The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders
The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% an...
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| Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2019-03, Vol.750, p.117-124 |
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| container_title | Materials science & engineering. A, Structural materials : properties, microstructure and processing |
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| creator | Guo, Wei-Ting Liang, Chien-Lung Lin, Kwang-Lung |
| description | The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% and 144.0% increments, respectively. These mechanical property variations were attributed to the combined effects of grain refining strengthening of the primary η-Zn phases, precipitation strengthening of the fine ε-CuZn5 compounds in the η-Zn matrix (Cu content greater than 0.3 wt%), and solid-solution strengthening of the Cu inclusion in the η-Zn matrix. The granular two-phase (η-Zn + ε-CuZn5) microstructure, composed of refined η-Zn matrix and fine ε-CuZn5 precipitations, contributed to superior mechanical strength of the Zn-25Sn-xCu high temperature Pb-free solders. |
| doi_str_mv | 10.1016/j.msea.2019.02.053 |
| format | Article |
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The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% and 144.0% increments, respectively. These mechanical property variations were attributed to the combined effects of grain refining strengthening of the primary η-Zn phases, precipitation strengthening of the fine ε-CuZn5 compounds in the η-Zn matrix (Cu content greater than 0.3 wt%), and solid-solution strengthening of the Cu inclusion in the η-Zn matrix. The granular two-phase (η-Zn + ε-CuZn5) microstructure, composed of refined η-Zn matrix and fine ε-CuZn5 precipitations, contributed to superior mechanical strength of the Zn-25Sn-xCu high temperature Pb-free solders.</description><identifier>ISSN: 0921-5093</identifier><identifier>EISSN: 1873-4936</identifier><identifier>DOI: 10.1016/j.msea.2019.02.053</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Alloying effects ; Copper ; Cu alloying ; Grain refinement ; High temperature ; High temperature Pb-free solders ; Intermetallics ; Lead free ; Mechanical properties ; Microhardness ; Microstructure ; Microstructures ; Precipitation hardening ; Solders ; Solid solutions ; Solution strengthening ; Ultimate tensile strength ; Zinc</subject><ispartof>Materials science & engineering. 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A, Structural materials : properties, microstructure and processing</title><description>The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% and 144.0% increments, respectively. These mechanical property variations were attributed to the combined effects of grain refining strengthening of the primary η-Zn phases, precipitation strengthening of the fine ε-CuZn5 compounds in the η-Zn matrix (Cu content greater than 0.3 wt%), and solid-solution strengthening of the Cu inclusion in the η-Zn matrix. The granular two-phase (η-Zn + ε-CuZn5) microstructure, composed of refined η-Zn matrix and fine ε-CuZn5 precipitations, contributed to superior mechanical strength of the Zn-25Sn-xCu high temperature Pb-free solders.</description><subject>Alloying effects</subject><subject>Copper</subject><subject>Cu alloying</subject><subject>Grain refinement</subject><subject>High temperature</subject><subject>High temperature Pb-free solders</subject><subject>Intermetallics</subject><subject>Lead free</subject><subject>Mechanical properties</subject><subject>Microhardness</subject><subject>Microstructure</subject><subject>Microstructures</subject><subject>Precipitation hardening</subject><subject>Solders</subject><subject>Solid solutions</subject><subject>Solution strengthening</subject><subject>Ultimate tensile strength</subject><subject>Zinc</subject><issn>0921-5093</issn><issn>1873-4936</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNp9kEtuFDEQhq0IJIbABVhZiiLBojtlu909LYUFGuUlRQKJsGFjue1yxqN-DLYbkl3OAAfJnXISPBnWLMq1cH1_2R8h7xiUDFh9simHiLrkwNoSeAlSHJAFWzaiqFpRvyALaDkrJLTiFXkd4wYAWAVyQX7frJGic2hSpJOjq5nqvp_u_XhLp5GmfDt4E6aYwmzSHJDq0dIBzVqP3uiebsO0xZA8PuPfx4LLr2Nxl3Pe3z09PH7MBU8Pf1iZz8df6fgDXfvbNU04ZEw_J37pChcQaZx6iyG-IS-d7iO-_dcPybfzs5vVZXH9-eJq9em6MKKtUqFlLYXsuDN1t6zryoFDvtQcnGss47DssBHOCtt1VnLeCC2hxqZiqDW2YMUhOdrn5i_8mDEmtZnmMOaVinMmJauZqPIU30_tJMSATm2DH3S4VwzUzr3aqJ17tXOvgKvsPkOnewjz-396DCoaj6NB60M2rezk_4f_Bez3ka0</recordid><startdate>20190318</startdate><enddate>20190318</enddate><creator>Guo, Wei-Ting</creator><creator>Liang, Chien-Lung</creator><creator>Lin, Kwang-Lung</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0003-4743-4765</orcidid></search><sort><creationdate>20190318</creationdate><title>The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders</title><author>Guo, Wei-Ting ; Liang, Chien-Lung ; Lin, Kwang-Lung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c394t-a56535b2fc6b8664f0fe28a20ff7d1208be73fd3dbbd52273a506e741eaae90d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Alloying effects</topic><topic>Copper</topic><topic>Cu alloying</topic><topic>Grain refinement</topic><topic>High temperature</topic><topic>High temperature Pb-free solders</topic><topic>Intermetallics</topic><topic>Lead free</topic><topic>Mechanical properties</topic><topic>Microhardness</topic><topic>Microstructure</topic><topic>Microstructures</topic><topic>Precipitation hardening</topic><topic>Solders</topic><topic>Solid solutions</topic><topic>Solution strengthening</topic><topic>Ultimate tensile strength</topic><topic>Zinc</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Guo, Wei-Ting</creatorcontrib><creatorcontrib>Liang, Chien-Lung</creatorcontrib><creatorcontrib>Lin, Kwang-Lung</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Materials science & engineering. A, Structural materials : properties, microstructure and processing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Guo, Wei-Ting</au><au>Liang, Chien-Lung</au><au>Lin, Kwang-Lung</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders</atitle><jtitle>Materials science & engineering. A, Structural materials : properties, microstructure and processing</jtitle><date>2019-03-18</date><risdate>2019</risdate><volume>750</volume><spage>117</spage><epage>124</epage><pages>117-124</pages><issn>0921-5093</issn><eissn>1873-4936</eissn><abstract>The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% and 144.0% increments, respectively. These mechanical property variations were attributed to the combined effects of grain refining strengthening of the primary η-Zn phases, precipitation strengthening of the fine ε-CuZn5 compounds in the η-Zn matrix (Cu content greater than 0.3 wt%), and solid-solution strengthening of the Cu inclusion in the η-Zn matrix. The granular two-phase (η-Zn + ε-CuZn5) microstructure, composed of refined η-Zn matrix and fine ε-CuZn5 precipitations, contributed to superior mechanical strength of the Zn-25Sn-xCu high temperature Pb-free solders.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.msea.2019.02.053</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0003-4743-4765</orcidid></addata></record> |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Alloying effects Copper Cu alloying Grain refinement High temperature High temperature Pb-free solders Intermetallics Lead free Mechanical properties Microhardness Microstructure Microstructures Precipitation hardening Solders Solid solutions Solution strengthening Ultimate tensile strength Zinc |
| title | The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders |
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