Effect of dynamic adjustment of diamond tools on nano-cutting behavior of single-crystal silicon

A new method for adjusting the tool rake and flank angles by changing the position of the tools was used to dynamic explore the nano-cutting behavior of single-crystal silicon using MD simulation. Simulations under the same cutting conditions were carried out using a tool swinging to six different r...

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Veröffentlicht in:	Applied physics. A, Materials science & processing Materials science & processing, 2019-03, Vol.125 (3), p.1-13, Article 176
Hauptverfasser:	Wang, Ming Hai, You, Si Yao, Wang, Fu Ning, Liu, Qi
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied physics Characterization and Evaluation of Materials Condensed Matter Physics Coordination numbers Cutting force Cutting tools Diamond machining Diamond tools Machines Manufacturing Materials science Nanotechnology Optical and Electronic Materials Physics Physics and Astronomy Potential energy Processes Rake angle Silicon Single crystals Surfaces and Interfaces Thin Films
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