Heterophase materials for fused filament fabrication of structural electronics

In this work, new electrically conductive composite filaments are developed for the fabrication of conductive paths, 3D printed with FDM technology. These composite materials consist of electrically conductive copper powder and a polymer matrix. The influence of three different polymers (ABS, PLA, P...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2019-01, Vol.30 (2), p.1236-1245
Hauptverfasser:	Podsiadły, B., Skalski, A., Wałpuski, B., Słoma, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Composite materials Copper Current voltage characteristics Electrical measurement Electrical properties Electrical resistivity Filaments Fused deposition modeling High voltages Low voltage Materials Science Nanocomposites Optical and Electronic Materials Percolation Polymer matrix composites Polystyrene resins Three dimensional printing
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