Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy
Sn-5.0Zn-0.3 wt% Cu (SZC-503) plain solder and Sn-5.0Zn-0.3Cu-0.5 wt% Al 2 O 3 (SZC-Al 2 O 3 ) composite solder have been investigated. The differential scanning calorimetery (DSC) measurements revealed that both alloys have two thermal peaks. The melting and liquids temperature of the first peak of...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2019-02, Vol.30 (4), p.4326-4335 |
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| creator | Eid, E. A. El-Basaty, A. B. Deghady, A. M. Kaytbay, Saleh Nassar, Abbass |
| description | Sn-5.0Zn-0.3 wt% Cu (SZC-503) plain solder and Sn-5.0Zn-0.3Cu-0.5 wt% Al
2
O
3
(SZC-Al
2
O
3
) composite solder have been investigated. The differential scanning calorimetery (DSC) measurements revealed that both alloys have two thermal peaks. The melting and liquids temperature of the first peak of both solders were less than 1.0 °C. However, the melting and liquids temperatures of second peak for composite solder increased by 3.02 and 3.37 °C, respectively than those of plain solder alloy. Moreover, the undercooling range (UCR) reduced after addition of nano-metric Al
2
O
3
particles due to its high melting temperature and sacrifices them as additional nucleation seeds to initiate the solidification process. The microstructural characteristic was studied using X-ray diffraction (XRD), scanning electronic microscope (SEM), and energy dispersive X-ray spectroscopy (EDS). The refinement of β-Sn grains of SZC-Al
2
O
3
composite alloy can be attributed to the pinning effect of Al
2
O
3
nanoparticles on grain boundaries. In addition, a limited growth of IMC correlated to the adsorption theory of nano-metric Al
2
O
3
particles of surface-active materials. The uniformed distribution of refined β-Sn grain and IMC in SZC-Al
2
O
3
enhanced the yield stress (YS) by ~ 56% and ultimate tensile strength (UTS) by ~ 76.2% but reduced the ductility by ~ 32%. Moreover, the experimental value of the yield stress of composite solder is very close to that calculated by simple simulation program which included the different strengthens mechanism of composite alloys. |
| doi_str_mv | 10.1007/s10854-019-00726-1 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2166886585</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2166886585</sourcerecordid><originalsourceid>FETCH-LOGICAL-c249t-8ae30071314e131805d4a74f6d292ae7f3674cc4ec75ec2717bcbe289fe6d9ef3</originalsourceid><addsrcrecordid>eNp9UV1rVDEQvYiCa_UP-BTw1az5vMl9LIsfhUILtVB8CdnciZuSTdYkt7B_yN9p1hV8KwwzzMw5ZxjOMLynZE0JUZ8qJVoKTOiEe8tGTF8MKyoVx0Kzh5fDikxSYSEZez28qfWREDIKrlfD76vk4wLJAcoeJZsy3kMrwaHLyG44OtjSgotQkZ3n0EJOqEfbQdnbiLaws08hl49oH1zJtZXFtaX0jU0zapBqiIDczhbrGpRQu1Y9HdodDxmWBq4P0F3Cck1-JEzWfLOg2y32BQDVHGcoyMaYj2-HV97GCu_-1Yvh_svn75tv-Prm69Xm8ho7JqaGtQXe_6ecCuhJEzkLq4QfZzYxC8rzUQnnBDglwTFF1dZtgenJwzhP4PnF8OGseyj51wK1mce8lNRPGkbHUetRatlR7Iw6_VwLeHMoYW_L0VBiTn6Ysx-m-2H--mFoJ_EzqXZw-gnlv_QzrD_bppAm</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2166886585</pqid></control><display><type>article</type><title>Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy</title><source>SpringerNature Journals</source><creator>Eid, E. A. ; El-Basaty, A. B. ; Deghady, A. M. ; Kaytbay, Saleh ; Nassar, Abbass</creator><creatorcontrib>Eid, E. A. ; El-Basaty, A. B. ; Deghady, A. M. ; Kaytbay, Saleh ; Nassar, Abbass</creatorcontrib><description>Sn-5.0Zn-0.3 wt% Cu (SZC-503) plain solder and Sn-5.0Zn-0.3Cu-0.5 wt% Al
2
O
3
(SZC-Al
2
O
3
) composite solder have been investigated. The differential scanning calorimetery (DSC) measurements revealed that both alloys have two thermal peaks. The melting and liquids temperature of the first peak of both solders were less than 1.0 °C. However, the melting and liquids temperatures of second peak for composite solder increased by 3.02 and 3.37 °C, respectively than those of plain solder alloy. Moreover, the undercooling range (UCR) reduced after addition of nano-metric Al
2
O
3
particles due to its high melting temperature and sacrifices them as additional nucleation seeds to initiate the solidification process. The microstructural characteristic was studied using X-ray diffraction (XRD), scanning electronic microscope (SEM), and energy dispersive X-ray spectroscopy (EDS). The refinement of β-Sn grains of SZC-Al
2
O
3
composite alloy can be attributed to the pinning effect of Al
2
O
3
nanoparticles on grain boundaries. In addition, a limited growth of IMC correlated to the adsorption theory of nano-metric Al
2
O
3
particles of surface-active materials. The uniformed distribution of refined β-Sn grain and IMC in SZC-Al
2
O
3
