Preparation of Irregular Silica Nanoparticles by the Polymer Templating for Chemical Mechanical Polishing of Sapphire Substrates

Irregular silica nanoparticles were prepared through polymer templating and their application on chemical mechanical polishing (CMP) of sapphire substrates was performed. Irregular silica nanoparticles were obtained by the chain structure of PEG200 and many oxygen functional groups. Silica seed part...

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Veröffentlicht in:	Journal of electronic materials 2019-07, Vol.48 (7), p.4598-4606
Hauptverfasser:	Dong, Yue, Lei, Hong, Chen, Yi, Liu, Wenqing, Xu, Lei, Wang, Tianxian, Dai, Sanwei
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemical reactions Chemical-mechanical polishing Chemistry and Materials Science Electronics and Microelectronics Energy dispersive X ray spectroscopy Functional groups Hydrogen bonding Instrumentation Material removal rate (machining) Materials Science Nanoparticles Optical and Electronic Materials Organic chemistry Photoelectrons Polymers Sapphire Silicon dioxide Solid State Physics Spectrum analysis Substrates Surface roughness
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