Redistribution Layer Preparation on Glass Panel for Panel Level Fan Out Package by Photosensitive Polyimide

We successfully developed redistribution structure by using photosensitive polyimide and all wet Cu plating processes. To obtain the structure, patterned Cu was obtained by non-electrical plating on photosensitive polyimide layer with a mask of photo-resist. Various types of surface treatments on po...

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Veröffentlicht in:	Journal of Photopolymer Science and Technology 2018/06/25, Vol.31(5), pp.629-632
Hauptverfasser:	Masuda, Yuki, Hashimoto, Keika, Shoji, Yu, Koyama, Yutaro, Tomikawa, Masao
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion Cu plating Glass Photosensitive polyimide Photosensitivity Plating Redistribution layer Surface treatment
Online-Zugang:	Volltext
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