Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

In this work, surface analysis technology is employed to investigate the removal mechanism and the selection of abrasive during fused silica chemical mechanical polishing (CMP). Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to d...

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Veröffentlicht in:Surface and interface analysis 2019-05, Vol.51 (5), p.576-583
Hauptverfasser: Chen, Gaopan, Luo, Haimei, Kang, Chengxi, Luo, Guihai, Zhou, Yan, Pan, Guoshun
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container_end_page 583
container_issue 5
container_start_page 576
container_title Surface and interface analysis
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creator Chen, Gaopan
Luo, Haimei
Kang, Chengxi
Luo, Guihai
Zhou, Yan
Pan, Guoshun
description In this work, surface analysis technology is employed to investigate the removal mechanism and the selection of abrasive during fused silica chemical mechanical polishing (CMP). Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to determine the surface roughness (Rq) and undulating (PV) of the polished fused silica surface. The results show that abrasive morphology has a tremendous influence on removal rate (MRR) and PV but has little effect on the Rq. The AFM and infrared spectroscopy (IR) analysis show that a soft layer, called “silica gel membrane (SGM),” existed on the polished surface is the critical reason for the differences of MRR, Rq, and PV during CMP. For three kinds of micro‐ceria abrasives, the abrasive with a rougher surface gets more opportunities to contact the surface of fused silica, yielding higher MRR. Regarding different kinds of nano‐abrasives, there are more SGM induced by nano‐ceria abrasive resulting from higher chemical reaction rate. The element contaminations on the polished fused silica have been assessed using X‐ray photoelectron spectroscopy (XPS), and the results suggest that there are depths of 3.6 and 5.4‐nm element contaminations on the polished surface of fused silica with nano‐ceria and nano‐alumina abrasives, respectively. While the surface polished by nano‐silica is free of heterogeneous element contaminations. Based on study results, a novel polishing slurry is designed by modifying the chemical composition of nano‐silica. Comparing with ceria‐based slurry, the silica‐based slurry has better removal efficiency, and surface quality in fused silica precision machining.
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Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to determine the surface roughness (Rq) and undulating (PV) of the polished fused silica surface. The results show that abrasive morphology has a tremendous influence on removal rate (MRR) and PV but has little effect on the Rq. The AFM and infrared spectroscopy (IR) analysis show that a soft layer, called “silica gel membrane (SGM),” existed on the polished surface is the critical reason for the differences of MRR, Rq, and PV during CMP. For three kinds of micro‐ceria abrasives, the abrasive with a rougher surface gets more opportunities to contact the surface of fused silica, yielding higher MRR. Regarding different kinds of nano‐abrasives, there are more SGM induced by nano‐ceria abrasive resulting from higher chemical reaction rate. The element contaminations on the polished fused silica have been assessed using X‐ray photoelectron spectroscopy (XPS), and the results suggest that there are depths of 3.6 and 5.4‐nm element contaminations on the polished surface of fused silica with nano‐ceria and nano‐alumina abrasives, respectively. While the surface polished by nano‐silica is free of heterogeneous element contaminations. Based on study results, a novel polishing slurry is designed by modifying the chemical composition of nano‐silica. Comparing with ceria‐based slurry, the silica‐based slurry has better removal efficiency, and surface quality in fused silica precision machining.</description><identifier>ISSN: 0142-2421</identifier><identifier>EISSN: 1096-9918</identifier><identifier>DOI: 10.1002/sia.6625</identifier><language>eng</language><publisher>Bognor Regis: Wiley Subscription Services, Inc</publisher><subject>abrasive selection ; Abrasives ; Aluminum oxide ; Atomic force microscopes ; Atomic force microscopy ; Cerium oxides ; Chemical composition ; Chemical reactions ; Chemical-mechanical polishing ; Contamination ; Fused silica ; Infrared analysis ; Infrared spectroscopy ; Morphology ; Organic chemistry ; Photoelectrons ; Precision machining ; removal mechanism ; Repair &amp; maintenance ; Silica gel ; Silicon dioxide ; Slurries ; Spectrum analysis ; surface analysis ; Surface analysis (chemical) ; Surface properties ; Surface roughness ; Technology assessment</subject><ispartof>Surface and interface analysis, 2019-05, Vol.51 (5), p.576-583</ispartof><rights>2019 John Wiley &amp; Sons, Ltd.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2935-f7b8a17769d6e51581d6e173f3447046e26691546c69989bcf9ec6028c1d9be83</citedby><cites>FETCH-LOGICAL-c2935-f7b8a17769d6e51581d6e173f3447046e26691546c69989bcf9ec6028c1d9be83</cites><orcidid>0000-0002-1212-0195</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fsia.6625$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fsia.6625$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids></links><search><creatorcontrib>Chen, Gaopan</creatorcontrib><creatorcontrib>Luo, Haimei</creatorcontrib><creatorcontrib>Kang, Chengxi</creatorcontrib><creatorcontrib>Luo, Guihai</creatorcontrib><creatorcontrib>Zhou, Yan</creatorcontrib><creatorcontrib>Pan, Guoshun</creatorcontrib><title>Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing</title><title>Surface and interface analysis</title><description>In this work, surface analysis technology is employed to investigate the removal mechanism and the selection of abrasive during fused silica chemical mechanical polishing (CMP). Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to determine the surface roughness (Rq) and undulating (PV) of the polished fused silica surface. The results show that abrasive morphology has a tremendous influence on removal rate (MRR) and PV but has little effect on the Rq. The AFM and infrared spectroscopy (IR) analysis show that a soft layer, called “silica gel membrane (SGM),” existed on the polished surface is the critical reason for the differences of MRR, Rq, and PV during CMP. For three kinds of micro‐ceria abrasives, the abrasive with a rougher surface gets more opportunities to contact the surface of fused silica, yielding higher MRR. Regarding different kinds of nano‐abrasives, there are more SGM induced by nano‐ceria abrasive resulting from higher chemical reaction rate. The element contaminations on the polished fused silica have been assessed using X‐ray photoelectron spectroscopy (XPS), and the results suggest that there are depths of 3.6 and 5.4‐nm element contaminations on the polished surface of fused silica with nano‐ceria and nano‐alumina abrasives, respectively. While the surface polished by nano‐silica is free of heterogeneous element contaminations. Based on study results, a novel polishing slurry is designed by modifying the chemical composition of nano‐silica. Comparing with ceria‐based slurry, the silica‐based slurry has better removal efficiency, and surface quality in fused silica precision machining.</description><subject>abrasive selection</subject><subject>Abrasives</subject><subject>Aluminum oxide</subject><subject>Atomic force microscopes</subject><subject>Atomic force microscopy</subject><subject>Cerium oxides</subject><subject>Chemical composition</subject><subject>Chemical reactions</subject><subject>Chemical-mechanical polishing</subject><subject>Contamination</subject><subject>Fused silica</subject><subject>Infrared analysis</subject><subject>Infrared spectroscopy</subject><subject>Morphology</subject><subject>Organic chemistry</subject><subject>Photoelectrons</subject><subject>Precision machining</subject><subject>removal mechanism</subject><subject>Repair &amp; maintenance</subject><subject>Silica gel</subject><subject>Silicon dioxide</subject><subject>Slurries</subject><subject>Spectrum analysis</subject><subject>surface analysis</subject><subject>Surface analysis (chemical)</subject><subject>Surface properties</subject><subject>Surface roughness</subject><subject>Technology assessment</subject><issn>0142-2421</issn><issn>1096-9918</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNp10MtKAzEUBuAgCtYq-AgBN26mJpmZTLIsxUtBcKGuQyaT2JS5mdOpzAv43GZacefqD-TLCedH6JqSBSWE3YHXC85ZfoJmlEieSEnFKZoRmrGEZYyeowuALSFEpILP0Pey72tv9M53Le4chiE4bSzWra5H8IB9i2E3VCOO98E23V7XuLFmo1sPTWQV1mXQ4PcWg62tOQyqhuDbD-wGsBUGP32AzcY2Mf9eT8e-qz1sIr1EZ07XYK9-c47eH-7fVk_J88vjerV8TgyTaZ64ohSaFgWXFbc5zQWNSYvUpVlWkIxbxrmkecYNl1LI0jhpDSdMGFrJ0op0jm6Oc_vQfQ4WdmrbDSHuCooxwikrhMyiuj0qEzqAYJ3qg290GBUlampZxZbV1HKkyZF--dqO_zr1ul4e_A80SX-0</recordid><startdate>201905</startdate><enddate>201905</enddate><creator>Chen, Gaopan</creator><creator>Luo, Haimei</creator><creator>Kang, Chengxi</creator><creator>Luo, Guihai</creator><creator>Zhou, Yan</creator><creator>Pan, Guoshun</creator><general>Wiley Subscription Services, Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-1212-0195</orcidid></search><sort><creationdate>201905</creationdate><title>Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing</title><author>Chen, Gaopan ; 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Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to determine the surface roughness (Rq) and undulating (PV) of the polished fused silica surface. The results show that abrasive morphology has a tremendous influence on removal rate (MRR) and PV but has little effect on the Rq. The AFM and infrared spectroscopy (IR) analysis show that a soft layer, called “silica gel membrane (SGM),” existed on the polished surface is the critical reason for the differences of MRR, Rq, and PV during CMP. For three kinds of micro‐ceria abrasives, the abrasive with a rougher surface gets more opportunities to contact the surface of fused silica, yielding higher MRR. Regarding different kinds of nano‐abrasives, there are more SGM induced by nano‐ceria abrasive resulting from higher chemical reaction rate. The element contaminations on the polished fused silica have been assessed using X‐ray photoelectron spectroscopy (XPS), and the results suggest that there are depths of 3.6 and 5.4‐nm element contaminations on the polished surface of fused silica with nano‐ceria and nano‐alumina abrasives, respectively. While the surface polished by nano‐silica is free of heterogeneous element contaminations. Based on study results, a novel polishing slurry is designed by modifying the chemical composition of nano‐silica. Comparing with ceria‐based slurry, the silica‐based slurry has better removal efficiency, and surface quality in fused silica precision machining.</abstract><cop>Bognor Regis</cop><pub>Wiley Subscription Services, Inc</pub><doi>10.1002/sia.6625</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0002-1212-0195</orcidid></addata></record>
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subjects abrasive selection
Abrasives
Aluminum oxide
Atomic force microscopes
Atomic force microscopy
Cerium oxides
Chemical composition
Chemical reactions
Chemical-mechanical polishing
Contamination
Fused silica
Infrared analysis
Infrared spectroscopy
Morphology
Organic chemistry
Photoelectrons
Precision machining
removal mechanism
Repair & maintenance
Silica gel
Silicon dioxide
Slurries
Spectrum analysis
surface analysis
Surface analysis (chemical)
Surface properties
Surface roughness
Technology assessment
title Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing
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