Polymer multilayer films for high temperature capacitor application
ABSTRACT Advanced film capacitors require polymers with high thermal stability, high breakdown strength, and low loss for high temperature dielectric applications. To fulfill such requirements, two polymer multilayer film systems were coextruded via the forced assembly technique. High glass transiti...
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| Veröffentlicht in: | Journal of applied polymer science 2019-05, Vol.136 (20), p.n/a |
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| container_title | Journal of applied polymer science |
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| creator | Yin, Kezhen Zhang, Jingwei Li, Zhenpeng Feng, Jingxing Zhang, Ci Chen, Xinyue Olah, Andrew Schuele, Donald E. Zhu, Lei Baer, Eric |
| description | ABSTRACT
Advanced film capacitors require polymers with high thermal stability, high breakdown strength, and low loss for high temperature dielectric applications. To fulfill such requirements, two polymer multilayer film systems were coextruded via the forced assembly technique. High glass transition temperature (T
g) polycarbonate (HTPC, Tg = 165 °C) and polysulfone (PSF, Tg = 185 °C) were multilayered with a high dielectric constant polymer, poly(vinylidene fluoride) (PVDF), respectively. The PSF/PVDF system was more thermally stable than the HTPC/PVDF system because of the higher Tg for PSF. At temperatures lower than 170 °C, the HTPC/PVDF system exhibited comparable breakdown strength and hysteresis loss as the PSF/PVDF system. While at temperatures above 170 °C, the PSF/PVDF system exhibited a higher breakdown strength because of the higher Tg of PSF. The electric displacement‐electric field (D‐E) loop behavior of the PSF/PVDF system was studied as a function of temperature. Moreover, a melt‐recrystallization process could further decrease the hysteresis loss for the PSF/PVDF system due to better edge‐on crystal orientation. These results demonstrate that PSF/PVDF and HTPC/PVDF systems are applicable for high temperature film capacitors. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47535.
Weibull breakdown strengths |
| doi_str_mv | 10.1002/app.47535 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2180588707</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2180588707</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2975-12814de5d30201f28e801eddf7d757880c5cfa215e611dbd56099a6f45b52dfc3</originalsourceid><addsrcrecordid>eNp1kEtPwzAQhC0EEqVw4B9E4sQh7a4bx86xqnhJlegBzpbrB3WVNMFOhPLvMYQrp11pvt0ZDSG3CAsEoEvVdYuCsxU7IzOEiudFScU5mSUNc1FV7JJcxXgEQGRQzshm19ZjY0PWDHXvazWm1fm6iZlrQ3bwH4est01ng-qHYDOtOqV9n6RkVHutet-ersmFU3W0N39zTt4fH942z_n29ells97mmlac5UgFFsYyswIK6KiwAtAa47jhjAsBmmmnKDJbIpq9YSVUlSpdwfaMGqdXc3I3_e1C-znY2MtjO4RTspQUBTAhOPBE3U-UDm2MwTrZBd-oMEoE-dORTNHlb0eJXU7sl6_t-D8o17vddPENtp5ocw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2180588707</pqid></control><display><type>article</type><title>Polymer multilayer films for high temperature capacitor application</title><source>Wiley Online Library - AutoHoldings Journals</source><creator>Yin, Kezhen ; Zhang, Jingwei ; Li, Zhenpeng ; Feng, Jingxing ; Zhang, Ci ; Chen, Xinyue ; Olah, Andrew ; Schuele, Donald E. ; Zhu, Lei ; Baer, Eric</creator><creatorcontrib>Yin, Kezhen ; Zhang, Jingwei ; Li, Zhenpeng ; Feng, Jingxing ; Zhang, Ci ; Chen, Xinyue ; Olah, Andrew ; Schuele, Donald E. ; Zhu, Lei ; Baer, Eric</creatorcontrib><description>ABSTRACT
Advanced film capacitors require polymers with high thermal stability, high breakdown strength, and low loss for high temperature dielectric applications. To fulfill such requirements, two polymer multilayer film systems were coextruded via the forced assembly technique. High glass transition temperature (T
g) polycarbonate (HTPC, Tg = 165 °C) and polysulfone (PSF, Tg = 185 °C) were multilayered with a high dielectric constant polymer, poly(vinylidene fluoride) (PVDF), respectively. The PSF/PVDF system was more thermally stable than the HTPC/PVDF system because of the higher Tg for PSF. At temperatures lower than 170 °C, the HTPC/PVDF system exhibited comparable breakdown strength and hysteresis loss as the PSF/PVDF system. While at temperatures above 170 °C, the PSF/PVDF system exhibited a higher breakdown strength because of the higher Tg of PSF. The electric displacement‐electric field (D‐E) loop behavior of the PSF/PVDF system was studied as a function of temperature. Moreover, a melt‐recrystallization process could further decrease the hysteresis loss for the PSF/PVDF system due to better edge‐on crystal orientation. These results demonstrate that PSF/PVDF and HTPC/PVDF systems are applicable for high temperature film capacitors. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47535.
