A 0.4-to-4-GHz All-Digital RF Transmitter Package With a Band-Selecting Interposer Combining Three Wideband CMOS Transmitters
A single-output, band selecting interposer is designed to combine three identical all-digital CMOS transmitter (Tx) chips. The open-drain CMOS Txs are flip-chip connected to the primary windings of three frequency selecting transformers realized on a single PCB interposer. The secondary windings of...
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Veröffentlicht in: | IEEE transactions on microwave theory and techniques 2018-11, Vol.66 (11), p.4967-4984 |
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creator | Kuo, Nai-Chung Yang, Bonjern Wang, Angie Kong, Lingkai Wu, Charles Srini, Vason P. Alon, Elad Nikolic, Borivoje Niknejad, Ali M. |
description | A single-output, band selecting interposer is designed to combine three identical all-digital CMOS transmitter (Tx) chips. The open-drain CMOS Txs are flip-chip connected to the primary windings of three frequency selecting transformers realized on a single PCB interposer. The secondary windings of the three transformers are connected in series and they share a single output. Across 0.4 to 4 GHz, a peak power higher than 22.9 dBm is achieved collectively by the three sub-Txs with a drain efficiency (DE) better than 25%. The peak powers/DE of the three sub-Txs are 28.6 dBm/50%, 27.4 dBm/49%, and 24.7 dBm/34%, at 0.85, 2.1, and 3 GHz, respectively. This paper further demonstrates that the band selection can be achieved via reconfiguring the CMOS inverse Class-D switching power amplifiers. As demonstrated via continuous wave and 64-quadratic-amplitude modulation, WLAN, and LTE modulation tests, the reconfigurable Tx package exhibits high power and efficiency across all supported bands. |
doi_str_mv | 10.1109/TMTT.2018.2860007 |
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The open-drain CMOS Txs are flip-chip connected to the primary windings of three frequency selecting transformers realized on a single PCB interposer. The secondary windings of the three transformers are connected in series and they share a single output. Across 0.4 to 4 GHz, a peak power higher than 22.9 dBm is achieved collectively by the three sub-Txs with a drain efficiency (DE) better than 25%. The peak powers/DE of the three sub-Txs are 28.6 dBm/50%, 27.4 dBm/49%, and 24.7 dBm/34%, at 0.85, 2.1, and 3 GHz, respectively. This paper further demonstrates that the band selection can be achieved via reconfiguring the CMOS inverse Class-D switching power amplifiers. As demonstrated via continuous wave and 64-quadratic-amplitude modulation, WLAN, and LTE modulation tests, the reconfigurable Tx package exhibits high power and efficiency across all supported bands.</description><identifier>ISSN: 0018-9480</identifier><identifier>EISSN: 1557-9670</identifier><identifier>DOI: 10.1109/TMTT.2018.2860007</identifier><identifier>CODEN: IETMAB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Amplitude modulation ; Broadband ; Capacitors ; Carrier aggregation ; CMOS ; CMOS power amplifier (PA) ; Coils (windings) ; Continuous radiation ; Impedance ; index terms ; interposer ; Local area networks ; multiband ; polar transmitter ; Power amplifiers ; Power efficiency ; RF-DAC ; Switches ; transformer ; Transformers ; Transmitters ; Wideband ; Windings ; Wireless networks</subject><ispartof>IEEE transactions on microwave theory and techniques, 2018-11, Vol.66 (11), p.4967-4984</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2018</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c245t-ebbbdb7c6847caeeeccc9d19ab840b56677cf1798abba4cddee6a3e68ee14a883</cites><orcidid>0000-0002-9246-9791 ; 0000-0002-3723-1959 ; 0000-0003-0627-0020 ; 0000-0003-2324-1715</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8434250$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/8434250$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kuo, Nai-Chung</creatorcontrib><creatorcontrib>Yang, Bonjern</creatorcontrib><creatorcontrib>Wang, Angie</creatorcontrib><creatorcontrib>Kong, Lingkai</creatorcontrib><creatorcontrib>Wu, Charles</creatorcontrib><creatorcontrib>Srini, Vason P.</creatorcontrib><creatorcontrib>Alon, Elad</creatorcontrib><creatorcontrib>Nikolic, Borivoje</creatorcontrib><creatorcontrib>Niknejad, Ali M.