Removing Heat from Si with a “Thermal Circuit”: An Ab‐Initio Study

Electronic devices generate unwanted heat. The removal of this heat often involves a layer of a high‐thermal‐conductivity material X deposited at a strategic location on the Si chip. The layer is then cooled using a mechanical fan or more sophisticated means. The authors present here the results of...

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Veröffentlicht in:	Physica status solidi. A, Applications and materials science Applications and materials science, 2019-05, Vol.216 (10), p.n/a
Hauptverfasser:	Estreicher, Stefan K., Vincent, Trey M., Stanley, Christopher M.
Format:	Artikel
Sprache:	eng
Schlagworte:	ab‐initio molecular dynamics Cooling rate Coupling (molecular) Decay Electronic devices Germanium heat flow interfaces lattice thermal transport Silicon Wire
Online-Zugang:	Volltext
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