Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder
Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phas...
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| Veröffentlicht in: | Soldering & surface mount technology 2019-04, Vol.31 (2), p.93-101 |
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| container_title | Soldering & surface mount technology |
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| creator | Koleňák, Roman Kostolný, Igor Drápala, Jaromír Kusý, Martin Pašák, Matej |
| description | Purpose
This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied.
Design/methodology/approach
It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials.
Findings
X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa.
Originality/value
The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured. |
| doi_str_mv | 10.1108/SSMT-10-2018-0039 |
| format | Article |
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This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied.
Design/methodology/approach
It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials.
Findings
X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa.
Originality/value
The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/SSMT-10-2018-0039</identifier><language>eng</language><publisher>Bradford: Emerald Publishing Limited</publisher><subject>Alloys ; Aluminum nitride ; Ceramics ; Copper ; Fluxless soldering ; Phases ; R&D ; Research & development ; Shear strength ; Shear tests ; Silver ; Substrates ; Temperature ; Thickness ; Ultrasonic imaging ; Wettability ; X-ray diffraction</subject><ispartof>Soldering & surface mount technology, 2019-04, Vol.31 (2), p.93-101</ispartof><rights>Emerald Publishing Limited</rights><rights>Emerald Publishing Limited 2019</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c314t-38f20e8fc8502769bb985ecca64392742add6576e3ad4646c6ce84d3490efc743</citedby><cites>FETCH-LOGICAL-c314t-38f20e8fc8502769bb985ecca64392742add6576e3ad4646c6ce84d3490efc743</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/SSMT-10-2018-0039/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,11635,27924,27925,52689</link.rule.ids></links><search><creatorcontrib>Koleňák, Roman</creatorcontrib><creatorcontrib>Kostolný, Igor</creatorcontrib><creatorcontrib>Drápala, Jaromír</creatorcontrib><creatorcontrib>Kusý, Martin</creatorcontrib><creatorcontrib>Pašák, Matej</creatorcontrib><title>Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder</title><title>Soldering & surface mount technology</title><description>Purpose
This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied.
Design/methodology/approach
It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials.
Findings
X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa.
Originality/value
The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.</description><subject>Alloys</subject><subject>Aluminum nitride</subject><subject>Ceramics</subject><subject>Copper</subject><subject>Fluxless soldering</subject><subject>Phases</subject><subject>R&D</subject><subject>Research & development</subject><subject>Shear strength</subject><subject>Shear tests</subject><subject>Silver</subject><subject>Substrates</subject><subject>Temperature</subject><subject>Thickness</subject><subject>Ultrasonic imaging</subject><subject>Wettability</subject><subject>X-ray diffraction</subject><issn>0954-0911</issn><issn>1758-6836</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNptkE1Lw0AQhhdRsFZ_gLcFz6uzH9nsHkvxk6pg6jlsN5M2JU3qboL4701oL4KnYeB9ZngfQq453HIO5i7LXpeMAxPADQOQ9oRMeJoYpo3Up2QCNlEMLOfn5CLGLQAobeWEvHxgRBf8hrYNjW1dYKiaNZ3Vb9RjcLvKR_pddRs672nsV7ELrkPaxzGUNWy2ZsvqyF2Ss9LVEa-Oc0o-H-6X8ye2eH98ns8WzEuuOiZNKQBN6U0CItV2tbImQe-dVtKKVAlXFDpJNUpXKK201x6NKqSygKVPlZySm8PdfWi_eoxdvm370AwvcyHAGpkOvYcUP6R8aGMMWOb7UO1c-Mk55KOyfFQ2LqOyfFQ2MHBgcDd0r4t_kT-W5S8wb2wr</recordid><startdate>20190401</startdate><enddate>20190401</enddate><creator>Koleňák, Roman</creator><creator>Kostolný, Igor</creator><creator>Drápala, Jaromír</creator><creator>Kusý, Martin</creator><creator>Pašák, Matej</creator><general>Emerald Publishing Limited</general><general>Emerald Group Publishing Limited</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7RQ</scope><scope>7SP</scope><scope>7TB</scope><scope>7WY</scope><scope>7XB</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>L7M</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope></search><sort><creationdate>20190401</creationdate><title>Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder</title><author>Koleňák, Roman ; Kostolný, Igor ; Drápala, Jaromír ; Kusý, Martin ; Pašák, Matej</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c314t-38f20e8fc8502769bb985ecca64392742add6576e3ad4646c6ce84d3490efc743</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Alloys</topic><topic>Aluminum nitride</topic><topic>Ceramics</topic><topic>Copper</topic><topic>Fluxless soldering</topic><topic>Phases</topic><topic>R&D</topic><topic>Research & development</topic><topic>Shear strength</topic><topic>Shear tests</topic><topic>Silver</topic><topic>Substrates</topic><topic>Temperature</topic><topic>Thickness</topic><topic>Ultrasonic imaging</topic><topic>Wettability</topic><topic>X-ray diffraction</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Koleňák, Roman</creatorcontrib><creatorcontrib>Kostolný, Igor</creatorcontrib><creatorcontrib>Drápala, Jaromír</creatorcontrib><creatorcontrib>Kusý, Martin</creatorcontrib><creatorcontrib>Pašák, Matej</creatorcontrib><collection>CrossRef</collection><collection>Career & Technical Education Database</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>ABI/INFORM Collection</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering & surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Koleňák, Roman</au><au>Kostolný, Igor</au><au>Drápala, Jaromír</au><au>Kusý, Martin</au><au>Pašák, Matej</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder</atitle><jtitle>Soldering & surface mount technology</jtitle><date>2019-04-01</date><risdate>2019</risdate><volume>31</volume><issue>2</issue><spage>93</spage><epage>101</epage><pages>93-101</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><abstract>Purpose
This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied.
Design/methodology/approach
It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials.
Findings
X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa.
Originality/value
The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.</abstract><cop>Bradford</cop><pub>Emerald Publishing Limited</pub><doi>10.1108/SSMT-10-2018-0039</doi><tpages>9</tpages></addata></record> |
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| identifier | ISSN: 0954-0911 |
| ispartof | Soldering & surface mount technology, 2019-04, Vol.31 (2), p.93-101 |
| issn | 0954-0911 1758-6836 |
| language | eng |
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| source | Emerald A-Z Current Journals |
| subjects | Alloys Aluminum nitride Ceramics Copper Fluxless soldering Phases R&D Research & development Shear strength Shear tests Silver Substrates Temperature Thickness Ultrasonic imaging Wettability X-ray diffraction |
| title | Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder |
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