enhanced the yield stress (YS) by ~ 56% and ultimate tensile strength (UTS) by ~ 76.2% but reduced the ductility by ~ 32%. Moreover, the experimental value of the yield stress of composite solder is very close to that calculated by simple simulation program which included the different strengthens mechanism of composite alloys.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-019-00726-1</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Alloys ; Aluminum oxide ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Differential thermal analysis ; Energy dispersive X ray spectroscopy ; Grain boundaries ; Lead free ; Liquids ; Materials Science ; Melt temperature ; Melting ; Nanoparticles ; Nucleation ; Optical and Electronic Materials ; Seeds ; Solders ; Solidification ; Supercooling ; Thermodynamic properties ; Tin base alloys ; Ultimate tensile strength ; X-ray diffraction ; Yield strength ; Yield stress</subject><ispartof>Journal of materials science. Materials in electronics, 2019-02, Vol.30 (4), p.4326-4335</ispartof><rights>Springer Science+Business Media, LLC, part of Springer Nature 2019</rights><rights>Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2019). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c249t-8ae30071314e131805d4a74f6d292ae7f3674cc4ec75ec2717bcbe289fe6d9ef3</citedby><cites>FETCH-LOGICAL-c249t-8ae30071314e131805d4a74f6d292ae7f3674cc4ec75ec2717bcbe289fe6d9ef3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-019-00726-1$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-019-00726-1$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>315,781,785,27928,27929,41492,42561,51323</link.rule.ids></links><search><creatorcontrib>Eid, E. A.</creatorcontrib><creatorcontrib>El-Basaty, A. B.</creatorcontrib><creatorcontrib>Deghady, A. M.</creatorcontrib><creatorcontrib>Kaytbay, Saleh</creatorcontrib><creatorcontrib>Nassar, Abbass</creatorcontrib><title>Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>Sn-5.0Zn-0.3 wt% Cu (SZC-503) plain solder and Sn-5.0Zn-0.3Cu-0.5 wt% Al
2
O
3
(SZC-Al
2
O
3
) composite solder have been investigated. The differential scanning calorimetery (DSC) measurements revealed that both alloys have two thermal peaks. The melting and liquids temperature of the first peak of both solders were less than 1.0 °C. However, the melting and liquids temperatures of second peak for composite solder increased by 3.02 and 3.37 °C, respectively than those of plain solder alloy. Moreover, the undercooling range (UCR) reduced after addition of nano-metric Al
2
O
3
particles due to its high melting temperature and sacrifices them as additional nucleation seeds to initiate the solidification process. The microstructural characteristic was studied using X-ray diffraction (XRD), scanning electronic microscope (SEM), and energy dispersive X-ray spectroscopy (EDS). The refinement of β-Sn grains of SZC-Al
2
O
3
composite alloy can be attributed to the pinning effect of Al
2
O
3
nanoparticles on grain boundaries. In addition, a limited growth of IMC correlated to the adsorption theory of nano-metric Al
2
O
3
particles of surface-active materials. The uniformed distribution of refined β-Sn grain and IMC in SZC-Al
2
O
3
enhanced the yield stress (YS) by ~ 56% and ultimate tensile strength (UTS) by ~ 76.2% but reduced the ductility by ~ 32%. Moreover, the experimental value of the yield stress of composite solder is very close to that calculated by simple simulation program which included the different strengthens mechanism of composite alloys.</description><subject>Alloys</subject><subject>Aluminum oxide</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Differential thermal analysis</subject><subject>Energy dispersive X ray spectroscopy</subject><subject>Grain boundaries</subject><subject>Lead free</subject><subject>Liquids</subject><subject>Materials Science</subject><subject>Melt temperature</subject><subject>Melting</subject><subject>Nanoparticles</subject><subject>Nucleation</subject><subject>Optical and Electronic Materials</subject><subject>Seeds</subject><subject>Solders</subject><subject>Solidification</subject><subject>Supercooling</subject><subject>Thermodynamic properties</subject><subject>Tin base alloys</subject><subject>Ultimate tensile strength</subject><subject>X-ray diffraction</subject><subject>Yield strength</subject><subject>Yield stress</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9UV1rVDEQvYiCa_UP-BTw1az5vMl9LIsfhUILtVB8CdnciZuSTdYkt7B_yN9p1hV8KwwzzMw5ZxjOMLynZE0JUZ8qJVoKTOiEe8tGTF8MKyoVx0Kzh5fDikxSYSEZez28qfWREDIKrlfD76vk4wLJAcoeJZsy3kMrwaHLyG44OtjSgotQkZ3n0EJOqEfbQdnbiLaws08hl49oH1zJtZXFtaX0jU0zapBqiIDczhbrGpRQu1Y9HdodDxmWBq4P0F3Cck1-JEzWfLOg2y32BQDVHGcoyMaYj2-HV97GCu_-1Yvh_svn75tv-Prm69Xm8ho7JqaGtQXe_6ecCuhJEzkLq4QfZzYxC8rzUQnnBDglwTFF1dZtgenJwzhP4PnF8OGseyj51wK1mce8lNRPGkbHUetRatlR7Iw6_VwLeHMoYW_L0VBiTn6Ysx-m-2H--mFoJ_EzqXZw-gnlv_QzrD_bppAm</recordid><startdate>20190201</startdate><enddate>20190201</enddate><creator>Eid, E. A.