Effects of Thermal Cycling on Creep of SnAgCu Solder Joints

The long-term life of properly optimized high-end microelectronics assemblies is commonly limited by fatigue of the solder joints. The most credible assessments of this rely on modeling-based extrapolation and generalization of accelerated test results. As the validity of extrapolations to long-term...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2019-05, Vol.9 (5), p.888-894
Hauptverfasser:	Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., Borgesen, P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Accelerated tests Constitutive relations Constitutive relationships Creep Deformation effects Dislocations Finite element method Mathematical models Modelling Predictions solder Soldered joints Soldering Strain Stress Stress relaxation Temperature measurement Thermal cycling Thermal stresses Tin base alloys tin–silver–copper (SnAgCu)
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