Basal Plane Dislocation Conversion Enhancement in 4H-SiC Homo-Epitaxial Layers by Ion Implantation into the Wafer

We studied the impact of ion implantation into the wafer substrate prior to the epitaxy process on the basal plane dislocation conversion behavior during epitaxial layer growth. Defect density measurements show an enhancing effect of the ion implantation on the basal plane dislocation to threading e...

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Veröffentlicht in:Materials science forum 2019-07, Vol.963, p.114-118
Hauptverfasser: Esteve, Romain, Heidorn, Christian, Höchbauer, Tobias, Krieger, Michael, Rupp, Roland, Weber, Heiko B.
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creator Esteve, Romain
Heidorn, Christian
Höchbauer, Tobias
Krieger, Michael
Rupp, Roland
Weber, Heiko B.
description We studied the impact of ion implantation into the wafer substrate prior to the epitaxy process on the basal plane dislocation conversion behavior during epitaxial layer growth. Defect density measurements show an enhancing effect of the ion implantation on the basal plane dislocation to threading edge dislocation conversion. Analysis of the lateral conversion distribution, the stress field in the material as well as the wafer topography at the onset of epitaxial growth lead us to believe, that stresses in the epitaxy layer cause the enhanced basal plane dislocation conversion.
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subjects Basal plane
Conversion
Crystals
Dislocation density
Edge dislocations
Epitaxial growth
Epitaxial layers
Ion implantation
Magnetism
Stress concentration
Stress distribution
Substrates
title Basal Plane Dislocation Conversion Enhancement in 4H-SiC Homo-Epitaxial Layers by Ion Implantation into the Wafer
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