Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology

Encouraged by the increasing requirements of intelligent equipment, silicon integrated circuit–compatible photodetectors that support single‐chip photonic–electronic systems have gained considerable progresses. Advanced materials have resulted in enhanced device performance based on traditional phot...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Advanced functional materials 2019-05, Vol.29 (18), p.n/a
Hauptverfasser: Yang, Wei, Chen, Jiaxin, Zhang, Yong, Zhang, Yujia, He, Jr‐Hau, Fang, Xiaosheng
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page n/a
container_issue 18
container_start_page
container_title Advanced functional materials
container_volume 29
creator Yang, Wei
Chen, Jiaxin
Zhang, Yong
Zhang, Yujia
He, Jr‐Hau
Fang, Xiaosheng
description Encouraged by the increasing requirements of intelligent equipment, silicon integrated circuit–compatible photodetectors that support single‐chip photonic–electronic systems have gained considerable progresses. Advanced materials have resulted in enhanced device performance based on traditional photovoltaic effect and photoconductive effect, and novel device designs have catalyzed new working mechanisms combing rapid photoresponse and high responsivity gain. Surprising applications are developed using monolithic photonic–electronic platforms, and the developing integration strategies keep pace with the developing complementary metal‐oxide‐semiconductor techniques as well as nonsilicon substrates. Here, the recent developments in silicon‐compatible photodetectors, both in device advances and their integration routes, are reviewed. Meanwhile, the progresses, challenges, and possible future directions in this field are discussed and concluded. Single‐chip photonic–electronic systems have catalyzed plenty of surprising applications, where silicon‐compatible photodetectors play an important role. Here, the recent advances in silicon‐compatible photodetectors as well as the integration strategies with electronic components are reviewed. Massive important progresses are achieved and potential future directions are discussed to develop the next‐generation monolithic photonic–electronic platforms.
doi_str_mv 10.1002/adfm.201808182
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2218101669</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2218101669</sourcerecordid><originalsourceid>FETCH-LOGICAL-c3172-328cdc4b22391a787bf9d9bceeb7fc24d182c79f5b215e90a2d31e38b4eb5e773</originalsourceid><addsrcrecordid>eNqFkE1Lw0AQhhdRsFavnhc8p-5s0nx4K9FqoUXBCt6WZDNptqTZuLtScvMn-Bv9Jaa01KOnmcPzzPC-hFwDGwFj_DYrys2IM4hZDDE_IQMIIfR8xuPT4w7v5-TC2jVjEEV-MCDqVdVK6ubn6zvVmzZzKq-RvlTa6QIdSqeNvaNLg01hqdN0oRtdK1cpmdV1R2eNw5XJ3EGx2NheoNueoGmlWrpEWfWGXnWX5KzMaotXhzkkb9OHZfrkzZ8fZ-lk7kkfIu75PJaFDHLO_QSyKI7yMimSXCLmUSl5UPTZZJSU45zDGBOW8cIH9OM8wHyMfaghudnfbY3--ETrxFp_mqZ_KTiHGBiEYdJToz0ljbbWYClaozaZ6QQwsatT7OoUxzp7IdkLW1Vj9w8tJvfTxZ_7CyvafL0</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2218101669</pqid></control><display><type>article</type><title>Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Yang, Wei ; Chen, Jiaxin ; Zhang, Yong ; Zhang, Yujia ; He, Jr‐Hau ; Fang, Xiaosheng</creator><creatorcontrib>Yang, Wei ; Chen, Jiaxin ; Zhang, Yong ; Zhang, Yujia ; He, Jr‐Hau ; Fang, Xiaosheng</creatorcontrib><description>Encouraged by the increasing requirements of intelligent equipment, silicon integrated circuit–compatible photodetectors that support single‐chip photonic–electronic systems have gained considerable progresses. Advanced materials have resulted in enhanced device performance based on traditional photovoltaic effect and photoconductive effect, and novel device designs have catalyzed new working mechanisms combing rapid photoresponse and high responsivity gain. Surprising applications are developed using monolithic photonic–electronic platforms, and the developing integration strategies keep pace with the developing complementary metal‐oxide‐semiconductor techniques as well as nonsilicon substrates. Here, the recent developments in silicon‐compatible photodetectors, both in device advances and their integration routes, are reviewed. Meanwhile, the progresses, challenges, and possible future directions in this field are discussed and concluded. Single‐chip photonic–electronic systems have catalyzed plenty of surprising applications, where silicon‐compatible photodetectors play an important role. Here, the recent advances in silicon‐compatible photodetectors as well as the integration strategies with electronic components are reviewed. Massive important progresses are achieved and potential future directions are discussed to develop the next‐generation monolithic photonic–electronic platforms.