Weibull breakdown strengths</description><identifier>ISSN: 0021-8995</identifier><identifier>EISSN: 1097-4628</identifier><identifier>DOI: 10.1002/app.47535</identifier><language>eng</language><publisher>Hoboken, USA: John Wiley & Sons, Inc</publisher><subject>Breakdown ; Capacitors ; Coextrusion ; Core loss ; Crystal structure ; dielectric properties ; Dielectric strength ; Electric fields ; Glass transition temperature ; High temperature ; Materials science ; Multilayers ; nanostructured polymers ; Polymer films ; Polymers ; Polysulfone resins ; Polyvinylidene fluorides ; Recrystallization ; Thermal stability ; Vinylidene fluoride</subject><ispartof>Journal of applied polymer science, 2019-05, Vol.136 (20), p.n/a</ispartof><rights>2019 Wiley Periodicals, Inc.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2975-12814de5d30201f28e801eddf7d757880c5cfa215e611dbd56099a6f45b52dfc3</citedby><cites>FETCH-LOGICAL-c2975-12814de5d30201f28e801eddf7d757880c5cfa215e611dbd56099a6f45b52dfc3</cites><orcidid>0000-0001-6570-9123</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fapp.47535$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fapp.47535$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27901,27902,45550,45551</link.rule.ids></links><search><creatorcontrib>Yin, Kezhen</creatorcontrib><creatorcontrib>Zhang, Jingwei</creatorcontrib><creatorcontrib>Li, Zhenpeng</creatorcontrib><creatorcontrib>Feng, Jingxing</creatorcontrib><creatorcontrib>Zhang, Ci</creatorcontrib><creatorcontrib>Chen, Xinyue</creatorcontrib><creatorcontrib>Olah, Andrew</creatorcontrib><creatorcontrib>Schuele, Donald E.</creatorcontrib><creatorcontrib>Zhu, Lei</creatorcontrib><creatorcontrib>Baer, Eric</creatorcontrib><title>Polymer multilayer films for high temperature capacitor application</title><title>Journal of applied polymer science</title><description>ABSTRACT
Advanced film capacitors require polymers with high thermal stability, high breakdown strength, and low loss for high temperature dielectric applications. To fulfill such requirements, two polymer multilayer film systems were coextruded via the forced assembly technique. High glass transition temperature (T
g) polycarbonate (HTPC, Tg = 165 °C) and polysulfone (PSF, Tg = 185 °C) were multilayered with a high dielectric constant polymer, poly(vinylidene fluoride) (PVDF), respectively. The PSF/PVDF system was more thermally stable than the HTPC/PVDF system because of the higher Tg for PSF. At temperatures lower than 170 °C, the HTPC/PVDF system exhibited comparable breakdown strength and hysteresis loss as the PSF/PVDF system. While at temperatures above 170 °C, the PSF/PVDF system exhibited a higher breakdown strength because of the higher Tg of PSF. The electric displacement‐electric field (D‐E) loop behavior of the PSF/PVDF system was studied as a function of temperature. Moreover, a melt‐recrystallization process could further decrease the hysteresis loss for the PSF/PVDF system due to better edge‐on crystal orientation. These results demonstrate that PSF/PVDF and HTPC/PVDF systems are applicable for high temperature film capacitors. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47535.
Weibull breakdown strengths</description><subject>Breakdown</subject><subject>Capacitors</subject><subject>Coextrusion</subject><subject>Core loss</subject><subject>Crystal structure</subject><subject>dielectric properties</subject><subject>Dielectric strength</subject><subject>Electric fields</subject><subject>Glass transition temperature</subject><subject>High temperature</subject><subject>Materials science</subject><subject>Multilayers</subject><subject>nanostructured polymers</subject><subject>Polymer films</subject><subject>Polymers</subject><subject>Polysulfone resins</subject><subject>Polyvinylidene fluorides</subject><subject>Recrystallization</subject><subject>Thermal stability</subject><subject>Vinylidene fluoride</subject><issn>0021-8995</issn><issn>1097-4628</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNp1kEtPwzAQhC0EEqVw4B9E4sQh7a4bx86xqnhJlegBzpbrB3WVNMFOhPLvMYQrp11pvt0ZDSG3CAsEoEvVdYuCsxU7IzOEiudFScU5mSUNc1FV7JJcxXgEQGRQzshm19ZjY0PWDHXvazWm1fm6iZlrQ3bwH4est01ng-qHYDOtOqV9n6RkVHutet-ersmFU3W0N39zTt4fH942z_n29ells97mmlac5UgFFsYyswIK6KiwAtAa47jhjAsBmmmnKDJbIpq9YSVUlSpdwfaMGqdXc3I3_e1C-znY2MtjO4RTspQUBTAhOPBE3U-UDm2MwTrZBd-oMEoE-dORTNHlb0eJXU7sl6_t-D8o17vddPENtp5ocw</recordid><startdate>20190520</startdate><enddate>20190520</enddate><creator>Yin, Kezhen</creator><creator>Zhang, Jingwei</creator><creator>Li, Zhenpeng</creator><creator>Feng, Jingxing</creator><creator>Zhang, Ci</creator><creator>Chen, Xinyue</creator><creator>Olah, Andrew</creator><creator>Schuele, Donald E.