Curing behavior of soy flour with phenol-formaldehyde and isocyanate resins
Cost savings are realized when phenol formaldehyde (PF) and polymeric methylene diphenyl diisocyanate (pMDI) resins are partially substituted with soy flour during the manufacture of engineered woods such as oriented strand board. The interaction of soy flour with the two resins was studied through...
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| Veröffentlicht in: | International journal of adhesion and adhesives 2018-12, Vol.87, p.105-108 |
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| container_title | International journal of adhesion and adhesives |
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| creator | Hand, William G. Robert Ashurst, W. Via, Brian Banerjee, Sujit |
| description | Cost savings are realized when phenol formaldehyde (PF) and polymeric methylene diphenyl diisocyanate (pMDI) resins are partially substituted with soy flour during the manufacture of engineered woods such as oriented strand board. The interaction of soy flour with the two resins was studied through thermogravimetric analysis, Fourier transform infrared spectroscopy, and mass spectroscopy. No significant differences in the results from all three analyses were observed between neat PF and PF resin partially (up to 30%) substituted with soy flour, suggesting that chemical bonding between soy flour and PF resin was minimal. In contrast, soy flour induced major changes in the thermogravimetric and spectroscopic properties when substituted in pMDI resin because of chemical cross-linking between the two species. |
| doi_str_mv | 10.1016/j.ijadhadh.2018.10.002 |
| format | Article |
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The interaction of soy flour with the two resins was studied through thermogravimetric analysis, Fourier transform infrared spectroscopy, and mass spectroscopy. No significant differences in the results from all three analyses were observed between neat PF and PF resin partially (up to 30%) substituted with soy flour, suggesting that chemical bonding between soy flour and PF resin was minimal. 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In contrast, soy flour induced major changes in the thermogravimetric and spectroscopic properties when substituted in pMDI resin because of chemical cross-linking between the two species.</description><subject>Adhesion</subject><subject>Chemical bonds</subject><subject>Crosslinking</subject><subject>Diphenyl methane diisocyanate</subject><subject>Flour</subject><subject>Fourier transforms</subject><subject>Infrared analysis</subject><subject>Isocyanates</subject><subject>Organic chemistry</subject><subject>Oriented strand board</subject><subject>Phenol formaldehyde</subject><subject>Phenols</subject><subject>pMDI</subject><subject>Polymers</subject><subject>Polyurethane resins</subject><subject>Resins</subject><subject>Substitutes</subject><subject>Thermogravimetric</subject><subject>Thermogravimetric analysis</subject><issn>0143-7496</issn><issn>1879-0127</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNqFUE1LxDAUDKLguvoXJOC59aVp0-SmLH7hghc9hzRJbUq3WZOu0n9v1tWz8ODBMDNv3iB0SSAnQNh1n7temS5NXgDhCcwBiiO0ILwWGZCiPkYLICXN6lKwU3QWYw9AaijpAj2vdsGN77ixnfp0PmDf4uhn3A5-F_CXmzq87ezoh6z1YaMGY7vZWKxGg130elajmiwONroxnqOTVg3RXvzuJXq7v3tdPWbrl4en1e0607SEKasEp6wVKZygnPOGaCrqUmkDvBIG6ppUvARmDbMFcFZVqmJKCwENkIYBpUt0dfDdBv-xs3GSfQo7ppOyIJSJ9NwPix1YOvgYg23lNriNCrMkIPfFyV7-FSf3xe3xVFwS3hyENv3w6WyQUTs7amtcsHqSxrv_LL4BhFh4kQ</recordid><startdate>201812</startdate><enddate>201812</enddate><creator>Hand, William G.</creator><creator>Robert Ashurst, W.</creator><creator>Via, Brian</creator><creator>Banerjee, Sujit</creator><general>Elsevier Ltd</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7TB</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>JG9</scope><scope>KR7</scope></search><sort><creationdate>201812</creationdate><title>Curing behavior of soy flour with phenol-formaldehyde and isocyanate resins</title><author>Hand, William G. ; Robert Ashurst, W. ; Via, Brian ; Banerjee, Sujit</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c340t-59836f987993888b1c3974acd0859d077158406ed6e208655a56ac990b01b6033</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Adhesion</topic><topic>Chemical bonds</topic><topic>Crosslinking</topic><topic>Diphenyl methane diisocyanate</topic><topic>Flour</topic><topic>Fourier transforms</topic><topic>Infrared analysis</topic><topic>Isocyanates</topic><topic>Organic chemistry</topic><topic>Oriented strand board</topic><topic>Phenol formaldehyde</topic><topic>Phenols</topic><topic>pMDI</topic><topic>Polymers</topic><topic>Polyurethane resins</topic><topic>Resins</topic><topic>Substitutes</topic><topic>Thermogravimetric</topic><topic>Thermogravimetric analysis</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hand, William G.</creatorcontrib><creatorcontrib>Robert Ashurst, W.</creatorcontrib><creatorcontrib>Via, Brian</creatorcontrib><creatorcontrib>Banerjee, Sujit</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><collection>Civil Engineering Abstracts</collection><jtitle>International journal of adhesion and adhesives</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hand, William G.</au><au>Robert Ashurst, W.</au><au>Via, Brian</au><au>Banerjee, Sujit</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Curing behavior of soy flour with phenol-formaldehyde and isocyanate resins</atitle><jtitle>International journal of adhesion and adhesives</jtitle><date>2018-12</date><risdate>2018</risdate><volume>87</volume><spage>105</spage><epage>108</epage><pages>105-108</pages><issn>0143-7496</issn><eissn>1879-0127</eissn><abstract>Cost savings are realized when phenol formaldehyde (PF) and polymeric methylene diphenyl diisocyanate (pMDI) resins are partially substituted with soy flour during the manufacture of engineered woods such as oriented strand board. 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| identifier | ISSN: 0143-7496 |
| ispartof | International journal of adhesion and adhesives, 2018-12, Vol.87, p.105-108 |
| issn | 0143-7496 1879-0127 |
| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Adhesion Chemical bonds Crosslinking Diphenyl methane diisocyanate Flour Fourier transforms Infrared analysis Isocyanates Organic chemistry Oriented strand board Phenol formaldehyde Phenols pMDI Polymers Polyurethane resins Resins Substitutes Thermogravimetric Thermogravimetric analysis |
| title | Curing behavior of soy flour with phenol-formaldehyde and isocyanate resins |
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