Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy

The requirements of low resistivity and small magnetic permeability in the high-frequency signal delivery applications have driven the development of Ni-free surface finishes, such as Au/Pd (EPIG) or Au/Pd/Au (IGEPIG), over the Cu conducting lines. The compatibility of these newly developed surface...

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