Low Temperature Curable Polyimide for Advanced Package

Advanced packaging technology requires low temperature curable and low residual stress material as dielectric layer. We developed appropriate product based on our previous study and so on. As a result, we used polyimide structure with acidity control of amine unit techniques for polymer and additive...

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Veröffentlicht in:	Journal of Photopolymer Science and Technology 2016/06/21, Vol.29(3), pp.379-382
1. Verfasser:	Sasaki, Takahiro
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion tests low residual stress Low temperature low temperature curable pH control photosensitive polyimide Residual stress
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	Advanced packaging technology requires low temperature curable and low residual stress material as dielectric layer. We developed appropriate product based on our previous study and so on. As a result, we used polyimide structure with acidity control of amine unit techniques for polymer and additive A for copper adhesive. And we also evaluated the product regarding various items.
ISSN:	0914-9244 1349-6336
DOI:	10.2494/photopolymer.29.379