44.2: Invited Paper: Printed Polymer TFTs Towards Low‐Cost Backplane Production
We present Merck's new formulation and material developments enabling high‐volume and high‐throughput printing techniques to be used for cost‐effective electronic circuitry and backplane production. Performance at TFT array level in excess of 2 cm2/Vs, comparable to spin coating is demonstrated...
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Veröffentlicht in: | SID International Symposium Digest of technical papers 2018-04, Vol.49 (S1), p.476-478 |
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creator | Morley, Aurélie Lloyd, Giles Charbonneau, Micaël Locatelli, Denis Lombard, Stéphanie Laugier, Christelle Tournon, Laurent Bain, Stephen James, Mark Wang, Howard |
description | We present Merck's new formulation and material developments enabling high‐volume and high‐throughput printing techniques to be used for cost‐effective electronic circuitry and backplane production. Performance at TFT array level in excess of 2 cm2/Vs, comparable to spin coating is demonstrated at Gen1 scale and 50 ppi resolution, using a hybrid combination of conventional lithographic steps and direct gravure printing. |
doi_str_mv | 10.1002/sdtp.12759 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2138698499</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2138698499</sourcerecordid><originalsourceid>FETCH-LOGICAL-c1059-acf4c728e8f58c7ae33114ef8bd478fe5063d3e27d36990158a9218d4882a4473</originalsourceid><addsrcrecordid>eNp9kM1KAzEURoMoWKsbnyDgTpiav5kk3Wm1WihYcQR3ISYZmDqdjMnU0p2P4DP6JE47rl1dLpzvu9wDwDlGI4wQuYq2bUaY8FQegAHBmUgQTuUhGCAkeSKz7PUYnMS4RIhSxuQAPDE2ImM4qz_L1lm40I0LY7gIZb1ffbVduQDzaR5h7jc62AjnfvPz9T3xsYU32rw3la5dl_B2bdrS16fgqNBVdGd_cwhepnf55CGZP97PJtfzxGCUykSbghlOhBNFKgzXjlKMmSvEm2VcFC5FGbXUEW5pJmX3hdCSYGGZEEQzxukQXPS9TfAfaxdbtfTrUHcnFcFUZFIwKTvqsqdM8DEGV6gmlCsdtgojtVOmdsrUXlkH4x7elJXb_kOq59t80Wd-AdOYbZo</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2138698499</pqid></control><display><type>article</type><title>44.2: Invited Paper: Printed Polymer TFTs Towards Low‐Cost Backplane Production</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Morley, Aurélie ; Lloyd, Giles ; Charbonneau, Micaël ; Locatelli, Denis ; Lombard, Stéphanie ; Laugier, Christelle ; Tournon, Laurent ; Bain, Stephen ; James, Mark ; Wang, Howard</creator><creatorcontrib>Morley, Aurélie ; Lloyd, Giles ; Charbonneau, Micaël ; Locatelli, Denis ; Lombard, Stéphanie ; Laugier, Christelle ; Tournon, Laurent ; Bain, Stephen ; James, Mark ; Wang, Howard</creatorcontrib><description>We present Merck's new formulation and material developments enabling high‐volume and high‐throughput printing techniques to be used for cost‐effective electronic circuitry and backplane production. Performance at TFT array level in excess of 2 cm2/Vs, comparable to spin coating is demonstrated at Gen1 scale and 50 ppi resolution, using a hybrid combination of conventional lithographic steps and direct gravure printing.</description><identifier>ISSN: 0097-966X</identifier><identifier>EISSN: 2168-0159</identifier><identifier>DOI: 10.1002/sdtp.12759</identifier><language>eng</language><publisher>Campbell: Wiley Subscription Services, Inc</publisher><subject>active-matrix backplane ; Backplanes ; Circuits ; Gravure ; Organic semiconductors ; printed thin-film transistors ; Spin coating</subject><ispartof>SID International Symposium Digest of technical papers, 2018-04, Vol.49 (S1), p.476-478</ispartof><rights>2018 The Society for Information Display</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c1059-acf4c728e8f58c7ae33114ef8bd478fe5063d3e27d36990158a9218d4882a4473</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fsdtp.12759$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fsdtp.12759$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27903,27904,45553,45554</link.rule.ids></links><search><creatorcontrib>Morley, Aurélie</creatorcontrib><creatorcontrib>Lloyd, Giles</creatorcontrib><creatorcontrib>Charbonneau, Micaël</creatorcontrib><creatorcontrib>Locatelli, Denis</creatorcontrib><creatorcontrib>Lombard, Stéphanie</creatorcontrib><creatorcontrib>Laugier, Christelle</creatorcontrib><creatorcontrib>Tournon, Laurent</creatorcontrib><creatorcontrib>Bain, Stephen</creatorcontrib><creatorcontrib>James, Mark</creatorcontrib><creatorcontrib>Wang, Howard</creatorcontrib><title>44.2: Invited Paper: Printed Polymer TFTs Towards Low‐Cost Backplane Production</title><title>SID International Symposium Digest of technical papers</title><description>We present Merck's new formulation and material developments enabling high‐volume and high‐throughput printing techniques to be used for cost‐effective electronic circuitry and backplane production. Performance at TFT array level in excess of 2 cm2/Vs, comparable to spin coating is demonstrated at Gen1 scale and 50 ppi resolution, using a hybrid combination of conventional lithographic steps and direct gravure printing.