</description><identifier>ISSN: 1616-301X</identifier><identifier>EISSN: 1616-3028</identifier><identifier>DOI: 10.1002/adfm.201808182</identifier><language>eng</language><publisher>Hoboken: Wiley Subscription Services, Inc</publisher><subject>Compatibility ; Electronic systems ; Integrated circuits ; integration ; Materials science ; photodetector ; Photometers ; Photonics ; photonic–electronic ; Photovoltaic effect ; Semiconductors ; Silicon substrates ; silicon‐compatible</subject><ispartof>Advanced functional materials, 2019-05, Vol.29 (18), p.n/a</ispartof><rights>2019 WILEY‐VCH Verlag GmbH &amp; Co. KGaA, Weinheim</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3172-328cdc4b22391a787bf9d9bceeb7fc24d182c79f5b215e90a2d31e38b4eb5e773</citedby><cites>FETCH-LOGICAL-c3172-328cdc4b22391a787bf9d9bceeb7fc24d182c79f5b215e90a2d31e38b4eb5e773</cites><orcidid>0000-0003-3387-4532</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fadfm.201808182$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fadfm.201808182$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,777,781,1412,27905,27906,45555,45556</link.rule.ids></links><search><creatorcontrib>Yang, Wei</creatorcontrib><creatorcontrib>Chen, Jiaxin</creatorcontrib><creatorcontrib>Zhang, Yong</creatorcontrib><creatorcontrib>Zhang, Yujia</creatorcontrib><creatorcontrib>He, Jr‐Hau</creatorcontrib><creatorcontrib>Fang, Xiaosheng</creatorcontrib><title>Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology</title><title>Advanced functional materials</title><description>Encouraged by the increasing requirements of intelligent equipment, silicon integrated circuit–compatible photodetectors that support single‐chip photonic–electronic systems have gained considerable progresses. Advanced materials have resulted in enhanced device performance based on traditional photovoltaic effect and photoconductive effect, and novel device designs have catalyzed new working mechanisms combing rapid photoresponse and high responsivity gain. Surprising applications are developed using monolithic photonic–electronic platforms, and the developing integration strategies keep pace with the developing complementary metal‐oxide‐semiconductor techniques as well as nonsilicon substrates. Here, the recent developments in silicon‐compatible photodetectors, both in device advances and their integration routes, are reviewed. Meanwhile, the progresses, challenges, and possible future directions in this field are discussed and concluded. Single‐chip photonic–electronic systems have catalyzed plenty of surprising applications, where silicon‐compatible photodetectors play an important role. Here, the recent advances in silicon‐compatible photodetectors as well as the integration strategies with electronic components are reviewed. Massive important progresses are achieved and potential future directions are discussed to develop the next‐generation monolithic photonic–electronic platforms.</description><subject>Compatibility</subject><subject>Electronic systems</subject><subject>Integrated circuits</subject><subject>integration</subject><subject>Materials science</subject><subject>photodetector</subject><subject>Photometers</subject><subject>Photonics</subject><subject>photonic–electronic</subject><subject>Photovoltaic effect</subject><subject>Semiconductors</subject><subject>Silicon substrates</subject><subject>silicon‐compatible</subject><issn>1616-301X</issn><issn>1616-3028</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNqFkE1Lw0AQhhdRsFavnhc8p-5s0nx4K9FqoUXBCt6WZDNptqTZuLtScvMn-Bv9Jaa01KOnmcPzzPC-hFwDGwFj_DYrys2IM4hZDDE_IQMIIfR8xuPT4w7v5-TC2jVjEEV-MCDqVdVK6ubn6zvVmzZzKq-RvlTa6QIdSqeNvaNLg01hqdN0oRtdK1cpmdV1R2eNw5XJ3EGx2NheoNueoGmlWrpEWfWGXnWX5KzMaotXhzkkb9OHZfrkzZ8fZ-lk7kkfIu75PJaFDHLO_QSyKI7yMimSXCLmUSl5UPTZZJSU45zDGBOW8cIH9OM8wHyMfaghudnfbY3--ETrxFp_mqZ_KTiHGBiEYdJToz0ljbbWYClaozaZ6QQwsatT7OoUxzp7IdkLW1Vj9w8tJvfTxZ_7CyvafL0</recordid><startdate>20190502</startdate><enddate>20190502</enddate><creator>Yang, Wei</creator><creator>Chen, Jiaxin</creator><creator>Zhang, Yong</creator><creator>Zhang, Yujia</creator><creator>He, Jr‐Hau</creator><creator>Fang, Xiaosheng</creator><general>Wiley