EQCM and EIS characterization of electrochemical deposition of tin from aqueous solution containing pyrophosphate

Electroless plating of tin layers with thicknesses of more than 3 μm is becoming an important process in the production of circuit boards and semiconductor. Phosphonates constitute promising complexing agents for autocatalytic tin electrolytes. However, detailed time-resolved investigations or elect...

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Veröffentlicht in:	Electrochimica acta 2019-02, Vol.296, p.224-234
Hauptverfasser:	Tuna, Kadir, Kilian, Arnd, Ressler, Thorsten
Format:	Artikel
Sprache:	eng
Schlagworte:	Adsorbates Aqueous solutions Circuit boards Deposition EIS Electrochemical analysis Electrochemical impedance spectroscopy Electroless plating Electrolytes EQCM Equivalent circuits Gold Microbalances Phosphonates Resistance Spectrum analysis Thickness
Online-Zugang:	Volltext
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