High strain rate testing of solder interconnections

Purpose - This paper aims to present a new micro-impact tester developed for characterizing the impact properties of solder joints and micro-structures at high-strain rates, for the microelectronic industry, and the results evaluated for different solder ball materials, pad finishes and thermal hist...

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Veröffentlicht in:	Soldering & surface mount technology 2006-04, Vol.18 (2), p.12-17
Hauptverfasser:	Tsai, K.T, Liu, F-L, Wong, E.H, Rajoo, R
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Applied sciences Design Design. Technologies. Operation analysis. Testing Electrical engineering Electronic engineering Electronics Energy Exact sciences and technology Failure analysis Impact tests Integrated circuits Joining Joining processes Load Materials Quality control Reliability engineering Reliability management Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Shear tests Soldering Solders Strain rate Studies Testing, measurement, noise and reliability
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