</description><subject>active-matrix backplane</subject><subject>Backplanes</subject><subject>Circuits</subject><subject>Gravure</subject><subject>Organic semiconductors</subject><subject>printed thin-film transistors</subject><subject>Spin coating</subject><issn>0097-966X</issn><issn>2168-0159</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp9kM1KAzEURoMoWKsbnyDgTpiav5kk3Wm1WihYcQR3ISYZmDqdjMnU0p2P4DP6JE47rl1dLpzvu9wDwDlGI4wQuYq2bUaY8FQegAHBmUgQTuUhGCAkeSKz7PUYnMS4RIhSxuQAPDE2ImM4qz_L1lm40I0LY7gIZb1ffbVduQDzaR5h7jc62AjnfvPz9T3xsYU32rw3la5dl_B2bdrS16fgqNBVdGd_cwhepnf55CGZP97PJtfzxGCUykSbghlOhBNFKgzXjlKMmSvEm2VcFC5FGbXUEW5pJmX3hdCSYGGZEEQzxukQXPS9TfAfaxdbtfTrUHcnFcFUZFIwKTvqsqdM8DEGV6gmlCsdtgojtVOmdsrUXlkH4x7elJXb_kOq59t80Wd-AdOYbZo</recordid><startdate>201804</startdate><enddate>201804</enddate><creator>Morley, Aurélie</creator><creator>Lloyd, Giles</creator><creator>Charbonneau, Micaël</creator><creator>Locatelli, Denis</creator><creator>Lombard, Stéphanie</creator><creator>Laugier, Christelle</creator><creator>Tournon, Laurent</creator><creator>Bain, Stephen</creator><creator>James, Mark</creator><creator>Wang, Howard</creator><general>Wiley Subscription Services, Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SP</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>201804</creationdate><title>44.2: Invited Paper: Printed Polymer TFTs Towards Low‐Cost Backplane Production</title><author>Morley, Aurélie ; Lloyd, Giles ; Charbonneau, Micaël ; Locatelli, Denis ; Lombard, Stéphanie ; Laugier, Christelle ; Tournon, Laurent ; Bain, Stephen ; James, Mark ; Wang, Howard</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1059-acf4c728e8f58c7ae33114ef8bd478fe5063d3e27d36990158a9218d4882a4473</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>active-matrix backplane</topic><topic>Backplanes</topic><topic>Circuits</topic><topic>Gravure</topic><topic>Organic semiconductors</topic><topic>printed thin-film transistors</topic><topic>Spin coating</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Morley, Aurélie</creatorcontrib><creatorcontrib>Lloyd, Giles</creatorcontrib><creatorcontrib>Charbonneau, Micaël</creatorcontrib><creatorcontrib>Locatelli, Denis</creatorcontrib><creatorcontrib>Lombard, Stéphanie</creatorcontrib><creatorcontrib>Laugier, Christelle</creatorcontrib><creatorcontrib>Tournon, Laurent</creatorcontrib><creatorcontrib>Bain, Stephen</creatorcontrib><creatorcontrib>James, Mark</creatorcontrib><creatorcontrib>Wang, Howard</creatorcontrib><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>SID International Symposium Digest of technical papers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Morley, Aurélie</au><au>Lloyd, Giles</au><au>Charbonneau, Micaël</au><au>Locatelli, Denis</au><au>Lombard, Stéphanie</au><au>Laugier, Christelle</au><au>Tournon, Laurent</au><au>Bain, Stephen</au><au>James, Mark</au><au>Wang, Howard</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>44.2: Invited Paper: Printed Polymer TFTs Towards Low‐Cost Backplane Production</atitle><jtitle>SID International Symposium Digest of technical papers</jtitle><date>2018-04</date><risdate>2018</risdate><volume>49</volume><issue>S1</issue><spage>476</spage><epage>478</epage><pages>476-478</pages><issn>0097-966X</issn><eissn>2168-0159</eissn><abstract>We present Merck's new formulation and material developments enabling high‐volume and high‐throughput printing techniques to be used for cost‐effective electronic circuitry and backplane production. Performance at TFT array level in excess of 2 cm2/Vs, comparable to spin coating is demonstrated at Gen1 scale and 50 ppi resolution, using a hybrid combination of conventional lithographic steps and direct gravure printing.</abstract><cop>Campbell</cop><pub>Wiley Subscription Services, Inc</pub><doi>10.1002/sdtp.12759</doi><tpages>3</tpages></addata></record> |
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subjects | active-matrix backplane Backplanes Circuits Gravure Organic semiconductors printed thin-film transistors Spin coating |
title | 44.2: Invited Paper: Printed Polymer TFTs Towards Low‐Cost Backplane Production |
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