Higher-Order Lithography: Double-Deprotected Chemically Amplified Photoresists (DD-CAMP)
The synthesis and lithographic evaluation of 193-nm and EUV photoresists that utilize a higher-order reaction mechanism of deprotection is presented. Unique polymers utilize novel blocking groups that require two acid-catalyzed steps to be removed. When these steps occur with comparable reaction rat...
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Veröffentlicht in: | Journal of Photopolymer Science and Technology 2017/06/26, Vol.30(3), pp.351-359 |
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container_title | Journal of Photopolymer Science and Technology |
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creator | Soucie, Deanna Earley, William Hosoi, Kenji Takahashi, Arata Aoki, Takashi Cardineau, Brian Miyauchi, Koichi Brainard, Robert |
description | The synthesis and lithographic evaluation of 193-nm and EUV photoresists that utilize a higher-order reaction mechanism of deprotection is presented. Unique polymers utilize novel blocking groups that require two acid-catalyzed steps to be removed. When these steps occur with comparable reaction rates, the overall reaction should be higher order (≤ 1.85). The LWR of these resists is plotted against PEB time for a variety of compounds to acquire insight into the effectiveness of the proposed higher-order mechanisms. Evidence acquired during testing of these novel photoresist materials supports the conclusion that higher-order reaction kinetics leads to improved LWR vs. control resists. |
doi_str_mv | 10.2494/photopolymer.30.351 |
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Unique polymers utilize novel blocking groups that require two acid-catalyzed steps to be removed. When these steps occur with comparable reaction rates, the overall reaction should be higher order (≤ 1.85). The LWR of these resists is plotted against PEB time for a variety of compounds to acquire insight into the effectiveness of the proposed higher-order mechanisms. Evidence acquired during testing of these novel photoresist materials supports the conclusion that higher-order reaction kinetics leads to improved LWR vs. control resists.</description><identifier>ISSN: 0914-9244</identifier><identifier>EISSN: 1349-6336</identifier><identifier>DOI: 10.2494/photopolymer.30.351</identifier><language>eng</language><publisher>Hiratsuka: The Society of Photopolymer Science and Technology(SPST)</publisher><subject>193 nm ; DD-CAMP ; EUV ; Higher order ; Kinetics ; Organic chemistry ; Photoresist ; Photoresists ; Reaction kinetics ; Reaction mechanisms ; Resists</subject><ispartof>Journal of Photopolymer Science and Technology, 2017/06/26, Vol.30(3), pp.351-359</ispartof><rights>2017 The Society of Photopolymer Science and Technology (SPST)</rights><rights>Copyright Japan Science and Technology Agency 2017</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c522t-f7689e5a1281447f119e3faa8f9dd42da9c39cef063094c37248f9aa8e956b273</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1883,27924,27925</link.rule.ids></links><search><creatorcontrib>Soucie, Deanna</creatorcontrib><creatorcontrib>Earley, William</creatorcontrib><creatorcontrib>Hosoi, Kenji</creatorcontrib><creatorcontrib>Takahashi, Arata</creatorcontrib><creatorcontrib>Aoki, Takashi</creatorcontrib><creatorcontrib>Cardineau, Brian</creatorcontrib><creatorcontrib>Miyauchi, Koichi</creatorcontrib><creatorcontrib>Brainard, Robert</creatorcontrib><title>Higher-Order Lithography: Double-Deprotected Chemically Amplified Photoresists (DD-CAMP)</title><title>Journal of Photopolymer Science and Technology</title><addtitle>J. Photopol. Sci. Technol.</addtitle><description>The synthesis and lithographic evaluation of 193-nm and EUV photoresists that utilize a higher-order reaction mechanism of deprotection is presented. Unique polymers utilize novel blocking groups that require two acid-catalyzed steps to be removed. When these steps occur with comparable reaction rates, the overall reaction should be higher order (≤ 1.85). The LWR of these resists is plotted against PEB time for a variety of compounds to acquire insight into the effectiveness of the proposed higher-order mechanisms. Evidence acquired during testing of these novel photoresist materials supports the conclusion that higher-order reaction kinetics leads to improved LWR vs. control resists.