Silica Silicon Silicon dioxide Wood Wood composites |
| title | Dielectric properties of silicon dioxide/wood composite |
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