Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties
Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It...
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| Veröffentlicht in: | Key engineering materials 2018-09, Vol.781, p.76-81 |
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| creator | Klopotov, Аnatoliy A. Tolkachev, Oleg S. Ivanov, Yurii F. Potekaev, Aleksandr I. Tsvetkov, Nikolaii Moskvin, Pavel Ivanova, Olga V. Petrikova, Elizaveta A. Krysina, Olga V. |
| description | Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron-nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.781.76 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2199168249</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2199168249</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2086-94ff3eb18d60456ac7d3423146cb9628316c397e30b1fb92581b5b9a5b7a0e393</originalsourceid><addsrcrecordid>eNqNkN1O3DAQhaOqSKXAO1iqepngn8SxL1C12i4UAQIJem053glrlNip7bDiCXjtelkkbrkYzWh0zpnRVxQ_Ca5qTMXpdrutorHgku2tqRyk06vVTdUKUrX8S3FIOKelbGXzNc-YsFIKyr8V32N8wpgRQZrD4nU1gEnBu_Iy192g46jRbz9Z94h8jxbDPFo3j-h-Dr02gLY2bdDSTxMEpN0aPdiknc2CEi3yfpx00Mk-A1o4PbxEG3cpaQPo3IcR1ug-hdmkOcCb-y74HJQsxOPioNdDhJP3flT8PV89LP-U17cXl8vFdWkoFryUdd8z6IhYc1w3XJt2zWrKSM1NJzkVjHDDZAsMd6TvJG0E6ZpO6qZrNQYm2VHxY587Bf9vhpjUk59D_jUqSqQkXNB6pzrbq0zwMQbo1RTsqMOLIljt2KvMXn2wV5m9yuxVZq9anv2_9v4UtIsJzObjzOcS_gOni5ZY</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2199168249</pqid></control><display><type>article</type><title>Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties</title><source>Scientific.net Journals</source><creator>Klopotov, Аnatoliy A. ; Tolkachev, Oleg S. ; Ivanov, Yurii F. ; Potekaev, Aleksandr I. ; Tsvetkov, Nikolaii ; Moskvin, Pavel ; Ivanova, Olga V. ; Petrikova, Elizaveta A. ; Krysina, Olga V.</creator><creatorcontrib>Klopotov, Аnatoliy A. ; Tolkachev, Oleg S. ; Ivanov, Yurii F. ; Potekaev, Aleksandr I. ; Tsvetkov, Nikolaii ; Moskvin, Pavel ; Ivanova, Olga V. ; Petrikova, Elizaveta A. ; Krysina, Olga V.</creatorcontrib><description>Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron-nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.781.76</identifier><language>eng</language><publisher>Zurich: Trans Tech Publications Ltd</publisher><subject>Aluminum ; Aluminum base alloys ; Cellular structure ; Copper ; Doping ; Electron beams ; Irradiation ; Microhardness ; Parameter modification ; Rapid solidification ; Substrates ; Surface alloying ; Thickness ; Titanium base alloys ; Wear resistance</subject><ispartof>Key engineering materials, 2018-09, Vol.781, p.76-81</ispartof><rights>2018 Trans Tech Publications Ltd</rights><rights>Copyright Trans Tech Publications Ltd. Sep 2018</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c2086-94ff3eb18d60456ac7d3423146cb9628316c397e30b1fb92581b5b9a5b7a0e393</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/4800?width=600</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Klopotov, Аnatoliy A.</creatorcontrib><creatorcontrib>Tolkachev, Oleg S.</creatorcontrib><creatorcontrib>Ivanov, Yurii F.</creatorcontrib><creatorcontrib>Potekaev, Aleksandr I.</creatorcontrib><creatorcontrib>Tsvetkov, Nikolaii</creatorcontrib><creatorcontrib>Moskvin, Pavel</creatorcontrib><creatorcontrib>Ivanova, Olga V.</creatorcontrib><creatorcontrib>Petrikova, Elizaveta A.</creatorcontrib><creatorcontrib>Krysina, Olga V.</creatorcontrib><title>Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties</title><title>Key engineering materials</title><description>Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron-nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.