</description><subject>193 nm</subject><subject>DD-CAMP</subject><subject>EUV</subject><subject>Higher order</subject><subject>Kinetics</subject><subject>Organic chemistry</subject><subject>Photoresist</subject><subject>Photoresists</subject><subject>Reaction kinetics</subject><subject>Reaction mechanisms</subject><subject>Resists</subject><issn>0914-9244</issn><issn>1349-6336</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNplkEFLw0AQhRdRsFZ_gZeAFz2k7u5skq630lgrVNqDgrdlu5k0KUkTd7eH_HtTWorgaWDe--YNj5B7RkdcSPHcFo1v2qbqarQjoCOI2AUZMBAyjAHiSzKgkolQciGuyY1zW0oBokgOyPe83BRow6XN0AaL0hfNxuq26F6CtNmvKwxTbG3j0XjMgmmBdWl0VXXBpG6rMi_75eoQbtGVzrvgMU3D6eRj9XRLrnJdObw7zSH5mr1-TufhYvn2Pp0sQhNx7sM8iccSI834mAmR5IxJhFzrcS6zTPBMSwPSYE5joFIYSLjopV5HGcVrnsCQPBzv9l_-7NF5tW32dtdHKs6BxxTiSPQuOLqMbZyzmKvWlrW2nWJUHSpUfytUQFVfYU_NjtTWeb3BM6OtL02F_5kTeDaYQluFO_gFLrWChQ</recordid><startdate>20170101</startdate><enddate>20170101</enddate><creator>Soucie, Deanna</creator><creator>Earley, William</creator><creator>Hosoi, Kenji</creator><creator>Takahashi, Arata</creator><creator>Aoki, Takashi</creator><creator>Cardineau, Brian</creator><creator>Miyauchi, Koichi</creator><creator>Brainard, Robert</creator><general>The Society of Photopolymer Science and Technology(SPST)</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20170101</creationdate><title>Higher-Order Lithography: Double-Deprotected Chemically Amplified Photoresists (DD-CAMP)</title><author>Soucie, Deanna ; Earley, William ; Hosoi, Kenji ; Takahashi, Arata ; Aoki, Takashi ; Cardineau, Brian ; Miyauchi, Koichi ; Brainard, Robert</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c522t-f7689e5a1281447f119e3faa8f9dd42da9c39cef063094c37248f9aa8e956b273</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>193 nm</topic><topic>DD-CAMP</topic><topic>EUV</topic><topic>Higher order</topic><topic>Kinetics</topic><topic>Organic chemistry</topic><topic>Photoresist</topic><topic>Photoresists</topic><topic>Reaction kinetics</topic><topic>Reaction mechanisms</topic><topic>Resists</topic><toplevel>online_resources</toplevel><creatorcontrib>Soucie, Deanna</creatorcontrib><creatorcontrib>Earley, William</creatorcontrib><creatorcontrib>Hosoi, Kenji</creatorcontrib><creatorcontrib>Takahashi, Arata</creatorcontrib><creatorcontrib>Aoki, Takashi</creatorcontrib><creatorcontrib>Cardineau, Brian</creatorcontrib><creatorcontrib>Miyauchi, Koichi</creatorcontrib><creatorcontrib>Brainard, Robert</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of Photopolymer Science and Technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Soucie, Deanna</au><au>Earley, William</au><au>Hosoi, Kenji</au><au>Takahashi, Arata</au><au>Aoki, Takashi</au><au>Cardineau, Brian</au><au>Miyauchi, Koichi</au><au>Brainard, Robert</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Higher-Order Lithography: Double-Deprotected Chemically Amplified Photoresists (DD-CAMP)</atitle><jtitle>Journal of Photopolymer Science and Technology</jtitle><addtitle>J. Photopol. Sci. Technol.</addtitle><date>2017-01-01</date><risdate>2017</risdate><volume>30</volume><issue>3</issue><spage>351</spage><epage>359</epage><pages>351-359</pages><issn>0914-9244</issn><eissn>1349-6336</eissn><abstract>The synthesis and lithographic evaluation of 193-nm and EUV photoresists that utilize a higher-order reaction mechanism of deprotection is presented. Unique polymers utilize novel blocking groups that require two acid-catalyzed steps to be removed. When these steps occur with comparable reaction rates, the overall reaction should be higher order (≤ 1.85). The LWR of these resists is plotted against PEB time for a variety of compounds to acquire insight into the effectiveness of the proposed higher-order mechanisms. 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source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; Free Full-Text Journals in Chemistry |
subjects | 193 nm DD-CAMP EUV Higher order Kinetics Organic chemistry Photoresist Photoresists Reaction kinetics Reaction mechanisms Resists |
title | Higher-Order Lithography: Double-Deprotected Chemically Amplified Photoresists (DD-CAMP) |
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