</creatorcontrib><title>A 0.4-to-4-GHz All-Digital RF Transmitter Package With a Band-Selecting Interposer Combining Three Wideband CMOS Transmitters</title><title>IEEE transactions on microwave theory and techniques</title><addtitle>TMTT</addtitle><description>A single-output, band selecting interposer is designed to combine three identical all-digital CMOS transmitter (Tx) chips. The open-drain CMOS Txs are flip-chip connected to the primary windings of three frequency selecting transformers realized on a single PCB interposer. The secondary windings of the three transformers are connected in series and they share a single output. Across 0.4 to 4 GHz, a peak power higher than 22.9 dBm is achieved collectively by the three sub-Txs with a drain efficiency (DE) better than 25%. The peak powers/DE of the three sub-Txs are 28.6 dBm/50%, 27.4 dBm/49%, and 24.7 dBm/34%, at 0.85, 2.1, and 3 GHz, respectively. This paper further demonstrates that the band selection can be achieved via reconfiguring the CMOS inverse Class-D switching power amplifiers. As demonstrated via continuous wave and 64-quadratic-amplitude modulation, WLAN, and LTE modulation tests, the reconfigurable Tx package exhibits high power and efficiency across all supported bands.</description><subject>Amplitude modulation</subject><subject>Broadband</subject><subject>Capacitors</subject><subject>Carrier aggregation</subject><subject>CMOS</subject><subject>CMOS power amplifier (PA)</subject><subject>Coils (windings)</subject><subject>Continuous radiation</subject><subject>Impedance</subject><subject>index terms</subject><subject>interposer</subject><subject>Local area networks</subject><subject>multiband</subject><subject>polar transmitter</subject><subject>Power amplifiers</subject><subject>Power efficiency</subject><subject>RF-DAC</subject><subject>Switches</subject><subject>transformer</subject><subject>Transformers</subject><subject>Transmitters</subject><subject>Wideband</subject><subject>Windings</subject><subject>Wireless networks</subject><issn>0018-9480</issn><issn>1557-9670</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpNkM1OwzAQhC0EEqXwAIiLJc4OduI4zrEU-iO1KqJBHCPb2bYpaVLs9AAS746jVojTane_mV0NQreMBozR9CGbZ1kQUiaDUApKaXKGeiyOE5KKhJ6jHvUrknJJL9GVc1vf8pjKHvoZYBpw0jaEk_HkGw-qijyV67JVFX4d4cyq2u3KtgWLX5T5UGvA72W7wQo_qrogS6jAtGW9xtPaM_vGeXDY7HRZd8NsY6ETFKA9jYfzxfK_pbtGFytVObg51T56Gz1nwwmZLcbT4WBGTMjjloDWutCJEZInRgGAMSYtWKq05FTHQiSJWbEklUprxU1RAAgVgZAAjCspoz66P_rubfN5ANfm2-Zga38yD1lEBWOxCD3FjpSxjXMWVvneljtlv3JG8y7lvEs571LOTyl7zd1RU_q3_njJIx7GNPoFZJl5aA</recordid><startdate>20181101</startdate><enddate>20181101</enddate><creator>Kuo, Nai-Chung</creator><creator>Yang, Bonjern</creator><creator>Wang, Angie</creator><creator>Kong, Lingkai</creator><creator>Wu, Charles</creator><creator>Srini, Vason P.</creator><creator>Alon, Elad</creator><creator>Nikolic, Borivoje</creator><creator>Niknejad, Ali M.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The open-drain CMOS Txs are flip-chip connected to the primary windings of three frequency selecting transformers realized on a single PCB interposer. The secondary windings of the three transformers are connected in series and they share a single output. Across 0.4 to 4 GHz, a peak power higher than 22.9 dBm is achieved collectively by the three sub-Txs with a drain efficiency (DE) better than 25%. The peak powers/DE of the three sub-Txs are 28.6 dBm/50%, 27.4 dBm/49%, and 24.7 dBm/34%, at 0.85, 2.1, and 3 GHz, respectively. This paper further demonstrates that the band selection can be achieved via reconfiguring the CMOS inverse Class-D switching power amplifiers. As demonstrated via continuous wave and 64-quadratic-amplitude modulation, WLAN, and LTE modulation tests, the reconfigurable Tx package exhibits high power and efficiency across all supported bands.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TMTT.2018.2860007</doi><tpages>18</tpages><orcidid>https://orcid.org/0000-0002-9246-9791</orcidid><orcidid>https://orcid.org/0000-0002-3723-1959</orcidid><orcidid>https://orcid.org/0000-0003-0627-0020</orcidid><orcidid>https://orcid.org/0000-0003-2324-1715</orcidid></addata></record> |
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subjects | Amplitude modulation Broadband Capacitors Carrier aggregation CMOS CMOS power amplifier (PA) Coils (windings) Continuous radiation Impedance index terms interposer Local area networks multiband polar transmitter Power amplifiers Power efficiency RF-DAC Switches transformer Transformers Transmitters Wideband Windings Wireless networks |
title | A 0.4-to-4-GHz All-Digital RF Transmitter Package With a Band-Selecting Interposer Combining Three Wideband CMOS Transmitters |
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