Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties

Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It...

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Veröffentlicht in:	Key engineering materials 2018-09, Vol.781, p.76-81
Hauptverfasser:	Klopotov, Аnatoliy A., Tolkachev, Oleg S., Ivanov, Yurii F., Potekaev, Aleksandr I., Tsvetkov, Nikolaii, Moskvin, Pavel, Ivanova, Olga V., Petrikova, Elizaveta A., Krysina, Olga V.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum Aluminum base alloys Cellular structure Copper Doping Electron beams Irradiation Microhardness Parameter modification Rapid solidification Substrates Surface alloying Thickness Titanium base alloys Wear resistance
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