</creator><creator>Zhu, Lei</creator><creator>Baer, Eric</creator><general>John Wiley & Sons, Inc</general><general>Wiley Subscription Services, Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0001-6570-9123</orcidid></search><sort><creationdate>20190520</creationdate><title>Polymer multilayer films for high temperature capacitor application</title><author>Yin, Kezhen ; Zhang, Jingwei ; Li, Zhenpeng ; Feng, Jingxing ; Zhang, Ci ; Chen, Xinyue ; Olah, Andrew ; Schuele, Donald E. ; Zhu, Lei ; Baer, Eric</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2975-12814de5d30201f28e801eddf7d757880c5cfa215e611dbd56099a6f45b52dfc3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Breakdown</topic><topic>Capacitors</topic><topic>Coextrusion</topic><topic>Core loss</topic><topic>Crystal structure</topic><topic>dielectric properties</topic><topic>Dielectric strength</topic><topic>Electric fields</topic><topic>Glass transition temperature</topic><topic>High temperature</topic><topic>Materials science</topic><topic>Multilayers</topic><topic>nanostructured polymers</topic><topic>Polymer films</topic><topic>Polymers</topic><topic>Polysulfone resins</topic><topic>Polyvinylidene fluorides</topic><topic>Recrystallization</topic><topic>Thermal stability</topic><topic>Vinylidene fluoride</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yin, Kezhen</creatorcontrib><creatorcontrib>Zhang, Jingwei</creatorcontrib><creatorcontrib>Li, Zhenpeng</creatorcontrib><creatorcontrib>Feng, Jingxing</creatorcontrib><creatorcontrib>Zhang, Ci</creatorcontrib><creatorcontrib>Chen, Xinyue</creatorcontrib><creatorcontrib>Olah, Andrew</creatorcontrib><creatorcontrib>Schuele, Donald E.</creatorcontrib><creatorcontrib>Zhu, Lei</creatorcontrib><creatorcontrib>Baer, Eric</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of applied polymer science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yin, Kezhen</au><au>Zhang, Jingwei</au><au>Li, Zhenpeng</au><au>Feng, Jingxing</au><au>Zhang, Ci</au><au>Chen, Xinyue</au><au>Olah, Andrew</au><au>Schuele, Donald E.</au><au>Zhu, Lei</au><au>Baer, Eric</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Polymer multilayer films for high temperature capacitor application</atitle><jtitle>Journal of applied polymer science</jtitle><date>2019-05-20</date><risdate>2019</risdate><volume>136</volume><issue>20</issue><epage>n/a</epage><issn>0021-8995</issn><eissn>1097-4628</eissn><abstract>ABSTRACT
Advanced film capacitors require polymers with high thermal stability, high breakdown strength, and low loss for high temperature dielectric applications. To fulfill such requirements, two polymer multilayer film systems were coextruded via the forced assembly technique. High glass transition temperature (T
g) polycarbonate (HTPC, Tg = 165 °C) and polysulfone (PSF, Tg = 185 °C) were multilayered with a high dielectric constant polymer, poly(vinylidene fluoride) (PVDF), respectively. The PSF/PVDF system was more thermally stable than the HTPC/PVDF system because of the higher Tg for PSF. At temperatures lower than 170 °C, the HTPC/PVDF system exhibited comparable breakdown strength and hysteresis loss as the PSF/PVDF system. While at temperatures above 170 °C, the PSF/PVDF system exhibited a higher breakdown strength because of the higher Tg of PSF. The electric displacement‐electric field (D‐E) loop behavior of the PSF/PVDF system was studied as a function of temperature. Moreover, a melt‐recrystallization process could further decrease the hysteresis loss for the PSF/PVDF system due to better edge‐on crystal orientation. These results demonstrate that PSF/PVDF and HTPC/PVDF systems are applicable for high temperature film capacitors. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47535.
Weibull breakdown strengths</abstract><cop>Hoboken, USA</cop><pub>John Wiley & Sons, Inc</pub><doi>10.1002/app.47535</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0001-6570-9123</orcidid></addata></record> |
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| subjects | Breakdown Capacitors Coextrusion Core loss Crystal structure dielectric properties Dielectric strength Electric fields Glass transition temperature High temperature Materials science Multilayers nanostructured polymers Polymer films Polymers Polysulfone resins Polyvinylidene fluorides Recrystallization Thermal stability Vinylidene fluoride |
| title | Polymer multilayer films for high temperature capacitor application |
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