Subscription Services, Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-3387-4532</orcidid></search><sort><creationdate>20190502</creationdate><title>Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology</title><author>Yang, Wei ; Chen, Jiaxin ; Zhang, Yong ; Zhang, Yujia ; He, Jr‐Hau ; Fang, Xiaosheng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3172-328cdc4b22391a787bf9d9bceeb7fc24d182c79f5b215e90a2d31e38b4eb5e773</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Compatibility</topic><topic>Electronic systems</topic><topic>Integrated circuits</topic><topic>integration</topic><topic>Materials science</topic><topic>photodetector</topic><topic>Photometers</topic><topic>Photonics</topic><topic>photonic–electronic</topic><topic>Photovoltaic effect</topic><topic>Semiconductors</topic><topic>Silicon substrates</topic><topic>silicon‐compatible</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yang, Wei</creatorcontrib><creatorcontrib>Chen, Jiaxin</creatorcontrib><creatorcontrib>Zhang, Yong</creatorcontrib><creatorcontrib>Zhang, Yujia</creatorcontrib><creatorcontrib>He, Jr‐Hau</creatorcontrib><creatorcontrib>Fang, Xiaosheng</creatorcontrib><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Advanced functional materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yang, Wei</au><au>Chen, Jiaxin</au><au>Zhang, Yong</au><au>Zhang, Yujia</au><au>He, Jr‐Hau</au><au>Fang, Xiaosheng</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology</atitle><jtitle>Advanced functional materials</jtitle><date>2019-05-02</date><risdate>2019</risdate><volume>29</volume><issue>18</issue><epage>n/a</epage><issn>1616-301X</issn><eissn>1616-3028</eissn><abstract>Encouraged by the increasing requirements of intelligent equipment, silicon integrated circuit–compatible photodetectors that support single‐chip photonic–electronic systems have gained considerable progresses. Advanced materials have resulted in enhanced device performance based on traditional photovoltaic effect and photoconductive effect, and novel device designs have catalyzed new working mechanisms combing rapid photoresponse and high responsivity gain. Surprising applications are developed using monolithic photonic–electronic platforms, and the developing integration strategies keep pace with the developing complementary metal‐oxide‐semiconductor techniques as well as nonsilicon substrates. Here, the recent developments in silicon‐compatible photodetectors, both in device advances and their integration routes, are reviewed. Meanwhile, the progresses, challenges, and possible future directions in this field are discussed and concluded. Single‐chip photonic–electronic systems have catalyzed plenty of surprising applications, where silicon‐compatible photodetectors play an important role. Here, the recent advances in silicon‐compatible photodetectors as well as the integration strategies with electronic components are reviewed. Massive important progresses are achieved and potential future directions are discussed to develop the next‐generation monolithic photonic–electronic platforms.</abstract><cop>Hoboken</cop><pub>Wiley Subscription Services, Inc</pub><doi>10.1002/adfm.201808182</doi><tpages>17</tpages><orcidid>https://orcid.org/0000-0003-3387-4532</orcidid></addata></record>
fulltext fulltext
identifier ISSN: 1616-301X
ispartof Advanced functional materials, 2019-05, Vol.29 (18), p.n/a
issn 1616-301X
1616-3028
language eng
recordid cdi_proquest_journals_2218101669
source Wiley Online Library Journals Frontfile Complete
subjects Compatibility
Electronic systems
Integrated circuits
integration
Materials science
photodetector
Photometers
Photonics
photonic–electronic
Photovoltaic effect
Semiconductors
Silicon substrates
silicon‐compatible
title Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T22%3A43%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Silicon%E2%80%90Compatible%20Photodetectors:%20Trends%20to%20Monolithically%20Integrate%20Photosensors%20with%20Chip%20Technology&rft.jtitle=Advanced%20functional%20materials&rft.au=Yang,%20Wei&rft.date=2019-05-02&rft.volume=29&rft.issue=18&rft.epage=n/a&rft.issn=1616-301X&rft.eissn=1616-3028&rft_id=info:doi/10.1002/adfm.201808182&rft_dat=%3Cproquest_cross%3E2218101669%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2218101669&rft_id=info:pmid/&rfr_iscdi=true