Effect of argon gas flow rate on properties of film electrodes prepared by thermal vacuum evaporation from synthesized Cu2SnSe3 source

This work describes a new technique to enhance photoresponse of metal chalcogenide-based semiconductor film electrodes deposited by thermal vacuum evaporation under argon gas flow from synthesized Cu2SnSe3 sources. SnSe formation with Cu-doped was obtained under higher argon gas flow rate (VA = 25 c...

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Hauptverfasser: Nordin, Sabli, Talib Zainal Abidin, Yunus Wan Mahmood Mat, Zainal Zulkarnain, Hilal, Hikmat S, Fujii Masatoshi
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creator Nordin, Sabli
Talib Zainal Abidin
Yunus Wan Mahmood Mat
Zainal Zulkarnain
Hilal, Hikmat S
Fujii Masatoshi
description This work describes a new technique to enhance photoresponse of metal chalcogenide-based semiconductor film electrodes deposited by thermal vacuum evaporation under argon gas flow from synthesized Cu2SnSe3 sources. SnSe formation with Cu-doped was obtained under higher argon gas flow rate (VA = 25 cm3/min). Higher value of photoresponse was observed for films deposited under VA = 25 cm3/min which was 9.1%. This finding indicates that Cu atoms inside the SnSe film were important to increase carrier concentrations that promote higher photoresponse.
doi_str_mv 10.1063/1.4866957
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source American Institute of Physics (AIP) Journals
subjects Argon
Carrier density
Electrodes
Evaporation rate
Flow velocity
Gas flow
Synthesis
Vacuum evaporation
title Effect of argon gas flow rate on properties of film electrodes prepared by thermal vacuum evaporation from synthesized Cu2SnSe3 source
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