</description><subject>Aluminum</subject><subject>Aluminum base alloys</subject><subject>Cellular structure</subject><subject>Copper</subject><subject>Doping</subject><subject>Electron beams</subject><subject>Irradiation</subject><subject>Microhardness</subject><subject>Parameter modification</subject><subject>Rapid solidification</subject><subject>Substrates</subject><subject>Surface alloying</subject><subject>Thickness</subject><subject>Titanium base alloys</subject><subject>Wear resistance</subject><issn>1013-9826</issn><issn>1662-9795</issn><issn>1662-9795</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNqNkN1O3DAQhaOqSKXAO1iqepngn8SxL1C12i4UAQIJem053glrlNip7bDiCXjtelkkbrkYzWh0zpnRVxQ_Ca5qTMXpdrutorHgku2tqRyk06vVTdUKUrX8S3FIOKelbGXzNc-YsFIKyr8V32N8wpgRQZrD4nU1gEnBu_Iy192g46jRbz9Z94h8jxbDPFo3j-h-Dr02gLY2bdDSTxMEpN0aPdiknc2CEi3yfpx00Mk-A1o4PbxEG3cpaQPo3IcR1ug-hdmkOcCb-y74HJQsxOPioNdDhJP3flT8PV89LP-U17cXl8vFdWkoFryUdd8z6IhYc1w3XJt2zWrKSM1NJzkVjHDDZAsMd6TvJG0E6ZpO6qZrNQYm2VHxY587Bf9vhpjUk59D_jUqSqQkXNB6pzrbq0zwMQbo1RTsqMOLIljt2KvMXn2wV5m9yuxVZq9anv2_9v4UtIsJzObjzOcS_gOni5ZY</recordid><startdate>20180901</startdate><enddate>20180901</enddate><creator>Klopotov, Аnatoliy A.</creator><creator>Tolkachev, Oleg S.</creator><creator>Ivanov, Yurii F.</creator><creator>Potekaev, Aleksandr I.</creator><creator>Tsvetkov, Nikolaii</creator><creator>Moskvin, Pavel</creator><creator>Ivanova, Olga V.</creator><creator>Petrikova, Elizaveta A.</creator><creator>Krysina, Olga V.</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope></search><sort><creationdate>20180901</creationdate><title>Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties</title><author>Klopotov, Аnatoliy A. ; Tolkachev, Oleg S. ; Ivanov, Yurii F. ; Potekaev, Aleksandr I. ; Tsvetkov, Nikolaii ; Moskvin, Pavel ; Ivanova, Olga V. ; Petrikova, Elizaveta A. ; Krysina, Olga V.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2086-94ff3eb18d60456ac7d3423146cb9628316c397e30b1fb92581b5b9a5b7a0e393</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Aluminum</topic><topic>Aluminum base alloys</topic><topic>Cellular structure</topic><topic>Copper</topic><topic>Doping</topic><topic>Electron beams</topic><topic>Irradiation</topic><topic>Microhardness</topic><topic>Parameter modification</topic><topic>Rapid solidification</topic><topic>Substrates</topic><topic>Surface alloying</topic><topic>Thickness</topic><topic>Titanium base alloys</topic><topic>Wear resistance</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Klopotov, Аnatoliy A.</creatorcontrib><creatorcontrib>Tolkachev, Oleg S.</creatorcontrib><creatorcontrib>Ivanov, Yurii F.</creatorcontrib><creatorcontrib>Potekaev, Aleksandr I.</creatorcontrib><creatorcontrib>Tsvetkov, Nikolaii</creatorcontrib><creatorcontrib>Moskvin, Pavel</creatorcontrib><creatorcontrib>Ivanova, Olga V.</creatorcontrib><creatorcontrib>Petrikova, Elizaveta A.</creatorcontrib><creatorcontrib>Krysina, Olga V.</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering collection</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Klopotov, Аnatoliy A.</au><au>Tolkachev, Oleg S.</au><au>Ivanov, Yurii F.</au><au>Potekaev, Aleksandr I.</au><au>Tsvetkov, Nikolaii</au><au>Moskvin, Pavel</au><au>Ivanova, Olga V.</au><au>Petrikova, Elizaveta A.</au><au>Krysina, Olga V.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties</atitle><jtitle>Key engineering materials</jtitle><date>2018-09-01</date><risdate>2018</risdate><volume>781</volume><spage>76</spage><epage>81</epage><pages>76-81</pages><issn>1013-9826</issn><issn>1662-9795</issn><eissn>1662-9795</eissn><abstract>Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron-nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.</abstract><cop>Zurich</cop><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.781.76</doi><tpages>6</tpages></addata></record> |
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| subjects | Aluminum Aluminum base alloys Cellular structure Copper Doping Electron beams Irradiation Microhardness Parameter modification Rapid solidification Substrates Surface alloying Thickness Titanium base alloys Wear resistance |
| title | Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T20%3A05%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Electron-Ion-Plasma%20Doping%20of%20Aluminum%20Surface%20with%20Copper%20and%20Titanium%20-%20A%20Comparative%20Analysis%20of%20the%20Formed%20Structure%20and%20Properties&rft.jtitle=Key%20engineering%20materials&rft.au=Klopotov,%20%D0%90natoliy%20A.&rft.date=2018-09-01&rft.volume=781&rft.spage=76&rft.epage=81&rft.pages=76-81&rft.issn=1013-9826&rft.eissn=1662-9795&rft_id=info:doi/10.4028/www.scientific.net/KEM.781.76&rft_dat=%3Cproquest_cross%3E2199168249%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2199168249&rft_id=info:pmid/&rfr_iscdi=true |