</creator><creator>El-Basaty, A. B.</creator><creator>Deghady, A. M.</creator><creator>Kaytbay, Saleh</creator><creator>Nassar, Abbass</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope></search><sort><creationdate>20190201</creationdate><title>Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy</title><author>Eid, E. A. ; El-Basaty, A. B. ; Deghady, A. M. ; Kaytbay, Saleh ; Nassar, Abbass</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c249t-8ae30071314e131805d4a74f6d292ae7f3674cc4ec75ec2717bcbe289fe6d9ef3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Alloys</topic><topic>Aluminum oxide</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Differential thermal analysis</topic><topic>Energy dispersive X ray spectroscopy</topic><topic>Grain boundaries</topic><topic>Lead free</topic><topic>Liquids</topic><topic>Materials Science</topic><topic>Melt temperature</topic><topic>Melting</topic><topic>Nanoparticles</topic><topic>Nucleation</topic><topic>Optical and Electronic Materials</topic><topic>Seeds</topic><topic>Solders</topic><topic>Solidification</topic><topic>Supercooling</topic><topic>Thermodynamic properties</topic><topic>Tin base alloys</topic><topic>Ultimate tensile strength</topic><topic>X-ray diffraction</topic><topic>Yield strength</topic><topic>Yield stress</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Eid, E. A.</creatorcontrib><creatorcontrib>El-Basaty, A. B.</creatorcontrib><creatorcontrib>Deghady, A. 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Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Eid, E. A.</au><au>El-Basaty, A. B.</au><au>Deghady, A. M.</au><au>Kaytbay, Saleh</au><au>Nassar, Abbass</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2019-02-01</date><risdate>2019</risdate><volume>30</volume><issue>4</issue><spage>4326</spage><epage>4335</epage><pages>4326-4335</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>Sn-5.0Zn-0.3 wt% Cu (SZC-503) plain solder and Sn-5.0Zn-0.3Cu-0.5 wt% Al
2
O
3
(SZC-Al
2
O
3
) composite solder have been investigated. The differential scanning calorimetery (DSC) measurements revealed that both alloys have two thermal peaks. The melting and liquids temperature of the first peak of both solders were less than 1.0 °C. However, the melting and liquids temperatures of second peak for composite solder increased by 3.02 and 3.37 °C, respectively than those of plain solder alloy. Moreover, the undercooling range (UCR) reduced after addition of nano-metric Al
2
O
3
particles due to its high melting temperature and sacrifices them as additional nucleation seeds to initiate the solidification process. The microstructural characteristic was studied using X-ray diffraction (XRD), scanning electronic microscope (SEM), and energy dispersive X-ray spectroscopy (EDS). The refinement of β-Sn grains of SZC-Al
2
O
3
composite alloy can be attributed to the pinning effect of Al
2
O
3
nanoparticles on grain boundaries. In addition, a limited growth of IMC correlated to the adsorption theory of nano-metric Al
2
O
3
particles of surface-active materials. The uniformed distribution of refined β-Sn grain and IMC in SZC-Al
2
O
3
enhanced the yield stress (YS) by ~ 56% and ultimate tensile strength (UTS) by ~ 76.2% but reduced the ductility by ~ 32%. Moreover, the experimental value of the yield stress of composite solder is very close to that calculated by simple simulation program which included the different strengthens mechanism of composite alloys.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-019-00726-1</doi><tpages>10</tpages></addata></record> |
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| identifier | ISSN: 0957-4522 |
| ispartof | Journal of materials science. Materials in electronics, 2019-02, Vol.30 (4), p.4326-4335 |
| issn | 0957-4522 1573-482X |
| language | eng |
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| source | SpringerNature Journals |
| subjects | Alloys Aluminum oxide Characterization and Evaluation of Materials Chemistry and Materials Science Copper Differential thermal analysis Energy dispersive X ray spectroscopy Grain boundaries Lead free Liquids Materials Science Melt temperature Melting Nanoparticles Nucleation Optical and Electronic Materials Seeds Solders Solidification Supercooling Thermodynamic properties Tin base alloys Ultimate tensile strength X-ray diffraction Yield strength Yield stress |
| title | Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy |
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