The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders
The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% an...
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| Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2019-03, Vol.750, p.117-124 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
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