Metallographic Analysis during Multilayer Printed Circuit Board Production Quality Assurance with Interlayer Connections Composed of Radio-Electronic Systems

Metallographic Analysis during Multilayer Printed Circuit Board Production Quality Assurance with Interlayer Connections Composed of Radio-Electronic Systems

The current state of the high-tech radio-electronic industry, including special and dual-purpose products, is considered. The main causes of space electronics failures are revealed. The estimation of modern manufacturing technical requirements for printed circuit boards is given as one of the main r...

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Veröffentlicht in:Journal of communications technology & electronics 2019-02, Vol.64 (2), p.182-185
Hauptverfasser: Vorunichev, D. S., Zasovin, E. A.
Format: Artikel
Sprache:eng
Schlagworte:
Circuit boards
Communications Engineering
Electronic systems
Engineering
Interlayers
Multilayers
Networks
Novel Radio Systems and Elements
Printed circuit boards
Printed circuits
Quality assurance
Quality control
Radio
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container_title Journal of communications technology & electronics
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creator Vorunichev, D. S.
Zasovin, E. A.
description The current state of the high-tech radio-electronic industry, including special and dual-purpose products, is considered. The main causes of space electronics failures are revealed. The estimation of modern manufacturing technical requirements for printed circuit boards is given as one of the main reasons for failure. The combined method of defect study and production quality assurance of multilayer printed circuit boards with interlayer connections composed of complex radio-electronic systems is proposed.
doi_str_mv 10.1134/S1064226919020207
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source Springer Nature - Complete Springer Journals
subjects Circuit boards
Communications Engineering
Electronic systems
Engineering
Interlayers
Multilayers
Networks
Novel Radio Systems and Elements
Printed circuit boards
Printed circuits
Quality assurance
Quality control
Radio
title Metallographic Analysis during Multilayer Printed Circuit Board Production Quality Assurance with Interlayer Connections Composed of Radio-Electronic Systems
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