Microstructure and performance evolution of SnPbSb solder joint under γ-ray irradiation and thermal cycling

The requirements of miniaturization and light-weighting in the manufacture of satellite have placed much emphasis on the property of its electronic materials. To comprehend the reliability evolution of solder joint in electronic components exposed to cosmic environment, the effect of γ-ray irradiati...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of materials science. Materials in electronics 2019-03, Vol.30 (5), p.4990-4999
Hauptverfasser:	Wang, Jianhao, Xue, Songbai, Lv, Zhaoping, Wen, Li, Liu, Siyi
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Component reliability Electronic components Electronic materials Evolution Fracture mechanics Intermetallic compounds Irradiation Materials Science Microcracks Microstructure Migration Miniaturization Optical and Electronic Materials Soldered joints Thermal cycling Thickness
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!