Cu-Ba0.7Sr0.3TiO3 composites for electronic packaging

With the rapid growth of Electronic industries, there is an increasing demand for high-performance electronic packaging materials. In a harsher service environment, the high-temperature performance and thermal cycling stability are required to run the electronic system. In order to remove the heat g...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2019-05, Vol.30 (9), p.9022-9028
Hauptverfasser:	Kumar, Sanjay, Pradeepkumar, Maurya Sandeep, Dwivedi, Akansha, Ahmad, Md. Imteyaz
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Citrate gel method Electronic packaging Electronic systems Heat sinks High temperature Materials Science Metal matrix composites Nanoparticles Optical and Electronic Materials Product design Thermal conductivity Thermal cycling Thermal expansion Thermal stability
Online-Zugang:	Volltext
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