Microstructure and its subsequent evolution of Sn37Pb/Cu column interconnect obtained by friction plunge welding

•Micro-join can also be achieved by friction plunge welding.•Column planting of CuCGA was transformed into a solid-state welding without mold.•A thin, wave-like Sn/Cu diffusion layer formed on solder/Cu column interface.•Grain breakage, plastic flow and dynamic recrystallization occurred in solder z...

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Veröffentlicht in:	Materials letters 2019-08, Vol.248, p.204-206
Hauptverfasser:	Zhao, Zhili, Bai, Yuhui, Song, Lairui, Xiao, Kai, Wang, Di
Format:	Artikel
Sprache:	eng
Schlagworte:	Column planting Copper Diffusion layers Dynamic recrystallization Extrusion molding Friction plunge welding Friction welding Homology Interface Lead Materials science Micro-join Microstructure Phases Planting Pressure welding Reflow soldering Tin α-Pb phase
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